ATCA is a new form factor for communication equipment applications. Finite element model (FEM) was created to predict the dynamic response of an ATCA design during a table drop shock. The model was built with 2nd order brick elements for minimizing the meshing sensitivity. Modal method was used and followed by dynamic transient analysis with superposition approach and validated by comparing the modal test data for matching the natural frequencies and the modal shapes. The model was further validated by comparing the board displacement with direct displacement measurement using a high speed camera. As a result the localized board strain predictions matched the measured board strain at each networking processor unit. The validated model was used to predict the risk areas for solder joints, which later proved to be accurate during board design verification tests. This paper presents the modeling and model validation processes, as well as the ATCA mechanical design evaluations.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Mechanical Shock FE Modeling for ATCA Circuit Board Design
Frank Z. Liang,
Frank Z. Liang
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
Larry M. Palanuk,
Larry M. Palanuk
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
Wade Hezeltine
Wade Hezeltine
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
Frank Z. Liang
Intel Corporation, Hillsboro, OR
Larry M. Palanuk
Intel Corporation, Hillsboro, OR
Wade Hezeltine
Intel Corporation, Hillsboro, OR
Paper No:
IPACK2005-73274, pp. 1487-1492; 6 pages
Published Online:
March 4, 2009
Citation
Liang, FZ, Palanuk, LM, & Hezeltine, W. "Mechanical Shock FE Modeling for ATCA Circuit Board Design." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1487-1492. ASME. https://doi.org/10.1115/IPACK2005-73274
Download citation file:
8
Views
Related Proceedings Papers
Related Articles
Validation of Electronic Package Reliability Using Speckle Interferometry
J. Electron. Packag (September,2002)
A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices
Appl. Mech. Rev (March,2011)
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
J. Electron. Packag (December,2007)
Related Chapters
Achievements, Challenges, and Opportunities
Computer Vision for Structural Dynamics and Health Monitoring
The ServoTeach Module
Precision Programming of Roving Robots: Project-Based Fundamentals of Wheeled, Legged and Hybrid Mobile Robots
LARGE STANDOFF MAGNETOMETRY TECHNOLOGY ADVANCES TO ASSESS PIPELINE INTEGRITY UNDER GEOHAZARD CONDITIONS AND APPROACHES TO UTILISATION OF IT
Pipeline Integrity Management Under Geohazard Conditions (PIMG)