1-20 of 46
Microscale devices
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
DOI: https://doi.org/10.1115/IPACK2020-2542
View Paper
PDF
Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Paper No: IPACK2019-6507
DOI: https://doi.org/10.1115/IPACK2019-6507
View Paper
PDF
Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

Yuvraj Singh, Anirudh Udupa, Srinivasan Chandrasekar, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 7–9, 2019
Paper No: IPACK2019-6510
DOI: https://doi.org/10.1115/IPACK2019-6510
View Paper
PDF
Topics: Alloys, Lead-free solders, Metal cutting, Cutting, Testing, Cutting tools, Deformation, Dynamometers, Hammers, Microscale devices
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Paper No: IPACK2019-6372
DOI: https://doi.org/10.1115/IPACK2019-6372
View Paper
PDF
Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Paper No: IPACK2019-6389
DOI: https://doi.org/10.1115/IPACK2019-6389
View Paper
PDF
Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Paper No: IPACK2018-8383
DOI: https://doi.org/10.1115/IPACK2018-8383
View Paper
PDF
Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Paper No: IPACK2018-8322
DOI: https://doi.org/10.1115/IPACK2018-8322
View Paper
PDF
Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017
Paper No: IPACK2017-74173
DOI: https://doi.org/10.1115/IPACK2017-74173
View Paper
PDF
Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Paper No: IPACK2017-74119
DOI: https://doi.org/10.1115/IPACK2017-74119
View Paper
PDF
Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
DOI: https://doi.org/10.1115/IPACK2017-74020
View Paper
PDF
Topics: Cooling systems, Electronics, Experimental analysis, Secondary cells, Boiling, Computer cooling, Condensers (steam plant), Cooling, Cylinders, Electronic components
Proceedings Papers

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Paper No: IPACK2017-74090
DOI: https://doi.org/10.1115/IPACK2017-74090
View Paper
PDF
Topics: Boiling, Copper, Heat transfer, Bubbles, Critical heat flux, Cooling, Heat transfer coefficients, Microscale devices, Nucleation (Physics), Optical images
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Paper No: IPACK2017-74107
DOI: https://doi.org/10.1115/IPACK2017-74107
View Paper
PDF
Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Paper No: IPACK2015-48178
DOI: https://doi.org/10.1115/IPACK2015-48178
View Paper
PDF
Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Paper No: IPACK2015-48489
DOI: https://doi.org/10.1115/IPACK2015-48489
View Paper
PDF
Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
View Paper
PDF
Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning

Promod R. Chowdhury, Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A013, July 6–9, 2015
Paper No: IPACK2015-48622
DOI: https://doi.org/10.1115/IPACK2015-48622
View Paper
PDF
Topics: Creep, Elastic moduli, Experimental characterization, Flip-chip assemblies, Hardening (Curing), Machinery, Materials properties, Mechanical properties, Microscale devices, Production equipment
Proceedings Papers

Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer

Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Paper No: IPACK2015-48628
DOI: https://doi.org/10.1115/IPACK2015-48628
View Paper
PDF
Topics: Boiling, Drops, Evaporation, Particulate matter, Nanoparticles, Adhesion, Temperature, Bubbles, Critical heat flux, Heat transfer
Proceedings Papers

Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels

Sajjad Bigham, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A017, July 6–9, 2015
Paper No: IPACK2015-48581
DOI: https://doi.org/10.1115/IPACK2015-48581
View Paper
PDF
Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Physics, Bubbles, Evaporation, Heat flux, Resolution (Optics), Thermal conductivity
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
View Paper
PDF
Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Paper No: IPACK2015-48123
DOI: https://doi.org/10.1115/IPACK2015-48123
View Paper
PDF
Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation