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Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015

Paper No: IPACK2015-48019

DOI: https://doi.org/10.1115/IPACK2015-48019

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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis

Proceedings Papers

Cooling of a Many-Core Multiprocessor: Experimental Results for OLTP Workloads

Krishnamachar Sreenivasan

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A048, July 16–18, 2013

Paper No: IPACK2013-73265

DOI: https://doi.org/10.1115/IPACK2013-73265

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Topics: Anisotropy, Clocks, Control equipment, Cooling, Differential equations, Flow (Dynamics), Heat, Heat conduction, Slabs, Storage

Proceedings Papers

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Zhimin Wan, Yogendra Joshi

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013

Paper No: IPACK2013-73080

DOI: https://doi.org/10.1115/IPACK2013-73080

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Topics: Cooling, Heat flux, Microfluidics, Modeling, Transients (Dynamics), Flow (Dynamics), Computational fluid dynamics, Heat transfer, Signals, Temperature

Proceedings Papers

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 111-118, July 19–23, 2009

Paper No: InterPACK2009-89188

DOI: https://doi.org/10.1115/InterPACK2009-89188

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Topics: Clocks, Computer simulation, Computers, Control equipment, Junctions, Pareto optimization, Product reliability, Temperature, Temperature gradient

Proceedings Papers

Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki, Masaru Ishizuka

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 135-141, July 19–23, 2009

Paper No: InterPACK2009-89156

DOI: https://doi.org/10.1115/InterPACK2009-89156

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Topics: Simulation, Relaxation (Physics), Heat, Electromagnetic scattering, Energy conservation, Momentum, Radiation scattering, Scattering (Physics), Semiconductor devices, Approximation

Proceedings Papers

Dual Die Package Design Strategy and Performance

Mahadevan Suryakumar, Lu-Vong T. Phan, Mathew Ma, Wajahat Ahmed

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1045-1051, July 17–22, 2005

Paper No: IPACK2005-73391

DOI: https://doi.org/10.1115/IPACK2005-73391

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Topics: Design, Leakage, Clocks, Cycles, Energy efficiency, Packaging

Proceedings Papers

DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII

Bryan Hsieh, Kevin Chiang, Y. P. Wang, C. S. Hsiao

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1063-1068, July 17–22, 2005

Paper No: IPACK2005-73200

DOI: https://doi.org/10.1115/IPACK2005-73200

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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Clocks, Density, Electronics, Laptop computers, Manufacturing, Noise (Sound), Packaging, Signals

Proceedings Papers

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 431-437, July 17–22, 2005

Paper No: IPACK2005-73286

DOI: https://doi.org/10.1115/IPACK2005-73286

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Topics: Cooling, Heat pipes, Heat sinks, Laptop computers, Vapors, Energy dissipation, Heat, Clocks, Design, Heat flux

Proceedings Papers

Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance

J. C. Matayabas, Jr., Vassou LeBonheur

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1869-1873, July 17–22, 2005

Paper No: IPACK2005-73372

DOI: https://doi.org/10.1115/IPACK2005-73372

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Topics: Energy dissipation, Heat, Reliability, Silicones, Stress, Thermomechanics, Flat heat pipes, Packaging, Accelerated life testing, Clocks

Proceedings Papers

Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 675-682, July 17–22, 2005

Paper No: IPACK2005-73486

DOI: https://doi.org/10.1115/IPACK2005-73486

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Topics: Optimization, Design, Heat flux, Clocks, Energy dissipation, Finite element analysis, Finite element methods, Finite element model, Junctions, Separation (Technology)

Proceedings Papers

Thermal Management for Chip-Scale Atomic Clocks

Alexander Laws, Richard Y. J. Chang, Victor M. Bright, Y. C. Lee

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 741-745, July 17–22, 2005

Paper No: IPACK2005-73444

DOI: https://doi.org/10.1115/IPACK2005-73444

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Topics: Atomic clocks, Thermal management, Temperature, Switches, Clocks, Design, Energy dissipation, Vehicles, Waste heat, Cavities

Proceedings Papers

Electrical Simulation Design Technology of Silicon Through Substrate

Takamasa Takano, Masataka Yamaguchi, Koichi Nakayama, Tomoko Maruyama, Shigeki Chujyo, Satoru Kuramochi, Yoshitaka Fukuoka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 999-1004, July 17–22, 2005

Paper No: IPACK2005-73339

DOI: https://doi.org/10.1115/IPACK2005-73339

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Topics: Design, Silicon, Simulation, Packaging, System-in-package, Transmission lines, Cables, Circuits, Clocks, Delays

Proceedings Papers

Thermal Interface Material Technology Advancements and Challenges: An Overview

Ashay Dani, James C. Matayabas, Jr., Paul Koning

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 511-516, July 17–22, 2005

Paper No: IPACK2005-73384

DOI: https://doi.org/10.1115/IPACK2005-73384

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Topics: Clocks, Design, Energy dissipation, Flip-chip, Flip-chip devices, Heat, Materials science, Packaging, Phase change materials, Polymers

Proceedings Papers

Source Synchronous Double Data Rate (DDR) Parallel Optical Interconnects

Ping Gui, Fouad Kiamilev, Xiaoqing Wang, Michael McFadden, Charlie Kuznia, Jeremy Ekman, Joseph Deroba, Michael Haney

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 655-663, July 6–11, 2003

Paper No: IPACK2003-35202

DOI: https://doi.org/10.1115/IPACK2003-35202

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Topics: Optical interconnections, Clocks, Vacuum, Bonding, Cavities, Circuits, Complementary metal oxide semiconductors, Design, Fibers, Flip-chip

NARROW

Hot Spot Elimination by Thin and Smart Heat Spreader

Cooling of a Many-Core Multiprocessor: Experimental Results for OLTP Workloads

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

Dual Die Package Design Strategy and Performance

DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance

Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Thermal Management for Chip-Scale Atomic Clocks

Electrical Simulation Design Technology of Silicon Through Substrate

Thermal Interface Material Technology Advancements and Challenges: An Overview

Source Synchronous Double Data Rate (DDR) Parallel Optical Interconnects

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