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Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022

Paper No: IPACK2022-97587

DOI: https://doi.org/10.1115/IPACK2022-97587

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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat

Proceedings Papers

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Li Chen, Aaron P. Wemhoff

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 25–27, 2022

Paper No: IPACK2022-92005

DOI: https://doi.org/10.1115/IPACK2022-92005

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Topics: Carbon, Data centers, Energy consumption, Stress, Water

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022

Paper No: IPACK2022-97447

DOI: https://doi.org/10.1115/IPACK2022-97447

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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems

Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021

Paper No: IPACK2021-74016

DOI: https://doi.org/10.1115/IPACK2021-74016

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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)

Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021

Paper No: IPACK2021-72621

DOI: https://doi.org/10.1115/IPACK2021-72621

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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat

Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021

Paper No: IPACK2021-72682

DOI: https://doi.org/10.1115/IPACK2021-72682

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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases

Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021

Paper No: IPACK2021-69723

DOI: https://doi.org/10.1115/IPACK2021-69723

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Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks

Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021

Paper No: IPACK2021-72612

DOI: https://doi.org/10.1115/IPACK2021-72612

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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design

Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019

Paper No: IPACK2019-6514

DOI: https://doi.org/10.1115/IPACK2019-6514

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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption

Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019

Paper No: IPACK2019-6585

DOI: https://doi.org/10.1115/IPACK2019-6585

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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software

Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019

Paper No: IPACK2019-6386

DOI: https://doi.org/10.1115/IPACK2019-6386

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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles

Proceedings Papers

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018

Paper No: IPACK2018-8432

DOI: https://doi.org/10.1115/IPACK2018-8432

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Topics: Temperature, Pumps, Cooling, Fluids, Failure, Operating temperature, Air pollution, Condensation, Corrosion, Data centers

Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018

Paper No: IPACK2018-8305

DOI: https://doi.org/10.1115/IPACK2018-8305

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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing

Proceedings Papers

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

Manasa Sahini, Chinmay Kshirsagar, Patrick McGinn, Dereje Agonafer

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 27–30, 2018

Paper No: IPACK2018-8255

DOI: https://doi.org/10.1115/IPACK2018-8255

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Topics: Coolants, Cooling, Water, Data centers, Pumps, Stress, Temperature, Energy consumption, Heat exchangers, Exhaust systems

Proceedings Papers

Long-Term Effects of Power Quality and Power Cycling on Thermoelectric Module Performance

Viral K. Patel, Hsin Wang, Kyle R. Gluesenkamp, Anthony Gehl, Geoffrey Ormston, Emily Kirkman

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, August 27–30, 2018

Paper No: IPACK2018-8282

DOI: https://doi.org/10.1115/IPACK2018-8282

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Topics: Energy consumption, Heat, Heating and cooling, Temperature

Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018

Paper No: IPACK2018-8422

DOI: https://doi.org/10.1115/IPACK2018-8422

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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers

Proceedings Papers

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Sriram Chandrasekaran, Sushil Bhavnani

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A022, August 29–September 1, 2017

Paper No: IPACK2017-74025

DOI: https://doi.org/10.1115/IPACK2017-74025

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Topics: Flow (Dynamics), Nucleation (Physics), Cooling, Boiling, Data centers, Fluids, Silicon, Bubbles, Electronics, Energy consumption

Proceedings Papers

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

Yusuke Nakajo, Hiroaki Nishi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, August 29–September 1, 2017

Paper No: IPACK2017-74341

DOI: https://doi.org/10.1115/IPACK2017-74341

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Topics: Cycles, Temperature, Data centers, Stress, Air conditioning, Failure, Heat, Maintenance, Semiconductors (Materials), Energy consumption

Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017

Paper No: IPACK2017-74028

DOI: https://doi.org/10.1115/IPACK2017-74028

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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)

NARROW

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Design and Application of Innovative 3DVC in AI Server System

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Design of Passive Two-Phase Thermosyphons for Server Cooling

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

Long-Term Effects of Power Quality and Power Cycling on Thermoelectric Module Performance

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

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