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Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Paper No: IPACK2017-74026
DOI: https://doi.org/10.1115/IPACK2017-74026
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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Paper No: IPACK2015-48626
DOI: https://doi.org/10.1115/IPACK2015-48626
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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning

Promod R. Chowdhury, Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A013, July 6–9, 2015
Paper No: IPACK2015-48622
DOI: https://doi.org/10.1115/IPACK2015-48622
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Topics: Creep, Elastic moduli, Experimental characterization, Flip-chip assemblies, Hardening (Curing), Machinery, Materials properties, Mechanical properties, Microscale devices, Production equipment
Proceedings Papers

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 749-761, July 6–8, 2011
Paper No: IPACK2011-52209
DOI: https://doi.org/10.1115/IPACK2011-52209
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Topics: Creep, Experimental characterization, Modeling, Temperature, Stress, Testing, Tension, Constitutive equations, Engineering simulation, Finite element analysis
Proceedings Papers

High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package

Ming-Ji Dai, Chih-Kuang Yu, Chun Kai Liu, Sheng-Liang Kuo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 229-233, July 8–12, 2007
Paper No: IPACK2007-33369
DOI: https://doi.org/10.1115/IPACK2007-33369
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Topics: Silicon, Thermoelectric coolers, Cooling, Flip-chip assemblies, Junctions, Light-emitting diodes, Manufacturing, Microelectromechanical systems, Packaging, Temperature
Proceedings Papers

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Paper No: IPACK2005-73416
DOI: https://doi.org/10.1115/IPACK2005-73416
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Topics: Cooling, Heat sinks, Microfluidics, Silicon chips, Complementary metal oxide semiconductors, Density, Electroplating, Engineering prototypes, Flip-chip, Flip-chip assemblies
Proceedings Papers

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005
Paper No: IPACK2005-73348
DOI: https://doi.org/10.1115/IPACK2005-73348
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Topics: Delamination, Flip-chip assemblies, Stress, Flip-chip, Flip-chip devices, Sensors, Silicon, Cycles, Manufacturing, Solder joints
Proceedings Papers

Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, M. Saiful Islam, Hongtao Ma, Chang Lin, Pradeep Lall, Roy Knight, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1253-1262, July 17–22, 2005
Paper No: IPACK2005-73349
DOI: https://doi.org/10.1115/IPACK2005-73349
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Topics: Electronic packaging, Flip-chip, Flip-chip devices, Low temperature, Stress, Temperature, Finite element model, Flip-chip assemblies, Modeling, Packaging
Proceedings Papers

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Daniel J. Hyman, Roger Kuroda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2053-2056, July 17–22, 2005
Paper No: IPACK2005-73419
DOI: https://doi.org/10.1115/IPACK2005-73419
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Topics: Flip-chip assemblies, Microelectromechanical systems, Microwaves, Packaging, Flip-chip, Reliability, Filters, Performance characterization, Yield strength
Proceedings Papers

A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1341-1346, July 17–22, 2005
Paper No: IPACK2005-73493
DOI: https://doi.org/10.1115/IPACK2005-73493
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Topics: Delamination, Flip-chip packages, Fracture mechanics, Fatigue, Flip-chip, Flip-chip devices, Solders, Adhesives, Computer simulation, Displacement
Proceedings Papers

Measurement of the Constitutive Behavior of Underfill Encapsulants

M. Saiful Islam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 923-931, July 6–11, 2003
Paper No: IPACK2003-35321
DOI: https://doi.org/10.1115/IPACK2003-35321
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Topics: Creep, Design engineering, Dimensions, Electronic packages, Flip-chip assemblies, Flow (Dynamics), Machinery, Materials properties, Mechanical testing, Microscale devices
Proceedings Papers

Development of Lead-Free Flip Chip Package and Its Reliability

Jeffrey C. B. Lee, Sting Wu, H. L. Chou, Yi-Shao Lai
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 115-121, July 6–11, 2003
Paper No: IPACK2003-35046
DOI: https://doi.org/10.1115/IPACK2003-35046
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Topics: Flip-chip packages, Reliability, Semiconductor wafers, Solders, Failure mechanisms, Cycles, Temperature, Wire bonding, Ball-Grid-Array packaging, Flip-chip
Proceedings Papers

Influence of the Property of the Build-Up Package on Warpage at Flip Chip Assembly Process

Yukihiko Toyoda, Yoichiro Kawamura, Hiroyoshi Hiei, Qiang Yu, Tadahiro Shibutani, Doseop Kim, Haeki Nam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 197-201, July 6–11, 2003
Paper No: IPACK2003-35262
DOI: https://doi.org/10.1115/IPACK2003-35262
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Topics: Flip-chip assemblies, Warping, Manufacturing, Simulation, Packaging, Reliability, Density