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Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A038, November 1–5, 2021
Paper No: IMECE2021-69055
... prismatic batteries is performed using a multidomain modeling framework. The well-known Newman, Tiedemann, Gu, and Kim (NTGK) model is used for modelling. A thermal management system based on liquid cooling via cold plates utilizing glycol aqueous solution (GAS) is proposed. Cooling simulations...
Proc. ASME. IMECE2001, Process Industries, 191-202, November 11–16, 2001
Paper No: IMECE2001/PID-25622
... on the surfaces of the dried product and of the condenser. This pressure drop environment, however noise and vibrations, produced by the vapor is a main moving force of the drying process [4,5], compressing system, can affect the benefits of the compact freeze- dryers; 2. THERMAL MANAGEMENT OP FREEZE-DRYING...
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001
Paper No: IMECE2001/HTD-24405
... densities. According to an international technology roadmap for Capillary pumped loop, heat spreader, phase change, semiconductors, high performance MPU (high volume thermal management, porous sheet, CPU, IGBT microprocessor) will have 170W power dissipation over an area of 3.7cm2 by 2005 . In addition...
Proc. ASME. IMECE2020, Volume 8: Energy, V008T08A046, November 16–19, 2020
Paper No: IMECE2020-24153
...THERMAL MANAGEMENT OF A REVERSIBLE SOLID OXIDE SYSTEM FOR LONG-TERM RENEWABLE ENERGY STORAGE Pegah Mottaghizadeh 1, Faryar Jabbari3, Jack Brouwer4 Department of Mechanical and Aerospace Engineering, University of California, Irvine Irvine, CA, USA Mahshid Fardadi2 Department of Mechanical...
Proc. ASME. IMECE2019, Volume 8: Heat Transfer and Thermal Engineering, V008T09A033, November 11–14, 2019
Paper No: IMECE2019-10470
...Abstract Abstract Carbon Dioxide (SCO 2 ) can revolutionize the thermal management landscape due to a dramatic increase in enthalpy and a specific heat near supercritical state, particularly along the pseudocritical line, which correspond to much lower temperatures and pressures than water...
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1719-1724, November 9–15, 2012
Paper No: IMECE2012-87890
... stability, and remarkable chemical inertness. These 2D nanostructures have been used to create composite fluids for diverse thermal management applications, such as microelectronics, high voltage power transmission systems, automobiles, solar cells, biopharmaceuticals, medical therapy/diagnosis, and nuclear...
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 253-261, November 12–18, 2010
Paper No: IMECE2010-40527
... on thermal management of 4 K packages. A characteristic model is developed in COMSOL MultiPhysics that allows for investigation of the dependence of temperature gradients across the package on these variables. It is found that at 4 K thermal interface resistances act as major bottlenecks to heat removal from...
Proc. ASME. IMECE2002, Heat Transfer, Volume 6, 241-245, November 17–22, 2002
Paper No: IMECE2002-33893
... 23 05 2008 UL requires that cooking appliances meet temperature restriction requirements on the outside surfaces for consumer safety. Application of Computational Fluid Dynamics has revealed the relative importance of conduction, convection and radiation in the thermal management...
Proc. ASME. IMECE2002, Advanced Energy Systems, 573-582, November 17–22, 2002
Paper No: IMECE2002-33033
... at a smaller thickness, whereas a thicker plate provided a more uniform distribution of heat transfer coefficient. Compared to Mil-7808 and FC-77, ammonia provided much smaller solid-fluid interface temperature and higher heat transfer coefficient. Jet Impingement Ammonia Thermal Management...
Proc. ASME. IMECE2003, Advanced Energy Systems, 437-446, November 15–21, 2003
Paper No: IMECE2003-42527
...-world systems been illustrated. Preliminary results suggest that such an y-based analysis can be a useful tool in the design and ncement of thermal management systems. Keywords: exergy, availability, data centers, thermal agement, second-law analysis. ENCLATURE E System energy h Specific enthalpy (per...
Proc. ASME. IMECE2003, Heat Transfer, Volume 1, 357-360, November 15–21, 2003
Paper No: IMECE2003-43361
... Transfer, 2nd ed. reissue, McGraw-Hill, Inc., New York.  FLUENT 6 User s Guide, 2001, Fluent, Inc., Lebanon, New Hampshire. 4 Copyright © 2003 by ASME Cooking Range Computational Fluid Dynamics Thermal management Range door design A typical cooking range design requires that UL temperature...
Proc. ASME. IMECE2004, Heat Transfer, Volume 1, 61-67, November 13–19, 2004
Paper No: IMECE2004-61384
... and miniaturization of electronic equipment has caused a dramatic increase in the amount of heat dissipated within data centers housing compute, network, and storage systems. The efficient thermal management of these systems is complicated by the intricate interdependence among the various components of the thermal...
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-431, November 5–11, 2005
Paper No: IMECE2005-79732
... device temperature needs to be around 100 C. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface...
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 467-472, November 5–11, 2005
Paper No: IMECE2005-79771
... of the domains. The solutions are found to be in agreement with known solutions for simpler geometries. The analytical solution presented here is very general in that it takes into account the interface resistances between the layers. One application of this analytical study relates to the thermal management...
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 93-104, November 5–10, 2006
Paper No: IMECE2006-13743
... or cross flow position, it can provide similar enhancement. synthetic jets electronics cooling thermal management impingement jet design Mittal R. and Rampunggoon P. , 2002 , “ On virtual aeroshaping effect of synthetic jets ,” Phys. Fluids (Brief Communication) , 14 ( 4...
Proc. ASME. IMECE2006, Fluids Engineering, 81-87, November 5–10, 2006
Paper No: IMECE2006-14283
... ABSTRACT Thermal management has become a key point in the development of contemporary electronics systems. It is evident that heat fluxes are currently approaching the limits of conventional forced air cooling, and that liquid technologies are now under consideration. The objective of this paper...