Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. In our research efforts, the mechanical responses of several different capillary flow snap cure underfill encapsulants are being characterized. A microscale tension-torsion testing machine has been used to evaluate the uniaxial tensile stress-strain behavior of underfill materials as a function of temperature, strain rate, specimen dimensions, humidity, thermal cycling exposure, etc. A critical step to achieving accurate experimental results has been the development of a sample preparation procedure that produces mechanical test specimens that reflect the properties of true underfill encapsulant layers. In the developed method, 75–125 μm (3–5 mil) thick underfill uniaxial tension specimens are dispensed and cured using production equipment and the same processing conditions as those used with actual flip chip assemblies. Although several underfills have been examined, this work features results for the mechanical response of a single typical capillary flow snap cure underfill. A three parameter hyperbolic tangent empirical model has been shown to provide accurate fits to the observed underfill nonlinear stress-strain behavior over a range of temperatures and strain rates. In addition, typical creep data are presented.
Skip Nav Destination
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Measurement of the Constitutive Behavior of Underfill Encapsulants
M. Saiful Islam,
M. Saiful Islam
Auburn University, Auburn, AL
Search for other works by this author on:
Jeffrey C. Suhling,
Jeffrey C. Suhling
Auburn University, Auburn, AL
Search for other works by this author on:
Pradeep Lall
Pradeep Lall
Auburn University, Auburn, AL
Search for other works by this author on:
M. Saiful Islam
Auburn University, Auburn, AL
Jeffrey C. Suhling
Auburn University, Auburn, AL
Pradeep Lall
Auburn University, Auburn, AL
Paper No:
IPACK2003-35321, pp. 923-931; 9 pages
Published Online:
January 5, 2009
Citation
Islam, MS, Suhling, JC, & Lall, P. "Measurement of the Constitutive Behavior of Underfill Encapsulants." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 923-931. ASME. https://doi.org/10.1115/IPACK2003-35321
Download citation file:
4
Views
Related Proceedings Papers
Related Articles
Mechanical Tests of Cellulose Acetate—III
Trans. ASME (July,1943)
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
J. Electron. Packag (March,2023)
An Experimental Investigation of Yield Surfaces and Loading Surfaces of Pure Aluminum With Stress-Controlled and Strain-Controlled Paths of Loading
J. Eng. Mater. Technol (October,1984)
Related Chapters
Basic Concepts
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range
Reliability of Electronic Packaging
Essentials of Electronic Packaging: A Multidisciplinary Approach
Axially Loaded Members
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range