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Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021

Paper No: IPACK2021-74086

DOI: https://doi.org/10.1115/IPACK2021-74086

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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components

Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021

Paper No: IPACK2021-74060

DOI: https://doi.org/10.1115/IPACK2021-74060

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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics

Proceedings Papers

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021

Paper No: IPACK2021-68902

DOI: https://doi.org/10.1115/IPACK2021-68902

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Topics: Damage, Electrodiffusion, Flexible electronics, Stress

Proceedings Papers

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021

Paper No: IPACK2021-74088

DOI: https://doi.org/10.1115/IPACK2021-74088

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Topics: Accelerated life testing, Flexible electronics, Lamination, Lithium-ion batteries

Proceedings Papers

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Pradeep Lall, Ved Soni, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021

Paper No: IPACK2021-74115

DOI: https://doi.org/10.1115/IPACK2021-74115

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Topics: Batteries, Bending (Stress), Biomedical equipment, Electronics, Flexible electronics, Industrial research, Lithium-ion batteries, Regression models, Stress

Proceedings Papers

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 27–29, 2020

Paper No: IPACK2020-2525

DOI: https://doi.org/10.1115/IPACK2020-2525

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Topics: Design, Electronics, Failure analysis, Temperature, Stress, Failure, Testing, Accelerated life testing, Chain, Failure data

Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020

Paper No: IPACK2020-2644

DOI: https://doi.org/10.1115/IPACK2020-2644

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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors

Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020

Paper No: IPACK2020-2661

DOI: https://doi.org/10.1115/IPACK2020-2661

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Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics

Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019

Paper No: IPACK2019-6584

DOI: https://doi.org/10.1115/IPACK2019-6584

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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019

Paper No: IPACK2019-6570

DOI: https://doi.org/10.1115/IPACK2019-6570

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Topics: Accelerated life testing, Batteries, Cycles, Electronics, Energy efficiency, Flexible electronics, High temperature, Lithium-ion batteries, Medical devices, Regression models

Proceedings Papers

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019

Paper No: IPACK2019-6579

DOI: https://doi.org/10.1115/IPACK2019-6579

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Topics: Aerosols, Bending (Stress), Flexible electronics, Reliability

Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019

Paper No: IPACK2019-6580

DOI: https://doi.org/10.1115/IPACK2019-6580

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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing

Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018

Paper No: IPACK2018-8322

DOI: https://doi.org/10.1115/IPACK2018-8322

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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine

Proceedings Papers

Peel-and-Stick Sensors Powered by Directed RF Energy

Christopher Lalau-Keraly, George Daniel, Joseph Lee, David Schwartz

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 29–September 1, 2017

Paper No: IPACK2017-74150

DOI: https://doi.org/10.1115/IPACK2017-74150

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Topics: Sensors, Building management systems, Design, Dimensions, Energy harvesting, Flexible electronics, Signals, Temperature

Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Pradeep Lall, Hao Zhang, Rahul Lall

Paper No: IPACK2017-74232

DOI: https://doi.org/10.1115/IPACK2017-74232

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Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper

Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal

Paper No: IPACK2017-74264

DOI: https://doi.org/10.1115/IPACK2017-74264

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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating

Proceedings Papers

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

Ryan Lewis, Julie Slaughter, Y. C. Lee

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015

Paper No: IPACK2015-48503

DOI: https://doi.org/10.1115/IPACK2015-48503

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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination

Proceedings Papers

Highly Stretchable Interconnects for Flexible Electronics Applications

Yeasir Arafat, Rahul Panat, Indranath Dutta

Paper No: IPACK2015-48130

DOI: https://doi.org/10.1115/IPACK2015-48130

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Topics: Density, Flexible electronics, Geometry, Manufacturing, Polymers

Proceedings Papers

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 27-32, July 19–23, 2009

Paper No: InterPACK2009-89247

DOI: https://doi.org/10.1115/InterPACK2009-89247

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Topics: Flexible electronics, High cycle fatigue, Metals, Thin films, Unsaturated polyesters, Fracture (Materials), Bulk solids, Electrical resistance, Electronic systems, Failure

NARROW

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Folding-Reliability of Flexible Electronics in Wearable Applications

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Peel-and-Stick Sensors Powered by Directed RF Energy

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

Highly Stretchable Interconnects for Flexible Electronics Applications

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

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