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Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
DOI: https://doi.org/10.1115/IPACK2018-8337
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
DOI: https://doi.org/10.1115/IPACK2018-8257
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

Manasa Sahini, Dereje Agonafer, Vijayalan Pandiyan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, August 29–September 1, 2017
Paper No: IPACK2017-74016
DOI: https://doi.org/10.1115/IPACK2017-74016
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Topics: Computational fluid dynamics, Containment, Cooling, Cooling systems, Data centers, Design, Exhaust systems, Fans, Flow (Dynamics), Hardware
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
DOI: https://doi.org/10.1115/IPACK2017-74279
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Paper No: IPACK2017-74286
DOI: https://doi.org/10.1115/IPACK2017-74286
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Paper No: IPACK2015-48123
DOI: https://doi.org/10.1115/IPACK2015-48123
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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Paper No: IPACK2015-48447
DOI: https://doi.org/10.1115/IPACK2015-48447
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Mechanism and Model of Bond Formation in Ultrasonic Wire Bonding

T. Calvin Tszeng
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A026, July 6–9, 2015
Paper No: IPACK2015-48613
DOI: https://doi.org/10.1115/IPACK2015-48613
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Topics: Wire bonding, Micromechanics (Engineering), Bonding, Boundary-value problems, Critical phenomena (Physics), Cycles, Engineering simulation, Finite element methods, Finite element model, Flip-chip
Proceedings Papers

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Saeed Ghalambor, John Edward Fernandes, Dereje Agonafer, Veerendra Mulay
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A026, July 16–18, 2013
Paper No: IPACK2013-73108
DOI: https://doi.org/10.1115/IPACK2013-73108
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Topics: Forced convection, Heat sinks, Manufacturing, Pressure, Design, Screws, Computer simulation, Cooling, Microelectronic devices, Numerical analysis
Proceedings Papers

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

Leila Choobineh, Dereje Agonafer, Ankur Jain
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013
Paper No: IPACK2013-73166
DOI: https://doi.org/10.1115/IPACK2013-73166
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Topics: Modeling, Temperature distribution, Thermal management, Temperature, Finite element analysis, Heat transfer, Design, Energy conservation, Fourier series, Heat
Proceedings Papers

Cooling Performance Comparisons of Five Different Plate-Pin Compound Heat Sinks Based on Two Different Length Scale

Feng Zhou, David Geb, Ivan Catton
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 47-57, July 6–8, 2011
Paper No: IPACK2011-52020
DOI: https://doi.org/10.1115/IPACK2011-52020
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Topics: Cooling, Heat sinks, Heat transfer, Pressure drop, Reynolds number, Computational fluid dynamics, Computer simulation, Design, Flow (Dynamics), Heat
Proceedings Papers

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 357-365, July 6–8, 2011
Paper No: IPACK2011-52262
DOI: https://doi.org/10.1115/IPACK2011-52262
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Topics: Air jets, Cooling, Jets, Microelectronic devices
Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Paper No: IPACK2011-52219
DOI: https://doi.org/10.1115/IPACK2011-52219
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Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)
Proceedings Papers

A Note on the Reliability of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 83-89, July 6–8, 2011
Paper No: IPACK2011-52286
DOI: https://doi.org/10.1115/IPACK2011-52286
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Topics: Reliability, Wire, Copper, Deformation, Displacement, Failure, Microelectronic devices, Structural mechanics
Proceedings Papers

Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 213-224, July 6–8, 2011
Paper No: IPACK2011-52133
DOI: https://doi.org/10.1115/IPACK2011-52133
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Topics: Principal component analysis, Transients (Dynamics), Heating, Integrated circuits, Joules, Microelectronic devices, Circuits, Failure, Fatigue failure, Finite element analysis
Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009
Paper No: InterPACK2009-89014
DOI: https://doi.org/10.1115/InterPACK2009-89014
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Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation
Proceedings Papers

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 27-32, July 19–23, 2009
Paper No: InterPACK2009-89247
DOI: https://doi.org/10.1115/InterPACK2009-89247
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Topics: Flexible electronics, High cycle fatigue, Metals, Thin films, Unsaturated polyesters, Fracture (Materials), Bulk solids, Electrical resistance, Electronic systems, Failure
Proceedings Papers

Thermal-Structural Performance of Orthotropic Pin Fin Applications

Abul Fazal M. Arif, Syed M. Zubair
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 125-134, July 19–23, 2009
Paper No: InterPACK2009-89125
DOI: https://doi.org/10.1115/InterPACK2009-89125
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Topics: Composite materials, Cooling, Corrosion, Density, Design, Finite element methods, Heat sinks, Heat transfer, Materials properties, Metals
Proceedings Papers

The IP Landscape for MEMS Packaging

Charles E. Bauer, Raymond A. Fillion, Herbert J. Neuhaus, Marc Papageorge
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 497-500, July 19–23, 2009
Paper No: InterPACK2009-89291
DOI: https://doi.org/10.1115/InterPACK2009-89291
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Topics: MEMS packaging, Microelectromechanical systems, Databases, MEMS packages, Microelectronic devices, Patents, Semiconductors (Materials), Valuation