Effective packaging of MEMS devices has lagged the development of unique sensors suitable for a variety of applications. Packaging challenges are often what prevent wider application and extensive commercialization of MEMS Sensors. MEMS devices are designed for sensing the environment. Their detection capability should not be adversely impacted by the package and the package reliability should not be compromised by the environment. Two different Sensor applications are used to highlight the packaging challenges. In one case the Sensor electrical output response was becoming nonlinear in the range of valid operating temperatures after packaging. The ASIC controller was not able to compensate for this nonlinearity. In the second application package design caused electrical response resonance within the operating environment range. Advanced package design methodology was developed to couple simulations for package reliability prediction for different failure modes with Sensor performance predictions to deliver cost effective and reliable packages. The predictive design methodology was extensively validated with experimental results at every stage.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors
Vijay Sarihan,
Vijay Sarihan
Freescale Semiconductor, Tempe, AZ
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Gary Li
Gary Li
Freescale Semiconductor, Tempe, AZ
Search for other works by this author on:
Vijay Sarihan
Freescale Semiconductor, Tempe, AZ
Jian Wen
Freescale Semiconductor, Tempe, AZ
Gary Li
Freescale Semiconductor, Tempe, AZ
Paper No:
InterPACK2009-89330, pp. 501-505; 5 pages
Published Online:
December 24, 2010
Citation
Sarihan, V, Wen, J, & Li, G. "Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 501-505. ASME. https://doi.org/10.1115/InterPACK2009-89330
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