Abstract
Networking and computing dependency has been increasing in the modern world, thus, boosting the growth of data centers in leading business domains like banking, education, transportation, social media etc. Data center is a facility that incorporates an organization’s IT operations and equipment, as well as where it stores, processes and manages the data. To fulfill the increasing demands of data storage and data processing, a corresponding increase in server performance is needed. This causes a subsequent increment in power consumption and heat generation in the servers due to high performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling high packaging densities. Therefore, industries are looking for single-phase immersion cooling using various dielectric fluids to reduce the operational and cooling costs by enhancing the thermal management of servers. This research work aims at increasing the rack density by reducing the form factor of a 3rd Generation Open Compute Server using single-phase immersion cooling. A computational study is conducted in the operational range of temperatures and the thermal efficiency is optimized. A parametric study is conducted by changing the inlet velocities and inlet temperatures of cooling liquid for different heights of the open compute 3rd generation server. A comparative study is then carried out for white mineral oil and synthetic fluid (EC100).
