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Proceedings Papers

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Quang N. Pham, Youngjoon Suh, Bowen Shao, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Paper No: IPACK2019-6307
DOI: https://doi.org/10.1115/IPACK2019-6307
View Paper titled, Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings
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Topics: Boiling, Bubbles, Coatings, Dynamics (Mechanics), Heat transfer, Pool boiling, Flow (Dynamics), Thermal management, Cooling, Design
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Paper No: IPACK2019-6385
DOI: https://doi.org/10.1115/IPACK2019-6385
View Paper titled, Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

Ange-Christian Iradukunda, Josh Kasitz, Fernando Moreno, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 7–9, 2019
Paper No: IPACK2019-6422
DOI: https://doi.org/10.1115/IPACK2019-6422
View Paper titled, Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems
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Topics: Electrical properties, Electronic packages, Electronics, Graphene, Heat, Iron, Latent heat, Nanocomposites, Particulate matter, Phase change materials
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
View Paper titled, Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
DOI: https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Experimental Investigation of Fluid Motion in Pulsating Heat Pipe

Hyung Yun Noh, Sung Jin Kim
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A054, July 6–9, 2015
Paper No: IPACK2015-48285
DOI: https://doi.org/10.1115/IPACK2015-48285
View Paper titled, Experimental Investigation of Fluid Motion in Pulsating Heat Pipe
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Topics: Fluids, Heat pipes, Pressure, Heat transfer, Latent heat, Temperature, Equilibrium (Physics), Flow visualization, Heat, Pressure sensors
Proceedings Papers

Enhanced Melting for Transient Thermal Management

T. Rozenfeld, R. Hayat, Y. Kozak, G. Ziskind
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A063, July 6–9, 2015
Paper No: IPACK2015-48369
DOI: https://doi.org/10.1115/IPACK2015-48369
View Paper titled, Enhanced Melting for Transient Thermal Management
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Topics: Melting, Thermal management, Transients (Dynamics), Fins, Phase change materials, Heat transfer, Energy dissipation, Geometry, Heat, Latent heat
Proceedings Papers

Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances

Yash Ganatra, Amy Marconnet
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A064, July 6–9, 2015
Paper No: IPACK2015-48499
DOI: https://doi.org/10.1115/IPACK2015-48499
View Paper titled, Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances
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Topics: Phase change materials, Thermal management, Energy dissipation, Heat, Temperature, Thermal conductivity, Density, Energy consumption, Flow (Dynamics), Heat capacity
Proceedings Papers

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

Charlie De Vivero, Fulya Kaplan, Ayse K. Coskun
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A086, July 6–9, 2015
Paper No: IPACK2015-48568
DOI: https://doi.org/10.1115/IPACK2015-48568
View Paper titled, Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed
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Topics: Hardware, Temperature, Phase change materials, Thermal management, Complementary metal oxide semiconductors, Computation, Cooling, Design, Errors, Heat
Proceedings Papers

A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Devesh Chugh, Rasool Nasr Isfahani, Kyle Gluesenkamp, Omar Abdelaziz, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A003, July 6–9, 2015
Paper No: IPACK2015-48816
DOI: https://doi.org/10.1115/IPACK2015-48816
View Paper titled, A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling
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Topics: Absorption, Cycles, Dehumidification, Evaporative cooling, Hot water heating, Water, Heat, Heating, Hot water, Water vapor
Proceedings Papers

Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

H. Arthur Kariya, Daniel F. Hanks, Wayne L. Staats, Nicholas A. Roche, Martin Cleary, Teresa B. Peters, John G. Brisson, Evelyn N. Wang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A027, July 16–18, 2013
Paper No: IPACK2013-73120
DOI: https://doi.org/10.1115/IPACK2013-73120
View Paper titled, Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink
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Topics: Condensers (steam plant), Heat pipes, Heat sinks, Heat, Design, Thermal resistance, Cooling, Data centers, Electronic packaging, Engineering prototypes
Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Paper No: InterPACK2009-89218
DOI: https://doi.org/10.1115/InterPACK2009-89218
View Paper titled, Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials
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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation
Proceedings Papers

Perspiration Nano-Patch for Hot Spot Thermal Management

Shankar Narayanan, Andrei G. Fedorov, Yogendra K. Joshi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 493-500, July 8–12, 2007
Paper No: IPACK2007-33156
DOI: https://doi.org/10.1115/IPACK2007-33156
View Paper titled, Perspiration Nano-Patch for Hot Spot Thermal Management
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Topics: Thermal management, Heat, Cooling, Evaporative cooling, Flux (Metallurgy), Heat transfer, Boiling, Design, Electrical measurement, Evaporation