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Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Paper No: IPACK2018-8432
https://doi.org/10.1115/IPACK2018-8432
View Paper titled, Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time
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Topics: Temperature, Pumps, Cooling, Fluids, Failure, Operating temperature, Air pollution, Condensation, Corrosion, Data centers
Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018
Paper No: IPACK2018-8449
https://doi.org/10.1115/IPACK2018-8449
View Paper titled, Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes
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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Paper No: IPACK2015-48516
https://doi.org/10.1115/IPACK2015-48516
View Paper titled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
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Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

A Numerical Study of Pulsating Heat Pipe Performance

Brian P. d’Entremont, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A025, July 6–9, 2015
Paper No: IPACK2015-48350
https://doi.org/10.1115/IPACK2015-48350
View Paper titled, A Numerical Study of Pulsating Heat Pipe Performance
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Topics: Heat pipes, Slug flows, Boiling, Condensation, Evaporation, Microchannels, Buoyancy, Condensers (steam plant), Flow (Dynamics), Heat transfer
Proceedings Papers

Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration

Gi Hwan Kwon, Sung Jin Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A010, July 16–18, 2013
Paper No: IPACK2013-73056
https://doi.org/10.1115/IPACK2013-73056
View Paper titled, Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration
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Topics: Flow (Dynamics), Heat pipes, Heat transfer, Fluids, Heat, Oscillations, Condensation, Evaporation, Glass, Visualization
Proceedings Papers

Correlation Between Behaviors of the Vapor Bubbles and the Characteristics of the Heat Transfer Over the Heated Surface on MEB

Takahito Saiki, Tomohiko Osawa, Ichiro Ueno, Chungpyo Hong
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A032, July 16–18, 2013
Paper No: IPACK2013-73153
https://doi.org/10.1115/IPACK2013-73153
View Paper titled, Correlation Between Behaviors of the Vapor Bubbles and the Characteristics of the Heat Transfer Over the Heated Surface on MEB
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Topics: Bubbles, Heat transfer, Vapors, Wire, Collapse, Condensation, Emissions, Heat flux, Microbubbles, Pool boiling
Proceedings Papers

Liquid Cooling Network Systems for Energy Conservation in Data Centers

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 443-449, July 6–8, 2011
Paper No: IPACK2011-52066
https://doi.org/10.1115/IPACK2011-52066
View Paper titled, Liquid Cooling Network Systems for Energy Conservation in Data Centers
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Topics: Cooling, Data centers, Energy conservation, Heat exchangers, Cooling systems, Heat, Flat heat pipes, Server racks, Air conditioning, Condensation
Proceedings Papers

Advanced Integrated Cooling Systems for Thermal Management in Data Centers

Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 619-624, July 19–23, 2009
Paper No: InterPACK2009-89009
https://doi.org/10.1115/InterPACK2009-89009
View Paper titled, Advanced Integrated Cooling Systems for Thermal Management in Data Centers
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Topics: Cooling systems, Data centers, Thermal management, Server racks, Heat pipes, Cables, Fluids, Heat exchangers, Heat sinks, Nanofluids
Proceedings Papers

A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids

Kyu Hyung Do, Byung Il Choi, Yong Shik Han, Seok Pil Jang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 83-90, July 19–23, 2009
Paper No: InterPACK2009-89138
https://doi.org/10.1115/InterPACK2009-89138
View Paper titled, A Theoretical Model for a Flat Micro Heat Pipe With a Grooved Wick Using Nanofluids
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Topics: Heat pipes, Nanofluids, Coating processes, Coatings, Condensation, Evaporation, Fluids, Heat conduction, Heat transfer, Nanoparticles
Proceedings Papers

Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Yogen Utturkar, Mehmet Arik, Tunc Icoz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 973-984, July 19–23, 2009
Paper No: InterPACK2009-89322
https://doi.org/10.1115/InterPACK2009-89322
View Paper titled, Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics
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Topics: Design, Electronics, Heat sinks, Cooling, Air jets, Computer simulation, Condensation, Dynamics (Mechanics), Electronic systems, Energy dissipation
Proceedings Papers

Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures

Xi Wang, Ali Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 293-296, July 19–23, 2009
Paper No: InterPACK2009-89084
https://doi.org/10.1115/InterPACK2009-89084
View Paper titled, Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures
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Topics: MOSFET transistors, Temperature, Thermal characterization, Temperature distribution, Gates (Closures), Design, Electrons, Flow (Dynamics), Heat, Phonons
Proceedings Papers

Enhancement of Condensation Heat Transfer in Micro Systems

Atsushi Tokunaga, Gyoko Nagayama, Takaharu Tsuruta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 599-605, July 19–23, 2009
Paper No: InterPACK2009-89234
https://doi.org/10.1115/InterPACK2009-89234
View Paper titled, Enhancement of Condensation Heat Transfer in Micro Systems
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Topics: Condensation, Heat transfer, Microelectromechanical systems, Thermal management, Computers, Condensers (steam plant), Cooling, Cooling systems, Electronic components, Electronics
Proceedings Papers

Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 665-671, July 19–23, 2009
Paper No: InterPACK2009-89115
https://doi.org/10.1115/InterPACK2009-89115
View Paper titled, Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment
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Topics: Condensation, Gallium arsenide, Lasers
Proceedings Papers

A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe

H. B. Ma, B. Borgmeyer, P. Cheng, Y. Zhang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 669-676, July 8–12, 2007
Paper No: IPACK2007-33246
https://doi.org/10.1115/IPACK2007-33246
View Paper titled, A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe
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Topics: Heat pipes, Heat transfer, Evaporation, Temperature, Condensers (steam plant), Vapors, Bubbles, Bulk modulus, Condensation, Excitation
Proceedings Papers

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

M. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1271-1276, July 17–22, 2005
Paper No: IPACK2005-73353
https://doi.org/10.1115/IPACK2005-73353
View Paper titled, Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias
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Topics: Printed circuit boards, Steady state, Temperature, Failure, Condensation, Density, Electronic packaging, High temperature, Microelectronic packaging, Optical microscopy
Proceedings Papers

Boiling of Enhanced Surfaces at High Heat Fluxes in a Small Boiler

Liang-Han Chien, C.-W. Chen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 655-662, July 17–22, 2005
Paper No: IPACK2005-73457
https://doi.org/10.1115/IPACK2005-73457
View Paper titled, Boiling of Enhanced Surfaces at High Heat Fluxes in a Small Boiler
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Topics: Boilers, Boiling, Condensation, Cooling, Evaporation, Flux (Metallurgy), Heat, Thermal resistance
Proceedings Papers

Thermal Characters of Mesh Structure in a Flat Heat Pipe

Liang-Han Chien, Y.-C. Shih
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 325-333, July 6–11, 2003
Paper No: IPACK2003-35095
https://doi.org/10.1115/IPACK2003-35095
View Paper titled, Thermal Characters of Mesh Structure in a Flat Heat Pipe
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Topics: Flat heat pipes, Heat pipes, Thermal resistance, Condensation, Evaporation, Water, Computer cooling, Condensers (steam plant), Copper, Fluids