This paper presents the multi-objective optimization of cost-effective pinfin heatsinks. Heat transfer rate and pressure drop were the objective functions, and four parameters (height, diameter, longitudinal pitch, and transverse pitch) were the design variables. The relationship between the objective functions and the design variables for pinfin heatsink was calculated by using our own empirical equations using the aspect ratio and the minimum gap considering cost-effectiveness and manufacturability. Non-dominated solutions to the objective functions were illustrated, and we derived the design rules for design variables. We found the similarity of the optimum trade-off curves between the heat transfer rate and the pressure drop if the multiplication of the height and the minimum gap were the same for the different constraints. We validated our calculated solutions by comparing them with experimental results and attained reasonable agreement between the calculation and experiment.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5576-8
PROCEEDINGS PAPER
Design of Cost-Effective Water-Cooled Pinfin Heatsinks
Keisuke Horiuchi,
Keisuke Horiuchi
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
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Atsuo Nishihara,
Atsuo Nishihara
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
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Kazuyuki Sugimura
Kazuyuki Sugimura
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
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Keisuke Horiuchi
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
Atsuo Nishihara
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
Kazuyuki Sugimura
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
Paper No:
IPACK2013-73194, V002T08A041; 7 pages
Published Online:
January 20, 2014
Citation
Horiuchi, K, Nishihara, A, & Sugimura, K. "Design of Cost-Effective Water-Cooled Pinfin Heatsinks." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. Burlingame, California, USA. July 16–18, 2013. V002T08A041. ASME. https://doi.org/10.1115/IPACK2013-73194
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