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Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Paper No: IPACK2021-74116
DOI: https://doi.org/10.1115/IPACK2021-74116
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams

Shungo Okamoto, Naomichi Saito, Kotaro Ito, Bei Ma, Ken Morita, Daisuke Iida, Kazuhiro Ohkawa, Yoshihiro Ishitani
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 27–29, 2020
Paper No: IPACK2020-2570
DOI: https://doi.org/10.1115/IPACK2020-2570
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Topics: Gallium, Gallium nitride, Heat, Imaging, Irradiation (Radiation exposure), Laser beams
Proceedings Papers

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020
Paper No: IPACK2020-2589
DOI: https://doi.org/10.1115/IPACK2020-2589
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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Magnetic fields, Reliability, Sensors
Proceedings Papers

Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

Ramchandra M. Kotecha, Andriy Zakutayev, Wyatt K. Metzger, Paul Paret, Gilberto Moreno, Bidzina Kekelia, Kevin Bennion, Barry Mather, Sreekant Narumanchi, Samuel Kim, Samuel Graham
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019
Paper No: IPACK2019-6453
DOI: https://doi.org/10.1115/IPACK2019-6453
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Topics: Electronics, Energy gap, Gallium, Modeling
Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Paper No: IPACK2015-48083
DOI: https://doi.org/10.1115/IPACK2015-48083
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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

Influences of Specimen Size and Annealing Temperature on Mechanical Reliability of FIB-Fabricated Si Nanowires for NEMS

Tatsuya Fujii, Koichi Sudoh, Shozo Inoue, Takahiro Namazu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A006, July 16–18, 2013
Paper No: IPACK2013-73310
DOI: https://doi.org/10.1115/IPACK2013-73310
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Topics: Annealing, Nanoelectromechanical systems, Nanowires, Reliability, Temperature, Manufacturing, Silicon, Young's modulus, Damage, Focused ion beams
Proceedings Papers

Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications

Rupal Jain, F. Patrick McCluskey, Alison B. Flatau
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 825-829, July 8–12, 2007
Paper No: IPACK2007-33455
DOI: https://doi.org/10.1115/IPACK2007-33455
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Topics: Acoustics, Gallium, Iron, Nanowires, Packaging, Sensors, Water, Waves, Absorption, Ear