The paper describes a novel approach for achieving enhanced energy efficiency for computer servers. The paper teaches a novel solid-state technique and apparatus for recycling waste heat from chip packages and turning that wasted energy into hot-spot cooling for other IC packages in the same server. This approach brings the combined advantages of enhanced energy efficiency while smoothing out the spatial and temporal thermal gradients, thereby yielding better long term reliability for multiple-chip enterprise servers.
- Electronic and Photonic Packaging Division
Hot Spot Cooling Using Recycled Energy
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Ouyang, C, Gross, K, & Heydari, A. "Hot Spot Cooling Using Recycled Energy." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 259-263. ASME. https://doi.org/10.1115/IPACK2007-33875
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