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Proceedings Papers

Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver

Aishworya Roy, Christina DiMarino, Jesi Miranda-Santos
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111921
https://doi.org/10.1115/IPACK2023-111921
View Paper titled, Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver
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Topics: Design, Gates (Closures), Manufacturing, Cooling, Bridges (Structures), Electric vehicles, Energy dissipation, Heat, Junctions, MOSFET transistors
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6631
https://doi.org/10.1115/IPACK2019-6631
View Paper titled, Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive
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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics
Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6436
https://doi.org/10.1115/IPACK2019-6436
View Paper titled, Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

Prabjit Singh
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48180
https://doi.org/10.1115/IPACK2015-48180
View Paper titled, Arcing and Spacing Requirements for High Voltage Printed Circuit Boards
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Topics: Cellulosic fibers, Circuits, Coating processes, Coatings, Dust, Electric potential, Gates (Closures), Hardware, MOSFET transistors, Physics
Proceedings Papers

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A061, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48802
https://doi.org/10.1115/IPACK2015-48802
View Paper titled, A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis
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Topics: MOSFET transistors, Relaxation (Physics), Temperature distribution, Simulation, Electric fields, Thermal properties, Heat, Physics, Temperature
Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73248
https://doi.org/10.1115/IPACK2013-73248
View Paper titled, Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
Open the PDF for Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density in another window
Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors
Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A049, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73273
https://doi.org/10.1115/IPACK2013-73273
View Paper titled, Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis
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Topics: Heat, MOSFET transistors, Electrons, Temperature, Thermal energy, Thermal properties, Crystal lattices, Density, Electric fields, Electronics
Proceedings Papers

Development of Plate Heat Pipes for the Thermal Management of Power Electronics

Yoshiyuki Abe, Akira Nakajima, Yoshihiko Maeda, Makoto Shimose
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73086
https://doi.org/10.1115/IPACK2013-73086
View Paper titled, Development of Plate Heat Pipes for the Thermal Management of Power Electronics
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Topics: Electronics, Heat pipes, Thermal management, MOSFET transistors, Cooling, Dimensions, Gates (Closures), Heat transfer, Thermal resistance, Transistors
Proceedings Papers

A Hierarchical Framework for Thermal Modelling of Electronic Devices: From Atoms to Chips

David A. Romero, Elham Pakseresht, Daniel Sellan, Aydin Nabovati, Cristina Amon
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A043, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73202
https://doi.org/10.1115/IPACK2013-73202
View Paper titled, A Hierarchical Framework for Thermal Modelling of Electronic Devices: From Atoms to Chips
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Topics: Atoms, Modeling, Engineering simulation, Simulation, Thermal conductivity, Phonons, Physics, Silicon, Gates (Closures), Lattice Boltzmann methods
Proceedings Papers

Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures

Xi Wang, Ali Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 293-296, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89084
https://doi.org/10.1115/InterPACK2009-89084
View Paper titled, Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures
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Topics: MOSFET transistors, Temperature, Thermal characterization, Temperature distribution, Gates (Closures), Design, Electrons, Flow (Dynamics), Heat, Phonons
Proceedings Papers

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89112
https://doi.org/10.1115/InterPACK2009-89112
View Paper titled, Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs
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Topics: Simulation, Stress, Stress concentration, Physics, Diffusion (Physics), Semiconductor devices, Simulation models, Computer simulation, Electron mobility, Gates (Closures)
Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89182
https://doi.org/10.1115/InterPACK2009-89182
View Paper titled, Coupled Electro-Thermal Simulation of MOSFETs
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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73196
https://doi.org/10.1115/IPACK2005-73196
View Paper titled, Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning
Open the PDF for Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning in another window
Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration
Proceedings Papers

Effect of the Device Structure in Electro-Thermal Analysis of Si CMOS

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2073-2078, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73151
https://doi.org/10.1115/IPACK2005-73151
View Paper titled, Effect of the Device Structure in Electro-Thermal Analysis of Si CMOS
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Topics: Complementary metal oxide semiconductors, MOSFET transistors, Junctions, Silicon
Proceedings Papers

Numerical Calculation of Sub-Micron Hot Spot in Si Devices

Kazuyoshi Fushinobu, Hirohisa Maruyama
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 183-188, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35079
https://doi.org/10.1115/IPACK2003-35079
View Paper titled, Numerical Calculation of Sub-Micron Hot Spot in Si Devices
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Topics: Electrons, Modeling, MOSFET transistors, Silicon, Temperature