Pool boiling from a surface featuring micro-pyramidal re-entrant cavities (mouth size 40 μm) etched in silicon, on a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at one atmosphere. The heat sink is designed to eliminate spreading through the substrate, and back heat loss. Experimentation showed that the critical heat flux was 12.8 W/cm2. A high speed camera (400fps) was used to record and quantify the effect of heat flux on departure diameter and bubble emission frequency. Both departure diameter and frequency showed an increasing trend with heat flux. Comparison with existing literature are also presented.

Volume Subject Area:
Thermal Management
Keywords:
Pool boiling, re-entrant cavities, departure diameter, bubble emission frequency, immersion cooling, heat sinks, thermal management of electronics
Topics:
Bubbles, Cavities, Cooling, Critical heat flux, Electronics, Emissions, Fluids, Glass, Heat flux, Heat losses, Heat sinks, Heat transfer, Microelectronic devices, Pool boiling, Silicon, Thermal management
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Copyright © 2003
 by ASME
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