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Proceedings Papers

Molecular Dynamics Investigation of Water Behavior Through Nanopores

Kimia Montazeri, Penghui Cao, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 27–29, 2020
Paper No: IPACK2020-2699
DOI: https://doi.org/10.1115/IPACK2020-2699
View Paper titled, Molecular Dynamics Investigation of Water Behavior Through Nanopores
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Topics: Density, Molecular dynamics, Nanopores, Water, Nanoscale phenomena, Dimensions, Dynamics (Mechanics), Energy storage, Engineering systems and industry applications, Fluids
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
DOI: https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Kieran Hess, Amy S. Fleischer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A062, July 6–9, 2015
Paper No: IPACK2015-48082
DOI: https://doi.org/10.1115/IPACK2015-48082
View Paper titled, The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials
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Topics: Energy storage, Nanoparticles, Viscosity, Multi-walled carbon nanotubes, Fluids, Graphite, Temperature, Currents, Heat transfer, Nanofibers
Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Paper No: IPACK2011-52265
DOI: https://doi.org/10.1115/IPACK2011-52265
View Paper titled, Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers
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Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems
Proceedings Papers

Multiphysics Approach to Modeling Supercapacitors for Improving Performance

Xinqiang Xu, Bahgat G. Sammakia, DaeYoung Jung, Thor Eilertsen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 165-174, July 6–8, 2011
Paper No: IPACK2011-52081
DOI: https://doi.org/10.1115/IPACK2011-52081
View Paper titled, Multiphysics Approach to Modeling Supercapacitors for Improving Performance
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Topics: Modeling, Ultracapacitors, Heat, Electrolytes, Temperature, Temperature distribution, Thermal management, Activated carbon, Boundary-value problems, Computer software
Proceedings Papers

Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

Shankar Krishnan, Suresh V. Garimella
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 363-374, July 6–11, 2003
Paper No: IPACK2003-35169
DOI: https://doi.org/10.1115/IPACK2003-35169
View Paper titled, Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??
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Topics: Computer cooling, Copper, Electronics, Energy storage, Heat sinks, Phase change materials, Thermal management, Transients (Dynamics)