Army programs have focused on increasing the use of power-dense electronic components to improve system weight, fuel usage, design flexibility, and overall functionality, thus, stressing the thermal management requirements. Recent cooling designs focused on flowing 80–100 °C engine coolant through single-phase microchannel cold plates but concern over pumping power, heat dissipation, cold plate temperature inconsistency, and contaminate clogging have prompted interest in two-phase flow in a minichannel cold plate. In the course of this study, both single- and two-phase experiments were conducted with a 6.8 × 2.7 × 0.9 cm offset fin minichannel cold plate using 25 °C, 80 °C, and 99 °C de-mineralized water, respectively, with flowrates ranging from 0.33 cm3/s to 45 cm3/s. Heat dissipation using solder attached chip resistors was incrementally increased from 0 W to more than 1000 W while simultaneously measuring cold plate pressure drop, chip surface temperature, inlet and outlet fluid temperature, and flowrate. Preliminary results indicate that utilizing a minichannel cold plate with two-phase heat transfer offers the ability to significantly reduce clogging potential, flowrate, and associated pumping power, while improving thermal resistivity by more than a factor of 4 and temperature consistency by greater than a factor of 10. Single- and two-phase correlations were used to compare performance with theoretical values.
- Electronic and Photonic Packaging Division
Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics
Sharar, DJ, Morgan, B, Jankowski, NR, & Bar-Cohen, A. "Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2. Portland, Oregon, USA. July 6–8, 2011. pp. 133-142. ASME. https://doi.org/10.1115/IPACK2011-52079
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