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Keywords: single chip package
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Proceedings Papers

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 443-449, November 11–15, 2007
Paper No: IMECE2007-43736
... junction temperature for given multilayer body. Finally validation of the analytical solution will be carried out using developed numerical model. Non-uniform power thermal resistance analytical model single chip package Proceedings of IMECE2007 2007 ASME International Mechanical Engineering...
Proceedings Papers

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 43-49, November 5–10, 2006
Paper No: IMECE2006-13436
... microprocessor numerically as well as analytically. The commercial finite element code ANSYS® is used for this analysis as a numerical tool. 28 01 2008 Non-uniform power thermal resistance analytical model single chip package Abhijit Kaisare, Dereje Agonafer, A. Haji-shiekh, Greg...