Skip Nav Destination
Proceedings Papers
Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems
Thermal Management
Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
InterPACK 2013; V002T08A001https://doi.org/10.1115/IPACK2013-73028
Topics:
Cooling
,
Electronics
,
Microchannels
,
Computers
,
Water
,
Brazing
,
Cooling systems
,
Data centers
,
Collaboration
,
Design
Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement
InterPACK 2013; V002T08A002https://doi.org/10.1115/IPACK2013-73031
Topics:
Cooling
,
Design
,
Light-emitting diodes
Heat Transfer due to the Impingement of an Axisymmetric Synthetic Jet Emanating From a Circular Orifice: A Numerical Investigation of a Canonical Geometry
InterPACK 2013; V002T08A003https://doi.org/10.1115/IPACK2013-73033
Topics:
Geometry
,
Heat transfer
,
Flow (Dynamics)
,
Reynolds number
,
Suction
,
Actuators
,
Convection
,
Cooling
,
Cycles
,
Diffusion (Physics)
Novel Immersion Cooling Technique for a 3D Chip Stack
InterPACK 2013; V002T08A004https://doi.org/10.1115/IPACK2013-73039
Topics:
Cooling
,
Fluids
,
Electronics
,
Heat
,
Copper
,
Water
,
Convection
,
Energy dissipation
,
Heat conduction
,
Heat sinks
A Statistical Approach to Real-Time Updating and Automatic Scheduling of Physical Models
InterPACK 2013; V002T08A005https://doi.org/10.1115/IPACK2013-73042
Topics:
Air pollution
,
Computational fluid dynamics
,
Data centers
,
Economics
,
Energy consumption
,
Energy management
,
Modeling
,
Physics
,
Resolution (Optics)
,
Sensors
Thermal Transport Phenomenon in Circular Pipe Flow Using Different Nanofluids
InterPACK 2013; V002T08A006https://doi.org/10.1115/IPACK2013-73043
Topics:
Nanofluids
,
Pipe flow
,
Transport phenomena
,
Nanoparticles
,
Copper
,
Flow (Dynamics)
,
Heat transfer
,
Particulate matter
,
Reynolds number
,
Thermal properties
Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate
InterPACK 2013; V002T08A007https://doi.org/10.1115/IPACK2013-73050
Topics:
Compression
,
Lasers
,
Thermoreflectance
,
Electrons
,
Temperature
,
Computer simulation
,
Density
,
Reflectance
,
Thermal analysis
New Method for Evaluating Heat Transfer Material
InterPACK 2013; V002T08A008https://doi.org/10.1115/IPACK2013-73051
Topics:
Heat transfer
,
Pressure
,
Aluminum plate
,
Heat sinks
,
Thermal conductivity
,
Shapes
,
Flow (Dynamics)
,
Insulation
,
Machinery
,
Reliability
Steady and Transient Heat Transfer Analysis of the Microprocessor System Using One-Dimensional Thermal Network
InterPACK 2013; V002T08A009https://doi.org/10.1115/IPACK2013-73052
Topics:
Cooling
,
Heat
,
Heat conduction
,
Heat sinks
,
Silicon
,
Simulation
,
Steady state
,
Temperature
,
Thermal resistance
,
Transient heat transfer
Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration
InterPACK 2013; V002T08A010https://doi.org/10.1115/IPACK2013-73056
Topics:
Flow (Dynamics)
,
Heat pipes
,
Heat transfer
,
Fluids
,
Heat
,
Oscillations
,
Condensation
,
Evaporation
,
Glass
,
Visualization
Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel Flows
InterPACK 2013; V002T08A011https://doi.org/10.1115/IPACK2013-73057
Topics:
Microchannel flow
,
Resolution (Optics)
,
Particulate matter
,
Flow (Dynamics)
,
Transparency
,
Emissions
,
Excitation
,
Fluids
,
Geometry
,
Imaging
Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels
InterPACK 2013; V002T08A012https://doi.org/10.1115/IPACK2013-73058
Topics:
Heating
,
Microchannels
,
Two-phase flow
,
Heat sinks
,
Flow (Dynamics)
,
Heat
,
Flux (Metallurgy)
,
Heat flux
,
Boiling
,
Diluents
Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink
InterPACK 2013; V002T08A013https://doi.org/10.1115/IPACK2013-73063
Topics:
Heat sinks
,
Silicon
,
Flow (Dynamics)
,
Laminar flow
,
Design
,
Boundary-value problems
,
Cross-flow
,
Electronics
,
Heat flux
,
Heat transfer
Investigation on the Multiple Jet Impingement Heat Transfer Using Al2O3-Water Nanofluid
InterPACK 2013; V002T08A015https://doi.org/10.1115/IPACK2013-73072
Topics:
Heat transfer
,
Nanofluids
,
Water
,
Energy dissipation
,
Heat
,
Particulate matter
,
Electronic components
,
Jets
,
Computer cooling
,
Convection
Design of High Packing Fraction Thermoelectric Modules for High Heat Flux Cooling
InterPACK 2013; V002T08A016https://doi.org/10.1115/IPACK2013-73073
Topics:
Cooling
,
Design
,
Heat flux
,
Packing (Shipments)
,
Packings (Cushioning)
,
Heat
,
Coolers
,
Electric current
,
Flux (Metallurgy)
,
Heating
Development of Plate Heat Pipes for the Thermal Management of Power Electronics
InterPACK 2013; V002T08A017https://doi.org/10.1115/IPACK2013-73086
Topics:
Electronics
,
Heat pipes
,
Thermal management
,
MOSFET transistors
,
Cooling
,
Dimensions
,
Gates (Closures)
,
Heat transfer
,
Thermal resistance
,
Transistors
Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments
David H. Altman, Anurag Gupta, Thomas E. Dubrowski, Jr., Darin J. Sharar, Nicholas R. Jankowski, Mark T. North
InterPACK 2013; V002T08A018https://doi.org/10.1115/IPACK2013-73087
Topics:
Flat heat pipes
Basic Study on Transient Temperature Response of Papers in a Thermal Transfer Printer
Koichi Hirose, Takashi Fukue, Fumiya Nakagawa, Risa Ito, Tomoko Wauke, Hisashi Hoshino, Hirotoshi Terao
InterPACK 2013; V002T08A019https://doi.org/10.1115/IPACK2013-73088
Topics:
Temperature
,
Transients (Dynamics)
,
Printing
,
Contact resistance
,
Heat
,
Heating
,
Network analysis
,
Thermal papers
Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure
InterPACK 2013; V002T08A020https://doi.org/10.1115/IPACK2013-73089
Topics:
Cooling
,
Fans
,
Flow (Dynamics)
,
Pressure drop
,
Density
,
Packaging
,
Pressure
,
Design
,
Electronic equipment
Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
InterPACK 2013; V002T08A021https://doi.org/10.1115/IPACK2013-73090
Topics:
Design
,
Water
,
Heat
,
Stress
,
Cooling
,
Disks
,
Electronics
,
Flow (Dynamics)
,
Heat exchangers
,
Motor drives
A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
InterPACK 2013; V002T08A023https://doi.org/10.1115/IPACK2013-73104
Topics:
Electron emission
,
Failure analysis
,
Imaging
,
Thermoreflectance
,
Circuits
,
Emissions
,
Failure
,
Electrons
,
Silicon
,
Temperature
Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
InterPACK 2013; V002T08A024https://doi.org/10.1115/IPACK2013-73106
Topics:
Copper
,
Foams (Chemistry)
,
Evaporation
,
Computer cooling
,
Containers
,
Ethanol
,
Flux (Metallurgy)
,
Heat
,
Heat conduction
,
Heat pipes
Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance
InterPACK 2013; V002T08A025https://doi.org/10.1115/IPACK2013-73107
Topics:
Energy consumption
,
Forced convection
,
Fans
,
Heat sinks
,
Temperature
,
Cooling
,
Manufacturing
,
Data centers
,
Heat
,
Junctions
Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly
InterPACK 2013; V002T08A026https://doi.org/10.1115/IPACK2013-73108
Topics:
Forced convection
,
Heat sinks
,
Manufacturing
,
Pressure
,
Design
,
Screws
,
Computer simulation
,
Cooling
,
Microelectronic devices
,
Numerical analysis
Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink
H. Arthur Kariya, Daniel F. Hanks, Wayne L. Staats, Nicholas A. Roche, Martin Cleary, Teresa B. Peters, John G. Brisson, Evelyn N. Wang
InterPACK 2013; V002T08A027https://doi.org/10.1115/IPACK2013-73120
Topics:
Condensers (steam plant)
,
Heat pipes
,
Heat sinks
,
Heat
,
Design
,
Thermal resistance
,
Cooling
,
Data centers
,
Electronic packaging
,
Engineering prototypes
Effect of Fin Interruptions on Natural Convection Heat Transfer From a Rectangular Interrupted Single-Wall
InterPACK 2013; V002T08A029https://doi.org/10.1115/IPACK2013-73129
Topics:
Computer simulation
,
Computer software
,
Convection
,
Fins
,
Heat transfer
,
Manufacturing
,
Natural convection
,
Steady state
,
Vertical plates
,
Weight (Mass)
Experimental Study of the Convective Heat Transfer From a Geometrically Scaled Up 2D Impinging Synthetic Jet
InterPACK 2013; V002T08A030https://doi.org/10.1115/IPACK2013-73139
Topics:
Acoustics
,
Actuators
,
Air flow
,
Computer simulation
,
Convection
,
Cooling
,
Cycles
,
Flow (Dynamics)
,
Fluids
,
Geometry
Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink
InterPACK 2013; V002T08A031https://doi.org/10.1115/IPACK2013-73141
Correlation Between Behaviors of the Vapor Bubbles and the Characteristics of the Heat Transfer Over the Heated Surface on MEB
InterPACK 2013; V002T08A032https://doi.org/10.1115/IPACK2013-73153
Topics:
Bubbles
,
Heat transfer
,
Vapors
,
Wire
,
Collapse
,
Condensation
,
Emissions
,
Heat flux
,
Microbubbles
,
Pool boiling
A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel
InterPACK 2013; V002T08A033https://doi.org/10.1115/IPACK2013-73162
Topics:
Computational fluid dynamics
,
Dimensions
,
Engineering simulation
,
Flow (Dynamics)
,
Forced convection
,
Heat
,
Heat flux
,
Heat sinks
,
Heat transfer
,
Laminar flow
Impact of Material Properties on Cooling COP of Integrated Thermoelectric Microcoolers
InterPACK 2013; V002T08A036https://doi.org/10.1115/IPACK2013-73184
Topics:
Cooling
,
Materials properties
,
Microcoolers
,
Thermal conductivity
,
Compression
,
Cycles
,
Electrical conductivity
,
Energy consumption
,
Energy efficiency
,
Heat
A Flow Visualization Study on the Temperature Oscillations Inside a Loop Heat Pipe With Flat Evaporator
InterPACK 2013; V002T08A037https://doi.org/10.1115/IPACK2013-73185
Topics:
Flow visualization
,
Heat pipes
,
Oscillations
,
Temperature
,
Condensers (steam plant)
,
Heating
,
Vapors
,
Copper
,
Flow (Dynamics)
,
Fluids
Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot
InterPACK 2013; V002T08A038https://doi.org/10.1115/IPACK2013-73186
Topics:
Cooling
,
Germanium
,
Thermoelectric cooling
,
Transients (Dynamics)
Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass
InterPACK 2013; V002T08A039https://doi.org/10.1115/IPACK2013-73187
Topics:
Energy efficiency
,
Heat sinks
,
Optimization
,
Porous materials
,
Heat transfer
,
Porosity
,
Fluids
,
Density
,
Electrical conductivity
,
Energy consumption
Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity
InterPACK 2013; V002T08A040https://doi.org/10.1115/IPACK2013-73189
Topics:
Heat sinks
,
Porosity
,
Porous materials
,
Design
,
Heat exchangers
,
Design methodology
,
Fluids
,
Modeling
,
Pressure drop
,
Scaling laws (Mathematical physics)
Design of Cost-Effective Water-Cooled Pinfin Heatsinks
InterPACK 2013; V002T08A041https://doi.org/10.1115/IPACK2013-73194
Topics:
Design
,
Water
,
Heat transfer
,
Pressure drop
,
Optimization
,
Pareto optimization
,
Tradeoffs
Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes
InterPACK 2013; V002T08A042https://doi.org/10.1115/IPACK2013-73199
Topics:
Flow (Dynamics)
,
Heat transfer
A Hierarchical Framework for Thermal Modelling of Electronic Devices: From Atoms to Chips
InterPACK 2013; V002T08A043https://doi.org/10.1115/IPACK2013-73202
Topics:
Atoms
,
Modeling
,
Engineering simulation
,
Simulation
,
Thermal conductivity
,
Phonons
,
Physics
,
Silicon
,
Gates (Closures)
,
Lattice Boltzmann methods
Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow
InterPACK 2013; V002T08A044https://doi.org/10.1115/IPACK2013-73204
Topics:
Boiling
,
Flow (Dynamics)
,
Jets
,
Subcooling
,
Heat transfer coefficients
,
Heat transfer
,
Microchannels
,
Momentum
,
Wall temperature
,
Boundary layers
TIM Selection for an IGBT Cold Plate Using Experimental and Numerical Modeling
InterPACK 2013; V002T08A045https://doi.org/10.1115/IPACK2013-73207
Topics:
Computer simulation
,
Cooling
,
Fluids
,
Junctions
,
Temperature
,
Water
On the Thermal Management Challenges in Next Generation Handheld Devices
InterPACK 2013; V002T08A046https://doi.org/10.1115/IPACK2013-73237
Topics:
Thermal management
,
Cooling
,
Energy dissipation
,
Computers
,
Flat heat pipes
,
Laptop computers
,
Shells
,
Temperature
Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation
InterPACK 2013; V002T08A047https://doi.org/10.1115/IPACK2013-73262
Topics:
Aerospace industry
,
Design
,
Electronics
,
Fluids
,
Cooling
,
Computational fluid dynamics
,
Computer software
,
Pressure drop
,
Computers
,
Dimensions
Cooling of a Many-Core Multiprocessor: Experimental Results for OLTP Workloads
InterPACK 2013; V002T08A048https://doi.org/10.1115/IPACK2013-73265
Topics:
Anisotropy
,
Clocks
,
Control equipment
,
Cooling
,
Differential equations
,
Flow (Dynamics)
,
Heat
,
Heat conduction
,
Slabs
,
Storage
Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis
InterPACK 2013; V002T08A049https://doi.org/10.1115/IPACK2013-73273
Topics:
Heat
,
MOSFET transistors
,
Electrons
,
Temperature
,
Thermal energy
,
Thermal properties
,
Crystal lattices
,
Density
,
Electric fields
,
Electronics
Fabrication of Heat Pipes on an Acrylic Resin Board
InterPACK 2013; V002T08A050https://doi.org/10.1115/IPACK2013-73277
Topics:
Heat pipes
,
Manufacturing
,
Resins
,
Heat transfer
,
Electrical wires
,
Fluids
,
Thermal conductivity
,
Water
,
Condensers (steam plant)
,
Gravity (Force)
A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions
InterPACK 2013; V002T08A051https://doi.org/10.1115/IPACK2013-73283
Topics:
Capacitance
,
Electrodes
,
Junctions
,
Electric fields
,
Design
,
Sensors
,
Circuits
,
Dimensions
,
Fracture (Materials)
,
Network models
Improved Cooling of Electromagnetics by Directed Airflow
InterPACK 2013; V002T08A052https://doi.org/10.1115/IPACK2013-73286
Topics:
Air flow
,
Cooling
,
Electromagnetic force
,
Electromagnetism
,
Computational fluid dynamics
,
Testing
,
Shapes
,
Aircraft
,
Computer simulation
,
Dimensions
Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate
John Fernandes, Saeed Ghalambor, Akhil Docca, Chris Aldham, Dereje Agonafer, Evan Chenelly, Benson Chan, Michael Ellsworth, Jr.
InterPACK 2013; V002T08A053https://doi.org/10.1115/IPACK2013-73294
Topics:
Computational fluid dynamics
,
Cooling
,
Design
,
Flow (Dynamics)
,
Modeling
,
Multi-chip modules
CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications
Betsegaw Gebrehiwot, Nikhil Dhiman, Kasturi Rajagopalan, Dereje Agonafer, Naveen Kannan, James Hoverson, Mike Kaler
InterPACK 2013; V002T08A054https://doi.org/10.1115/IPACK2013-73302
Topics:
Computational fluid dynamics
,
Data centers
,
Evaporative cooling
,
Modeling
,
Climate
,
Containers
,
Cooling
,
Cooling systems
,
Air conditioning
,
Air filters
Data Centers and Energy Efficient Electronic Systems
Improved Zonal Model for Data Center Analysis
InterPACK 2013; V002T09A001https://doi.org/10.1115/IPACK2013-73048
Prediction of Hot Aisle Partition Airflow Boundary Conditions
InterPACK 2013; V002T09A002https://doi.org/10.1115/IPACK2013-73049
Optimization Algorithms for Energy-Efficient Data Centers
InterPACK 2013; V002T09A003https://doi.org/10.1115/IPACK2013-73066
Topics:
Data centers
,
Optimization algorithms
,
Cooling
,
Energy efficiency
,
Junctions
,
Linear programming
Efficient Implementation of Potential-Flow Airflow Prediction for Data Centers
InterPACK 2013; V002T09A004https://doi.org/10.1115/IPACK2013-73075
Topics:
Air flow
,
Data centers
,
Flow (Dynamics)
,
Approximation
,
Mesh generation
,
Physics
Data Center Airflow Prediction With an Enhanced Potential Flow Model
InterPACK 2013; V002T09A005https://doi.org/10.1115/IPACK2013-73076
Topics:
Air flow
,
Data centers
,
Flow (Dynamics)
,
Temperature
,
Buoyancy
,
Computational fluid dynamics
,
Physics
,
Stability
Measured-Temperature Interpolation and Visualization for Data Centers
InterPACK 2013; V002T09A006https://doi.org/10.1115/IPACK2013-73081
Topics:
Data centers
,
Interpolation
,
Temperature
,
Visualization
,
Cooling
,
Temperature sensors
,
Computation
,
Computational fluid dynamics
,
Fluid dynamics
,
Maintenance
Thermodynamic Modeling of Data Center Cooling Systems
InterPACK 2013; V002T09A008https://doi.org/10.1115/IPACK2013-73116
Topics:
Cooling systems
,
Data centers
,
Modeling
,
Flow (Dynamics)
,
Air conditioning
,
Air flow
,
Design
,
Exergy
,
Fluid mechanics
,
Heat transfer
Data Center Trends Toward Higher Ambient Inlet Temperatures and the Impact on Server Performance
InterPACK 2013; V002T09A010https://doi.org/10.1115/IPACK2013-73133
Topics:
Data centers
,
Design
,
Stress
,
Temperature
Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models
InterPACK 2013; V002T09A012https://doi.org/10.1115/IPACK2013-73155
Topics:
Data centers
,
Transients (Dynamics)
,
Heat
,
Computational fluid dynamics
,
Cooling
,
Fluctuations (Physics)
,
Heat sinks
,
Specific heat
,
Temperature
A Field Investigation Into the Limits of High-Density Air-Cooling
Michael K. Patterson, Randall Martin, J. Barr von Oehsen, Jim Pepin, Yogendra Joshi, Vaibhav K. Arghode, Robin Steinbrecher, Jeff King
InterPACK 2013; V002T09A013https://doi.org/10.1115/IPACK2013-73163
Topics:
Cooling
,
Density
,
Air flow
,
Data centers
,
Pressure
,
Computational fluid dynamics
,
Energy consumption
,
Flow (Dynamics)
,
Imaging
,
Modeling
Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility
Milnes P. David, Pritish R. Parida, Mark D. Schultz, Robert E. Simons, Michael Gaynes, Roger Schmidt, Timothy J. Chainer
InterPACK 2013; V002T09A014https://doi.org/10.1115/IPACK2013-73183
Topics:
Data centers
,
Test facilities
,
Cooling
,
Energy consumption
,
Water
,
Energy efficiency
,
Computers
,
Water temperature
Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units
InterPACK 2013; V002T09A015https://doi.org/10.1115/IPACK2013-73196
Topics:
Cooling
,
Data centers
,
Dynamic analysis
,
Failure
,
Cooling systems
,
Water
,
Doors
,
Emergencies
,
Heat exchangers
,
Temperature
Impact of Cold Aisle Containment on Thermal Performance of Data Center
Bharathkrishnan Muralidharan, Saurabh K. Shrivastava, Mahmoud Ibrahim, Sami A. Alkharabsheh, Bahgat G. Sammakia
InterPACK 2013; V002T09A016https://doi.org/10.1115/IPACK2013-73201
Topics:
Containment
,
Data centers
,
Cooling
,
Heat
,
Separation (Technology)
,
Stress
,
Air conditioners
,
Computers
,
Containment systems
,
Density
Cooling Energy Reduction During Dynamically Controlled Data Center Operation
InterPACK 2013; V002T09A017https://doi.org/10.1115/IPACK2013-73208
Topics:
Cooling
,
Data centers
,
Energy consumption
,
Temperature
,
Algorithms
,
Heat
,
Air conditioning
,
Cloud computing
,
Density
,
Dynamic systems
Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory
Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
InterPACK 2013; V002T09A018https://doi.org/10.1115/IPACK2013-73214
Topics:
Computational fluid dynamics
,
Data centers
,
Tiles
,
Flow (Dynamics)
,
Leakage
,
Containment
,
Errors
,
Calibration
,
Containment systems
,
Flow measurement
Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center
InterPACK 2013; V002T09A019https://doi.org/10.1115/IPACK2013-73216
Topics:
Containment
,
Data centers
,
Flow (Dynamics)
,
Leakage
,
Temperature
,
Containment systems
,
Air flow
,
Approximation
,
Buoyancy
,
Computational fluid dynamics
A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers
Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt
InterPACK 2013; V002T09A020https://doi.org/10.1115/IPACK2013-73217
Topics:
Data centers
,
Steady state
,
Flow (Dynamics)
,
Temperature
,
Buoyancy
,
Dynamic models
,
Energy dissipation
,
Failure
,
Air flow
,
Approximation
Benefit of Cold Aisle Containment During Cooling Failure
InterPACK 2013; V002T09A021https://doi.org/10.1115/IPACK2013-73219
Topics:
Containment
,
Cooling
,
Failure
,
Data centers
,
Cooling systems
,
Temperature
,
Transients (Dynamics)
Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers
Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
InterPACK 2013; V002T09A022https://doi.org/10.1115/IPACK2013-73268
Topics:
Cogeneration systems
,
Cooling
,
Data centers
,
Electricity (Physics)
,
Exhaust systems
,
Turbines
,
Absorption
,
Combined heat and power
,
Heat
,
Heat exchangers
Room-Level Transient CFD Modeling of Rack Shutdown
InterPACK 2013; V002T09A024https://doi.org/10.1115/IPACK2013-73282
Compact Modeling of Data Center Air Containment Systems
InterPACK 2013; V002T09A026https://doi.org/10.1115/IPACK2013-73325
Topics:
Containment systems
,
Data centers
,
Modeling
,
Leakage
,
Computer simulation
,
Flow (Dynamics)
,
Ceilings
,
Computational fluid dynamics
,
Air flow
,
Cooling