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Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019

Paper No: IPACK2019-6372

DOI: https://doi.org/10.1115/IPACK2019-6372

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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics

Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Pradeep Lall, Amrit Abrol, David Locker

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017

Paper No: IPACK2017-74252

DOI: https://doi.org/10.1115/IPACK2017-74252

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Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms

Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017

Paper No: IPACK2017-74273

DOI: https://doi.org/10.1115/IPACK2017-74273

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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)

Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A034, July 6–9, 2015

Paper No: IPACK2015-48049

DOI: https://doi.org/10.1115/IPACK2015-48049

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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits

Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015

Paper No: IPACK2015-48085

DOI: https://doi.org/10.1115/IPACK2015-48085

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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation

Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015

Paper No: IPACK2015-48685

DOI: https://doi.org/10.1115/IPACK2015-48685

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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods

Proceedings Papers

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

Hafiz M. Hashim, Baris Dogruoz, Mehmet Arik, Murat Parlak

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015

Paper No: IPACK2015-48024

DOI: https://doi.org/10.1115/IPACK2015-48024

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Topics: Axial flow, Computational fluid dynamics, Performance characterization, Flow (Dynamics), Engineering simulation, Engineers, Fans, Pressure, Pressure drop, Simulation

Proceedings Papers

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015

Paper No: IPACK2015-48771

DOI: https://doi.org/10.1115/IPACK2015-48771

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Topics: Flow (Dynamics), Coolants, Pressure drop, Temperature, Energy dissipation, Fluids, Boiling, Cooling, Data centers, Design

Proceedings Papers

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Carin Lundquist Ruiz

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A022, July 6–9, 2015

Paper No: IPACK2015-48769

DOI: https://doi.org/10.1115/IPACK2015-48769

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Topics: Design, Modeling, Cutting, Engineers, Light-emitting diodes, Simulation, Structural design

Proceedings Papers

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Frank Fan Wang

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013

Paper No: IPACK2013-73262

DOI: https://doi.org/10.1115/IPACK2013-73262

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Topics: Aerospace industry, Design, Electronics, Fluids, Cooling, Computational fluid dynamics, Computer software, Pressure drop, Computers, Dimensions

Proceedings Papers

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

Michael K. Patterson, Don Atwood, John G. Miner

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1009-1014, July 19–23, 2009

Paper No: InterPACK2009-89358

DOI: https://doi.org/10.1115/InterPACK2009-89358

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Topics: Data centers, Cooling, Cooling systems, Energy consumption, Temperature control, Air conditioning, Design, Doors, Engineers, Heating

Proceedings Papers

Modelling Reliability of Power Electronics Packaging

Chris Bailey, Hua Lu, Chunyan Yin

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 215-220, July 19–23, 2009

Paper No: InterPACK2009-89430

DOI: https://doi.org/10.1115/InterPACK2009-89430

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Topics: Electronic packaging, Modeling, Reliability, Electronics, Semiconductors (Materials), Aluminum, Design, Electric vehicles, Electricity (Physics), Energy management

Proceedings Papers

Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction

Nihad Dukhan

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 881-886, July 19–23, 2009

Paper No: InterPACK2009-89231

DOI: https://doi.org/10.1115/InterPACK2009-89231

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Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Electrical conductivity, Heat, Thermal conductivity, Cooling, Design

Proceedings Papers

Integrating an Electronics Component Database Into a Thermal Design Tool

Patrick Loney

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 731-740, July 19–23, 2009

Paper No: InterPACK2009-89080

DOI: https://doi.org/10.1115/InterPACK2009-89080

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Topics: Databases, Design, Electronics, Engineers, Junctions, Lumber, Temperature, Computer software, Cooling, Electrical conductivity

Proceedings Papers

Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability

Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 855-861, July 8–12, 2007

Paper No: IPACK2007-33242

DOI: https://doi.org/10.1115/IPACK2007-33242

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Topics: Ball-Grid-Array packages, Design, Evaluation methods, Reliability, Ball-Grid-Array packaging, Engineers, Fatigue, Fatigue life, Printed circuit boards, Response surface methodology

Proceedings Papers

Using Linear Superposition to Solve Multiple Heat Source Transient Thermal Problems

David T. Billings, Roger P. Stout

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 791-799, July 8–12, 2007

Paper No: IPACK2007-33576

DOI: https://doi.org/10.1115/IPACK2007-33576

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Topics: Heat, Transients (Dynamics), Circuits, Design, Engineers, Steady state

Proceedings Papers

Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles

Vijay Sarihan, Steven Xu, Beth Keser

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 965-969, July 8–12, 2007

Paper No: IPACK2007-33312

DOI: https://doi.org/10.1115/IPACK2007-33312

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Topics: Nanoparticles, Polymers, Resins, Reliability, Materials properties, Packaging, Particulate matter, Simulation, Composite materials, Diluents

Proceedings Papers

Mold Adhesion Force Measurement

Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, Yeong-Jyh Lin

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 51-58, July 8–12, 2007

Paper No: IPACK2007-33826

DOI: https://doi.org/10.1115/IPACK2007-33826

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Topics: Adhesion, Force measurement, Coatings, Molding, Engineers, Instrumentation, Temperature, Foundry coatings, Surface finishing, Cavities

Proceedings Papers

Vapor Chambers in Blade Server CPU Cooling Solutions

Matt Connors

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 703-705, July 8–12, 2007

Paper No: IPACK2007-33779

DOI: https://doi.org/10.1115/IPACK2007-33779

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Topics: Blades, Computer cooling, Vapors, Heat sinks, Aluminum, Copper, Computational fluid dynamics, Cooling, Design, Dimensions

Proceedings Papers

Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China

Xiu-Lan Cheng, Yu-Zhuo Fu, Cheng Yang, Yan Chen

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 429-433, July 8–12, 2007

Paper No: IPACK2007-33334

DOI: https://doi.org/10.1115/IPACK2007-33334

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Topics: China, Microelectronic packaging, Packaging, Students, Design, Engineers, Failure analysis, Flow (Dynamics), Manufacturing, Printed circuit board assemblies

NARROW

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

Modelling Reliability of Power Electronics Packaging

Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction

Integrating an Electronics Component Database Into a Thermal Design Tool

Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability

Using Linear Superposition to Solve Multiple Heat Source Transient Thermal Problems

Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles

Mold Adhesion Force Measurement

Vapor Chambers in Blade Server CPU Cooling Solutions

Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China

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