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Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Paper No: IPACK2019-6461
https://doi.org/10.1115/IPACK2019-6461
View Paper titled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Paper No: IPACK2019-6372
https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 27–30, 2018
Paper No: IPACK2018-8219
https://doi.org/10.1115/IPACK2018-8219
View Paper titled, Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide
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Topics: Calibration, Design, Sensors, Silicon, Stress, Resistors, Temperature, Aerospace systems, Drilling, Geothermal power stations
Proceedings Papers

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A002, July 6–9, 2015
Paper No: IPACK2015-48491
https://doi.org/10.1115/IPACK2015-48491
View Paper titled, Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach
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Topics: Biomedicine, Hydrogen, Electrodes, Oxidation, Blood, Calibration, Chemistry, Diseases, Plasma desorption mass spectrometry, Plasmas (Ionized gases)
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Paper No: IPACK2015-48175
https://doi.org/10.1115/IPACK2015-48175
View Paper titled, A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection
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Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

Creating a Calibrated CFD Model of a Midsize Data Center

Zachary M. Pardey, James W. VanGilder, Christopher M. Healey, David W. Plamondon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A029, July 6–9, 2015
Paper No: IPACK2015-48448
https://doi.org/10.1115/IPACK2015-48448
View Paper titled, Creating a Calibrated CFD Model of a Midsize Data Center
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Topics: Computational fluid dynamics, Data centers, Modeling, Tiles, Air flow, Boundary-value problems, Calibration, Change management, Design, Flow (Dynamics)
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Paper No: IPACK2013-73214
https://doi.org/10.1115/IPACK2013-73214
View Paper titled, Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 451-464, July 8–12, 2007
Paper No: IPACK2007-33053
https://doi.org/10.1115/IPACK2007-33053
View Paper titled, Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C
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Topics: Silicon, Stress, Temperature, Sensors, Anisotropy, Calibration, Chemical etching, Electrical resistivity, Electron mobility, Engineering simulation
Proceedings Papers

Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method

T. E. Wong, C. Chu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 359-364, July 8–12, 2007
Paper No: IPACK2007-33247
https://doi.org/10.1115/IPACK2007-33247
View Paper titled, Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method
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Topics: Fatigue, Fatigue life, Solder joints, Solders, Electronic packages, Manufacturing, Calibration, Ceramics, Design, Equilibrium (Physics)
Proceedings Papers

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Yonggang Chen, Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 285-295, July 8–12, 2007
Paper No: IPACK2007-33569
https://doi.org/10.1115/IPACK2007-33569
View Paper titled, High Resolution Die Stress Mapping Using Arrays of CMOS Sensors
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Topics: Complementary metal oxide semiconductors, Resolution (Optics), Sensors, Stress, Integrated circuits, Calibration, Cavities, Finite element analysis, Mirrors, Shear stress
Proceedings Papers

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, M. Kaysar Rahim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 297-307, July 8–12, 2007
Paper No: IPACK2007-33570
https://doi.org/10.1115/IPACK2007-33570
View Paper titled, Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon
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Topics: Calibration, Hydrostatics, Silicon, Stress, Sensors, Temperature, Pressure, Electrical resistivity, Experimental methods, Manufacturing
Proceedings Papers

Application of Exploratory Data Analysis (EDA) Techniques to Temperature Data in a Conventional Data Center

Ratnesh Sharma, Rocky Shih, Chandrakant Patel, John Sontag
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 851-857, July 8–12, 2007
Paper No: IPACK2007-33700
https://doi.org/10.1115/IPACK2007-33700
View Paper titled, Application of Exploratory Data Analysis (EDA) Techniques to Temperature Data in a Conventional Data Center
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Topics: Data centers, Temperature, Cooling, Thermal management, Density, Energy consumption, Sensors, Surges, Air flow, Calibration
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Paper No: IPACK2005-73196
https://doi.org/10.1115/IPACK2005-73196
View Paper titled, Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning
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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration
Proceedings Papers

Realization of Ultra-Wideband, High-Resolution TDR for Chip-Carrier Packages

Dong-Ho Han, Bao-Shu Xu, Myoung J. Choi, Jiangqi He, Scott Gardiner, Cliff Lee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1499-1503, July 17–22, 2005
Paper No: IPACK2005-73291
https://doi.org/10.1115/IPACK2005-73291
View Paper titled, Realization of Ultra-Wideband, High-Resolution TDR for Chip-Carrier Packages
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Topics: Resolution (Optics), Transmission lines, Ball-Grid-Array packaging, Calibration, Hardware, Reflection, Signals, Stress, Testing
Proceedings Papers

On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques

Sandeep Sane, Shalabh Tandon, Biju Chandran, Tsgereda Alazar, Leonard R. Sorenson
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 965-969, July 17–22, 2005
Paper No: IPACK2005-73306
https://doi.org/10.1115/IPACK2005-73306
View Paper titled, On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques
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Topics: Shear (Mechanics), Silicon, Manufacturing, Failure mechanisms, Stress, Failure, Reliability, Calibration, Delays, Failure analysis
Proceedings Papers

A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

Richard C. Jaeger, Jeffrey C. Suhling, Yonggang Chen, Shahan Rahaman, M. Nokibul Islam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 845-851, July 6–11, 2003
Paper No: IPACK2003-35276
https://doi.org/10.1115/IPACK2003-35276
View Paper titled, A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die
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Topics: Calibration, Sensors, Stress, Semiconductor wafers, Strips, Design, Dimensions, Finite element analysis, Geometry, Integrated circuit fabrication
Proceedings Papers

Calibration Systems and Techniques for Automated Microassembly

K. Tsui, A. Geisberger, M. Ellis, G. Skidmore
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 251-255, July 6–11, 2003
Paper No: IPACK2003-35208
https://doi.org/10.1115/IPACK2003-35208
View Paper titled, Calibration Systems and Techniques for Automated Microassembly
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Topics: Calibration, Microassembling, Manufacturing, Crystals, End effectors, Geometry, Microelectromechanical systems, Nickel, Robotics, Silicon