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Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021

Paper No: IPACK2021-73252

DOI: https://doi.org/10.1115/IPACK2021-73252

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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux

Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021

Paper No: IPACK2021-66842

DOI: https://doi.org/10.1115/IPACK2021-66842

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Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry

Proceedings Papers

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

Marta Kuczynska, Ulrich Becker, Youssef Maniar, Steffen Weihe

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 26–28, 2021

Paper No: IPACK2021-73319

DOI: https://doi.org/10.1115/IPACK2021-73319

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Topics: Computer simulation, Finite element analysis, Recrystallization, Simulation, Solders, Stress, Tin

Proceedings Papers

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019

Paper No: IPACK2019-6356

DOI: https://doi.org/10.1115/IPACK2019-6356

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Topics: Additive manufacturing, Computer simulation, Hardening (Curing), Lasers, Numerical analysis, Photons, Polymerization, Resins, Manufacturing, Nanoscale phenomena

Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019

Paper No: IPACK2019-6514

DOI: https://doi.org/10.1115/IPACK2019-6514

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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption

Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018

Paper No: IPACK2018-8448

DOI: https://doi.org/10.1115/IPACK2018-8448

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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design

Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018

Paper No: IPACK2018-8311

DOI: https://doi.org/10.1115/IPACK2018-8311

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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields

Proceedings Papers

Thermal Characterization of Si BEOL Microelectronic Structures

Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018

Paper No: IPACK2018-8350

DOI: https://doi.org/10.1115/IPACK2018-8350

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Topics: Computer simulation, Design, Dimensions, Heat sinks, Operating temperature, Reliability, Resistors, Temperature, Thermal characterization, Thermal properties

Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018

Paper No: IPACK2018-8279

DOI: https://doi.org/10.1115/IPACK2018-8279

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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation

Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017

Paper No: IPACK2017-74222

DOI: https://doi.org/10.1115/IPACK2017-74222

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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride

Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati D. Athavale, Yogendra Joshi, Minami Yoda

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017

Paper No: IPACK2017-74108

DOI: https://doi.org/10.1115/IPACK2017-74108

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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning

Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Paper No: IPACK2017-74059

DOI: https://doi.org/10.1115/IPACK2017-74059

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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons

Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki

Paper No: IPACK2017-74092

DOI: https://doi.org/10.1115/IPACK2017-74092

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Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation

Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017

Paper No: IPACK2017-74158

DOI: https://doi.org/10.1115/IPACK2017-74158

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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics

Proceedings Papers

Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Min Pei, Guru Arakere, Milena Vujosevic

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, August 29–September 1, 2017

Paper No: IPACK2017-74082

DOI: https://doi.org/10.1115/IPACK2017-74082

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Topics: Ball-Grid-Array packaging, Shock (Mechanics), Failure, Physics, Computer simulation, Deformation, Design, Stress

Proceedings Papers

Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Takahiro Kinoshita, Takashi Kawakami, Tadaharu Adachi, Masahiro Funaki

Paper No: IPACK2017-74099

DOI: https://doi.org/10.1115/IPACK2017-74099

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Topics: Capacitors, Ceramics, Design, Stress, Finite element methods, Computer simulation, Pressure

Proceedings Papers

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017

Paper No: IPACK2017-74195

DOI: https://doi.org/10.1115/IPACK2017-74195

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Topics: Light-emitting diodes, Phosphors, Shapes, Geometry, Coating processes, Coatings, Computer simulation, Fluids, Temperature

Proceedings Papers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

Paper No: IPACK2017-74129

DOI: https://doi.org/10.1115/IPACK2017-74129

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Topics: Mechanical properties, Network models, Particulate matter, Thermal conductivity, Brittleness, Computer simulation, Elastic moduli, Heat, Heat sinks, Particle size

Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017

Paper No: IPACK2017-74244

DOI: https://doi.org/10.1115/IPACK2017-74244

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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity

Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Ru Han, Milena Vujosevic, Min Pei

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A038, July 6–9, 2015

Paper No: IPACK2015-48578

DOI: https://doi.org/10.1115/IPACK2015-48578

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Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage

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NARROW

Transient Performance and Melt Front Characterization of Phase Change Materials

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Thermal Characterization of Si BEOL Microelectronic Structures

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Optimization of Graphite Composite Latent Heat Storage Systems

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

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