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Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Paper No: IPACK2022-97456
DOI: https://doi.org/10.1115/IPACK2022-97456
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
DOI: https://doi.org/10.1115/IPACK2020-2695
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams

Shungo Okamoto, Naomichi Saito, Kotaro Ito, Bei Ma, Ken Morita, Daisuke Iida, Kazuhiro Ohkawa, Yoshihiro Ishitani
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 27–29, 2020
Paper No: IPACK2020-2570
DOI: https://doi.org/10.1115/IPACK2020-2570
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Topics: Gallium, Gallium nitride, Heat, Imaging, Irradiation (Radiation exposure), Laser beams
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Paper No: IPACK2019-6413
DOI: https://doi.org/10.1115/IPACK2019-6413
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
DOI: https://doi.org/10.1115/IPACK2019-6440
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Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Paper No: IPACK2019-6569
DOI: https://doi.org/10.1115/IPACK2019-6569
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Paper No: IPACK2018-8422
DOI: https://doi.org/10.1115/IPACK2018-8422
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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers
Proceedings Papers

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Sriram Chandrasekaran, Sushil Bhavnani
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A022, August 29–September 1, 2017
Paper No: IPACK2017-74025
DOI: https://doi.org/10.1115/IPACK2017-74025
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Topics: Flow (Dynamics), Nucleation (Physics), Cooling, Boiling, Data centers, Fluids, Silicon, Bubbles, Electronics, Energy consumption
Proceedings Papers

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, August 29–September 1, 2017
Paper No: IPACK2017-74269
DOI: https://doi.org/10.1115/IPACK2017-74269
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Topics: Damage, Shock (Mechanics), X-rays, Reliability, Deformation, Failure, Imaging, Manufacturing, Nondestructive evaluation, Service life (Equipment)
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

Azadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A008, July 6–9, 2015
Paper No: IPACK2015-48611
DOI: https://doi.org/10.1115/IPACK2015-48611
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Topics: Catheters, Endoscopic devices, Imaging, Manufacturing, Packaging, Ultrasound, Biomedical imaging, Ultrasonic transducers, Bonding, Design
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Paper No: IPACK2015-48389
DOI: https://doi.org/10.1115/IPACK2015-48389
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Paper No: IPACK2015-48447
DOI: https://doi.org/10.1115/IPACK2015-48447
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV

Matthew J. Rau, Tianqi Guo, Pavlos P. Vlachos, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A015, July 6–9, 2015
Paper No: IPACK2015-48184
DOI: https://doi.org/10.1115/IPACK2015-48184
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Topics: Boiling, Visualization, Vapors, Flow (Dynamics), Heat, Particulate matter, Bubbles, Heat flux, Imaging, Outflow
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Paper No: IPACK2015-48333
DOI: https://doi.org/10.1115/IPACK2015-48333
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Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Paper No: IPACK2015-48814
DOI: https://doi.org/10.1115/IPACK2015-48814
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Characterization of Crack Growth in BGA Under Drop Impact

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Paper No: IPACK2013-73110
DOI: https://doi.org/10.1115/IPACK2013-73110
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Topics: Ball-Grid-Array packaging, Fracture (Materials), Solder joints, Damage, Imaging, Low cycle fatigue, Microscopes, Polishing, Tin, Vehicles
Proceedings Papers

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A012, July 16–18, 2013
Paper No: IPACK2013-73246
DOI: https://doi.org/10.1115/IPACK2013-73246
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Topics: Materials properties, Alloys, Temperature, Tin, Copper, Creep, Design, Elastic moduli, Electronics, Finite element model
Proceedings Papers

A Field Investigation Into the Limits of High-Density Air-Cooling

Michael K. Patterson, Randall Martin, J. Barr von Oehsen, Jim Pepin, Yogendra Joshi, Vaibhav K. Arghode, Robin Steinbrecher, Jeff King
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A013, July 16–18, 2013
Paper No: IPACK2013-73163
DOI: https://doi.org/10.1115/IPACK2013-73163
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Topics: Cooling, Density, Air flow, Data centers, Pressure, Computational fluid dynamics, Energy consumption, Flow (Dynamics), Imaging, Modeling