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Keywords: electronic cooling
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Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 3-12, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24372
.... The modified Rayleigh number values are in the 10 2 –10 5 range. electronic cooling heat transfer enhancement natural convection radiative effects Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition November 11-16,2001, New York, NY HTD-Vol. 369-7 IMECE2001 /HTD...
Proceedings Papers
Linan Jiang, Jae-Mo Koo, Evelyn Wang, Abdullahel Bari, Eun Seok Cho, Wendy Ong, Ravi S. Prasher, Jim Maveety, Min Soo Kim, Thomas W. Kenny, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. IMECE2002, Microelectromechanical Systems, 13-17, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39238
... the hotspot region. 23 05 2008 Microchannel heat sinks Electronic cooling Two-phase flow Non-uniform heating Proceedings of IMECE: 2002 ASME International Mechanical Engineering Congress & Exhibition November 17-22, 2002, New Orleans, Louisiana, USA LS lyn vi S n G ord an ve. , Se -76...
Proceedings Papers
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 135-147, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33711
... predictive tools specifically tailored to micro-channel heat sinks. 23 05 2008 micro-channel heat sink flow boiling electronic cooling Proceedings of IMECE 02 2002 ASME International Mechanical Engineering Congress & Exposition New Orleans, Louisiana, November 17-22, 2002 H tro se ica...
Proceedings Papers
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 637-643, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61292
... to boiling of the plain surface. Contact resistance was significant and mitigated the affects of sample thermal conductivity. 31 03 2008 porous media copper foam carbon foam boiling impinging jet electronic cooling Proceedings of IMECE2004 ASME International Mechanical Engineering...
Proceedings Papers
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 399-408, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16146
... levels. 25 01 2008 Boiling enhanced structures sub-atmospheric pressure liquid fill volume fill ratio thermosyphon electronic cooling Tengblad N. and Palm B. , 1996 , External two phase thermosiphons for cooling of electronic components , International Journal...
