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Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Paper No: IPACK2021-68121
DOI: https://doi.org/10.1115/IPACK2021-68121
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021
Paper No: IPACK2021-69723
DOI: https://doi.org/10.1115/IPACK2021-69723
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Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Paper No: IPACK2019-6530
DOI: https://doi.org/10.1115/IPACK2019-6530
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

Michael Ozeh, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 27–30, 2018
Paper No: IPACK2018-8354
DOI: https://doi.org/10.1115/IPACK2018-8354
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Topics: Generators, Heat recovery, Heat sinks, Heat pipes, Nanoparticles, Electronics, Heat, Heat exchangers, Metals, Temperature gradient
Proceedings Papers

Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions

Devdatta Kulkarni, Sandeep Ahuja, Sanjoy Saha
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 29–September 1, 2017
Paper No: IPACK2017-74055
DOI: https://doi.org/10.1115/IPACK2017-74055
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Topics: Boundary-value problems, Cooling, Data centers, Design, Heat pipes
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Paper No: IPACK2017-74119
DOI: https://doi.org/10.1115/IPACK2017-74119
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

Joon Hong Boo, Hyun Gon Kim, Chang Woo Han
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 29–September 1, 2017
Paper No: IPACK2017-74095
DOI: https://doi.org/10.1115/IPACK2017-74095
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Topics: Computer cooling, Heat pipes, Stress, Thermal resistance, Fluids, Wire screens, Containers, Cooling, Copper, Density
Proceedings Papers

Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe

S. F. Wang, Y. X. Hu, Y. Zhou, W. Zhang
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A001, July 6–9, 2015
Paper No: IPACK2015-48665
DOI: https://doi.org/10.1115/IPACK2015-48665
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Topics: Fluids, Heat pipes, Heat transfer, Water, Surface tension, Boiling, Bubbles, Cooling, Critical heat flux, Temperature
Proceedings Papers

A Numerical Study of Pulsating Heat Pipe Performance

Brian P. d’Entremont, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A025, July 6–9, 2015
Paper No: IPACK2015-48350
DOI: https://doi.org/10.1115/IPACK2015-48350
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Topics: Heat pipes, Slug flows, Boiling, Condensation, Evaporation, Microchannels, Buoyancy, Condensers (steam plant), Flow (Dynamics), Heat transfer
Proceedings Papers

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Yasushi Koito, Hiroyuki Maehara, Daisuke Shimada, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A028, July 6–9, 2015
Paper No: IPACK2015-48308
DOI: https://doi.org/10.1115/IPACK2015-48308
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Topics: Heat, Heat pipes, Heat transfer, Thermal conductivity, Water, Circuits, Condensers (steam plant), Copper powders, Dimensions, Fluids
Proceedings Papers

Fabrication of a Vapor Chamber on a Plastic Board

Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A029, July 6–9, 2015
Paper No: IPACK2015-48554
DOI: https://doi.org/10.1115/IPACK2015-48554
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Topics: Manufacturing, Vapors, Heat transfer, Cooling, Heat, Fluids, Water, Condensers (steam plant), Copper powders, Flat heat pipes
Proceedings Papers

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

Ryan Lewis, Julie Slaughter, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Paper No: IPACK2015-48503
DOI: https://doi.org/10.1115/IPACK2015-48503
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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination
Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Paper No: IPACK2015-48019
DOI: https://doi.org/10.1115/IPACK2015-48019
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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis
Proceedings Papers

Experimental Investigation of Fluid Motion in Pulsating Heat Pipe

Hyung Yun Noh, Sung Jin Kim
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A054, July 6–9, 2015
Paper No: IPACK2015-48285
DOI: https://doi.org/10.1115/IPACK2015-48285
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Topics: Fluids, Heat pipes, Pressure, Heat transfer, Latent heat, Temperature, Equilibrium (Physics), Flow visualization, Heat, Pressure sensors
Proceedings Papers

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

Ehsan B. Haghighi, Thanh L. Phan, Vijit Wuttijumnong, Koichi Mashiko, Yuji Saito, Masataka Mochizuki
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A007, July 6–9, 2015
Paper No: IPACK2015-48671
DOI: https://doi.org/10.1115/IPACK2015-48671
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Topics: Cooling, Heat pipes, Heat sinks, Manufacturing, Air flow, Forced convection, Heat, Heat losses, Telecommunications, Thermal management
Proceedings Papers

Development of Plate Heat Pipes for the Thermal Management of Power Electronics

Yoshiyuki Abe, Akira Nakajima, Yoshihiko Maeda, Makoto Shimose
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A017, July 16–18, 2013
Paper No: IPACK2013-73086
DOI: https://doi.org/10.1115/IPACK2013-73086
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Topics: Electronics, Heat pipes, Thermal management, MOSFET transistors, Cooling, Dimensions, Gates (Closures), Heat transfer, Thermal resistance, Transistors
Proceedings Papers

Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration

Gi Hwan Kwon, Sung Jin Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A010, July 16–18, 2013
Paper No: IPACK2013-73056
DOI: https://doi.org/10.1115/IPACK2013-73056
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Topics: Flow (Dynamics), Heat pipes, Heat transfer, Fluids, Heat, Oscillations, Condensation, Evaporation, Glass, Visualization
Proceedings Papers

Fabrication of Heat Pipes on an Acrylic Resin Board

Yasushi Koito, Hiroyuki Maehara, Toshio Tomimura
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A050, July 16–18, 2013
Paper No: IPACK2013-73277
DOI: https://doi.org/10.1115/IPACK2013-73277
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Topics: Heat pipes, Manufacturing, Resins, Heat transfer, Electrical wires, Fluids, Thermal conductivity, Water, Condensers (steam plant), Gravity (Force)
Proceedings Papers

Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

H. Arthur Kariya, Daniel F. Hanks, Wayne L. Staats, Nicholas A. Roche, Martin Cleary, Teresa B. Peters, John G. Brisson, Evelyn N. Wang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A027, July 16–18, 2013
Paper No: IPACK2013-73120
DOI: https://doi.org/10.1115/IPACK2013-73120
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Topics: Condensers (steam plant), Heat pipes, Heat sinks, Heat, Design, Thermal resistance, Cooling, Data centers, Electronic packaging, Engineering prototypes