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Proceedings Papers

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

Zihao Yuan, Tao Zhang, Jeroen Van Duren, Ayse K. Coskun
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73017
https://doi.org/10.1115/IPACK2021-73017
View Paper titled, Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
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Topics: Diamonds, Flat heat pipes, Simulation, Thermal efficiency
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74163
https://doi.org/10.1115/IPACK2017-74163
View Paper titled, Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
https://doi.org/10.1115/IPACK2015-48179
View Paper titled, Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
https://doi.org/10.1115/IPACK2015-48429
View Paper titled, Advanced Cooling Designs for GaN-on-Diamond MMICs
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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Novel Thermal Management of GaN Electronics: Diamond Substrates

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48145
https://doi.org/10.1115/IPACK2015-48145
View Paper titled, Novel Thermal Management of GaN Electronics: Diamond Substrates
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Topics: Diamonds, Electronics, Gallium nitride, Thermal management, Thermal conductivity, Heat transfer, Junctions, Microwaves, Semiconductor wafers, Temperature
Proceedings Papers

Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 247-255, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52144
https://doi.org/10.1115/IPACK2011-52144
View Paper titled, Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures
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Topics: Bridges (Structures), Convection, Heat conduction, Nanoscale phenomena, Simulation, Displacement, Pressure, Silicon, Cooling, Diamonds
Proceedings Papers

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 311-318, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52225
https://doi.org/10.1115/IPACK2011-52225
View Paper titled, Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs
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Topics: Cooling, Graphics processing units, Diamonds, Fins, Water, Design, Flow (Dynamics), Coolers, Electrolytic corrosion, Metals
Proceedings Papers

Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 967-969, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33824
https://doi.org/10.1115/IPACK2007-33824
View Paper titled, Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond
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Topics: Carbon nanotubes, Diamonds, Vapors, Diamond films, Nucleation (Physics), Plasmas (Ionized gases)
Proceedings Papers

Challenges in Package Cooling of High Performance Servers

Jie Wei
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 501-507, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33637
https://doi.org/10.1115/IPACK2007-33637
View Paper titled, Challenges in Package Cooling of High Performance Servers
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Topics: Cooling, Composite materials, Energy dissipation, Heat, Thermal conductivity, Density, Diamonds, Flat heat pipes, Heat conduction, Heat pipes
Proceedings Papers

Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

Ravi Bollina, Janet Landgraf, Hannes Wagner, Robert Wilhelm, Sven Knippscheer, Gerhard Mitic, Svetlana Levchuck
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 389-397, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33028
https://doi.org/10.1115/IPACK2007-33028
View Paper titled, Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites
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Topics: Composite materials, Diamonds, Metals, Reliability, Testing, Pressure, Thermal diffusivity, Thermal properties, Aluminum, Aluminum alloys