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Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6461
https://doi.org/10.1115/IPACK2019-6461
View Paper titled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A060, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48770
https://doi.org/10.1115/IPACK2015-48770
View Paper titled, Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources
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Topics: Flow (Dynamics), Heat, Porous materials, Vapors, Cooling, Heat transfer, Approximation, Capillarity, Computational fluid dynamics, Design
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48641
https://doi.org/10.1115/IPACK2015-48641
View Paper titled, Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples
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Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs
Proceedings Papers

A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems

Feng Sheng, Dan Jiao
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73177
https://doi.org/10.1115/IPACK2013-73177
View Paper titled, A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems
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Topics: Finite element analysis, Design, Finite element methods, Algorithms, Approximation, Errors, Frequency-domain analysis, Integrated circuits, Linear systems, Modeling
Proceedings Papers

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

Sami A. Alkharabsheh, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73216
https://doi.org/10.1115/IPACK2013-73216
View Paper titled, Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center
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Topics: Containment, Data centers, Flow (Dynamics), Leakage, Temperature, Containment systems, Air flow, Approximation, Buoyancy, Computational fluid dynamics
Proceedings Papers

Efficient Implementation of Potential-Flow Airflow Prediction for Data Centers

Christopher M. Healey, James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73075
https://doi.org/10.1115/IPACK2013-73075
View Paper titled, Efficient Implementation of Potential-Flow Airflow Prediction for Data Centers
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Topics: Air flow, Data centers, Flow (Dynamics), Approximation, Mesh generation, Physics
Proceedings Papers

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73217
https://doi.org/10.1115/IPACK2013-73217
View Paper titled, A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers
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Topics: Data centers, Steady state, Flow (Dynamics), Temperature, Buoyancy, Dynamic models, Energy dissipation, Failure, Air flow, Approximation
Proceedings Papers

A Numerical Technique for the Approximation of Thermal Zones

Vanessa Lo´pez, Hendrik F. Hamann
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 637-644, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52213
https://doi.org/10.1115/IPACK2011-52213
View Paper titled, A Numerical Technique for the Approximation of Thermal Zones
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Topics: Air conditioning, Approximation, Boundary-value problems, Convection, Cooling systems, Data centers, Numerical analysis
Proceedings Papers

Spectral Detail of Phonon Conduction and Scattering in Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 329-343, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52243
https://doi.org/10.1115/IPACK2011-52243
View Paper titled, Spectral Detail of Phonon Conduction and Scattering in Graphene
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Topics: Electromagnetic scattering, Graphene, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Thermal conductivity, Probability, Algorithms, Approximation
Proceedings Papers

Frequency Resolved Phonon Transport in Si/Ge Nanocomposites

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 757-768, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52244
https://doi.org/10.1115/IPACK2011-52244
View Paper titled, Frequency Resolved Phonon Transport in Si/Ge Nanocomposites
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Topics: Nanocomposites, Phonons, Thermal conductivity, Mean free path, Acoustics, Approximation, Density, Electromagnetic scattering, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

Bo Dan, Sasanka Kanuparthi, Ganesh Subbarayan, Bahgat G. Sammakia
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 69-81, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89116
https://doi.org/10.1115/InterPACK2009-89116
View Paper titled, An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
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Topics: Network models, Particulate matter, Thermal conductivity, Approximation, Dimensions, Finite element model, Engineering simulation, Fillers (Materials), Simulation, Temperature distribution
Proceedings Papers

Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki, Masaru Ishizuka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 135-141, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89156
https://doi.org/10.1115/InterPACK2009-89156
View Paper titled, Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices
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Topics: Simulation, Relaxation (Physics), Heat, Electromagnetic scattering, Energy conservation, Momentum, Radiation scattering, Scattering (Physics), Semiconductor devices, Approximation
Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89178
https://doi.org/10.1115/InterPACK2009-89178
View Paper titled, Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects
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Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation
Proceedings Papers

Numerical Model for Thermal Transport in 3-D Nanotube Composites

Satish Kumar, Jayathi Y. Murthy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 773-781, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33296
https://doi.org/10.1115/IPACK2007-33296
View Paper titled, Numerical Model for Thermal Transport in 3-D Nanotube Composites
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Topics: Composite materials, Computer simulation, Nanotubes, Nanocomposites, Thermal conductivity, Carbon nanotubes, Approximation, Density, Disperse systems, Heat conduction
Proceedings Papers

Server-Rack Air Flow and Heat Transfer Interactions in Data Centers

S. P. Tan, K. C. Toh, Y. W. Wong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 845-849, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33672
https://doi.org/10.1115/IPACK2007-33672
View Paper titled, Server-Rack Air Flow and Heat Transfer Interactions in Data Centers
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Topics: Air flow, Data centers, Heat transfer, Server racks, Flow (Dynamics), Pressure, Modeling, Temperature, Approximation, Design
Proceedings Papers

The Adiabatic Conditions on Inner Boundary for Natural Convection With Porous Medium in a Narrow Horizontal Cylindrical Annulus

Kamyar Mansour
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 129-134, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33086
https://doi.org/10.1115/IPACK2007-33086
View Paper titled, The Adiabatic Conditions on Inner Boundary for Natural Convection With Porous Medium in a Narrow Horizontal Cylindrical Annulus
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Topics: Annulus, Natural convection, Porous materials, Approximation, Computation, Rayleigh number, Temperature
Proceedings Papers

Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models

Shankar Ganapathysubramanian, Sandeep Sane, Richard Raymond Dimagiba, Biju I. Chandran
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1523-1528, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73401
https://doi.org/10.1115/IPACK2005-73401
View Paper titled, Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models
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Topics: Approximation, Computer simulation, Elastic analysis, Electronic packaging, Flip-chip, Manufacturing, Modeling, Packaging, Polymers, Risk assessment
Proceedings Papers

Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept

Russell D. Whitenack, Chandra S. Desai
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 595-604, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35352
https://doi.org/10.1115/IPACK2003-35352
View Paper titled, Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept
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Topics: Event history analysis, Failure, Cycles, Approximation, Computers, Design, Electronic packaging, Finite element analysis, Modeling, Reliability
Proceedings Papers

Compact Thermal Representations for Several Fundamental Shapes in Forced Convection

Kyle A. Brucker, Kyle T. Ressler, Joseph Majdalani
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 431-437, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35218
https://doi.org/10.1115/IPACK2003-35218
View Paper titled, Compact Thermal Representations for Several Fundamental Shapes in Forced Convection
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Topics: Forced convection, Shapes, Heat sinks, Thermal conductivity, Fluids, Thermal resistance, Approximation, Computer simulation, Cooling, Electronic packages
Proceedings Papers

Compact Thermal Representations for Several Fundamental Shapes in Natural Convection

Kyle A. Brucker, Kyle T. Ressler, Joseph Majdalani
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 439-448, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35219
https://doi.org/10.1115/IPACK2003-35219
View Paper titled, Compact Thermal Representations for Several Fundamental Shapes in Natural Convection
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Topics: Natural convection, Shapes, Heat sinks, Thermal conductivity, Approximation, Fluids, Design, Engineers, Fins, Optimization