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Proceedings Papers

Monitoring Fugitive Methane Gas Emission From Natural Gas Pads

Levente J. Klein, Ted van Kessel, Dhruv Nair, Ramachandran Muralidhar, Hendrik Hamann, Norma Sosa
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 29–September 1, 2017
Paper No: IPACK2017-74191
DOI: https://doi.org/10.1115/IPACK2017-74191
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Topics: Emissions, Methane, Natural gas, Leakage, Sensors, Plumes (Fluid dynamics), Governments, Maintenance, Regulations, Wind
Proceedings Papers

The Environmental Footprint of Data Centers

Amip Shah, Cullen Bash, Ratnesh Sharma, Tom Christian, Brian J. Watson, Chandrakant Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 653-662, July 19–23, 2009
Paper No: InterPACK2009-89036
DOI: https://doi.org/10.1115/InterPACK2009-89036
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Topics: Data centers, Energy consumption, Energy efficiency, Cycles, Governments, Sustainability
Proceedings Papers

Educational Effects of Industry-Academia Joint Projects on the Development of Microelectronic Packaging Technologies: Recent Experiences in Japan

Wataru Nakayama, Masaki Shiratori, Noriyuki Miyazaki
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 1-6, July 6–11, 2003
Paper No: IPACK2003-35122
DOI: https://doi.org/10.1115/IPACK2003-35122
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Topics: Microelectronic packaging, Education, Engineers, Arches, Engineering teachers, Governments, Japan Society of Mechanical Engineers