1-20 of 221
Heat sinks
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Paper No: IPACK2021-74016
DOI: https://doi.org/10.1115/IPACK2021-74016
View Paper
PDF
Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Microchannel Heat Sink for Thermal Management of Concentrated Photovoltaic Cells

Dinumol Varghese, Ahmed Sefelnasr, Mohsen Sherif, Fadi Alnaimat, Bobby Mathew
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Paper No: IPACK2021-74010
DOI: https://doi.org/10.1115/IPACK2021-74010
View Paper
PDF
Topics: Heat sinks, Microchannels, Photovoltaic cells, Thermal management, Thermal resistance
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
View Paper
PDF
Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Paper No: IPACK2021-69254
DOI: https://doi.org/10.1115/IPACK2021-69254
View Paper
PDF
Topics: Agglomeration (Materials), Coal, Computer cooling, Electronic packages, Electronic packaging, Energy dissipation, Graphene, Graphite, Heat, Heat sinks
Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021
Paper No: IPACK2021-69723
DOI: https://doi.org/10.1115/IPACK2021-69723
View Paper
PDF
Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Paper No: IPACK2020-2562
DOI: https://doi.org/10.1115/IPACK2020-2562
View Paper
PDF
Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Paper No: IPACK2020-2569
DOI: https://doi.org/10.1115/IPACK2020-2569
View Paper
PDF
Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
DOI: https://doi.org/10.1115/IPACK2020-2627
View Paper
PDF
Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
View Paper
PDF
Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 27–29, 2020
Paper No: IPACK2020-2516
DOI: https://doi.org/10.1115/IPACK2020-2516
View Paper
PDF
Topics: Energy gap, Heat sinks, Optimization, Cooling, Heat, Energy conversion, Power semiconductor devices, Reliability, Semiconductor devices, Steady state
Proceedings Papers

Partitioned Heat Sinks for Improved Natural Convection

Todd Salamon, Roger Kempers, Brian Lynch, Kevin Terrell, Elina Simon
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 27–29, 2020
Paper No: IPACK2020-2553
DOI: https://doi.org/10.1115/IPACK2020-2553
View Paper
PDF
Topics: Heat sinks, Natural convection
Proceedings Papers

Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics

Darryl Jennings, Jr., Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 27–29, 2020
Paper No: IPACK2020-2527
DOI: https://doi.org/10.1115/IPACK2020-2527
View Paper
PDF
Topics: Computational fluid dynamics, Cooling, Friction, Heat sinks, Microchannels, Nanofluids, Nanostructures
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
DOI: https://doi.org/10.1115/IPACK2020-2670
View Paper
PDF
Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

Performance Analysis of Heat Sinks Designed for Additive Manufacturing

Andrew Scott White, David Saltzman, Stephen Lynch
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 27–29, 2020
Paper No: IPACK2020-2532
DOI: https://doi.org/10.1115/IPACK2020-2532
View Paper
PDF
Topics: Additive manufacturing, Heat sinks
Proceedings Papers

Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

Palash V. Acharya, Vaibhav Bahadur, Robert Hebner, Abdelhamid Ouroua, Shannon Strank
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 7–9, 2019
Paper No: IPACK2019-6311
DOI: https://doi.org/10.1115/IPACK2019-6311
View Paper
PDF
Topics: Cooling, Electronics, Thermal management, Heat, Electronic packages, Energy dissipation, Heat sinks, Packaging, Silicon, Copper
Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Paper No: IPACK2019-6429
DOI: https://doi.org/10.1115/IPACK2019-6429
View Paper
PDF
Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Paper No: IPACK2019-6530
DOI: https://doi.org/10.1115/IPACK2019-6530
View Paper
PDF
Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Paper No: IPACK2019-6389
DOI: https://doi.org/10.1115/IPACK2019-6389
View Paper
PDF
Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Paper No: IPACK2019-6444
DOI: https://doi.org/10.1115/IPACK2019-6444
View Paper
PDF
Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers
Proceedings Papers

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3 rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, Ravya Dandamudi, Chinmay Bhatt, Pranavi Rachamreddy, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 7–9, 2019
Paper No: IPACK2019-6600
DOI: https://doi.org/10.1115/IPACK2019-6600
View Paper
PDF
Topics: Computational fluid dynamics, Cooling, Heat sinks, Optimization