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Proceedings Papers

Experimental Estimation of the Phase Front Under Local Thermal Non-Equilibrium Condition: Phase Change Phenomena in Porous Media

A. G. Agwu Nnanna, A. Haji-Sheikh, Kendall T. Harris

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 395-423, November 17–22, 2002

Paper No: IMECE2002-39705

DOI: https://doi.org/10.1115/IMECE2002-39705

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Topics: Equilibrium (Physics), Porous materials, Thermal equilibrium, Cooling systems, Cryonics, Freezing, Phase change materials, Thawing

Proceedings Papers

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks

Roger Schmidt, Ethan Cruz

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 297-309, November 17–22, 2002

Paper No: IMECE2002-39652

DOI: https://doi.org/10.1115/IMECE2002-39652

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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Temperature distribution

Proceedings Papers

Effective Thermal-Mechanical Modeling of Solder Joints

Hsien-Chie Cheng, Chin-Yin Yu, Wen-Hwa Chen

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 345-352, November 17–22, 2002

Paper No: IMECE2002-39678

DOI: https://doi.org/10.1115/IMECE2002-39678

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Topics: Modeling, Solder joints, Finite element model, Temperature, Constitutive equations, Elastoplasticity, Finite element analysis, Solders, Viscoelasticity

Proceedings Papers

Thermal Stress Induced Void Formation in Semiconductor Interconnect

Xiaoling He, Clemens Burda

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 255-258, November 17–22, 2002

Paper No: IMECE2002-39513

DOI: https://doi.org/10.1115/IMECE2002-39513

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Topics: Semiconductors (Materials), Simulation, Stress, Thermal stresses, Delamination, Stress concentration, Cycles, Deformation, Failure, Metals

Proceedings Papers

Deterministic and Statistical Reliability of Surface Mount Components

Zhengfang Qian, Xiaohua Wu, Joe Tomase

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 151-158, November 17–22, 2002

Paper No: IMECE2002-39633

DOI: https://doi.org/10.1115/IMECE2002-39633

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Topics: Reliability, Surface mount components, Failure, Fatigue life, Solder joints, Crack propagation, Fracture (Materials), Geometry, Manufacturing, Solders

Proceedings Papers

Lead-Free Flip Chip Assembly

Sunil Gopakumar, Vinodh Poyyapakkam, Dan Blass, Peter Borgesen, K. Srihari

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002

Paper No: IMECE2002-39251

DOI: https://doi.org/10.1115/IMECE2002-39251

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Topics: Alloys, Collapse, Copper, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flux (Metallurgy), Manufacturing, Soldering, Solders

Proceedings Papers

The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries

Anthony J. Rafanelli

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 203-213, November 17–22, 2002

Paper No: IMECE2002-39497

DOI: https://doi.org/10.1115/IMECE2002-39497

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Topics: Aerospace industry, Defense industry, Performance characterization, Solders, Adhesives, Bearings, Electronics, Military systems, Reliability, Surface mount technology

Proceedings Papers

An Integrated Wafer-Scale Packaging Process for MEMS

Thomas W. Kenny, Rob N. Candler, Huimou J. Li, Woo-Tae Park, Junghwa Cho, Holden Li, Aaron Partridge, Gary Yama, Marcus Lutz

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 51-54, November 17–22, 2002

Paper No: IMECE2002-39270

DOI: https://doi.org/10.1115/IMECE2002-39270

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Topics: Microelectromechanical systems, Packaging, Semiconductor wafers, Electronics, High pressure (Physics), Injection molding, Manufacturing, Polysilicon

Proceedings Papers

Component Failure Analysis in MEMS Packaging

J. Zou, M. Waelti, A. Bowman, J. Marchetti, C. H. Mastrangelo

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 3-8, November 17–22, 2002

Paper No: IMECE2002-39263

DOI: https://doi.org/10.1115/IMECE2002-39263

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Topics: Failure analysis, Finite element analysis, MEMS packaging, Reliability, Failure, Microelectromechanical systems, Failure mechanisms, Brittleness, MEMS packages, Microcracks

Proceedings Papers

Deformation of Conductive Particles and Reliability of Electronic Devices Using COG

Takashi Akiguchi, Hideo Koguchi, M. Yamaguchi, A. Takayasu

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-430, November 17–22, 2002

Paper No: IMECE2002-39684

DOI: https://doi.org/10.1115/IMECE2002-39684

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Topics: Deformation, Particulate matter, Reliability, Electrodes, Materials properties, Anisotropy, Bonding, Diluents, Glass, Thin film transistors

Proceedings Papers

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

S. W. Ricky Lee, Yat-Kit Tsui, Xingjia Hunag, Eric C. C. Yan

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 259-262, November 17–22, 2002

Paper No: IMECE2002-39514

DOI: https://doi.org/10.1115/IMECE2002-39514

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Topics: Shear strength, Solders, Storage, Temperature

Proceedings Papers

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

S. M. Hsu, J. C. Lin, K. N. Chiang

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 311-318, November 17–22, 2002

Paper No: IMECE2002-39674

DOI: https://doi.org/10.1115/IMECE2002-39674

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Topics: Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages, Reliability, Finite element model, Design, Computation, Ball-Grid-Array packages, Ceramics

Proceedings Papers

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

J. Wei, Z. P. Wang, Y. M. Tan

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 431-436, November 17–22, 2002

Paper No: IMECE2002-39685

DOI: https://doi.org/10.1115/IMECE2002-39685

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Topics: Bonding, Ceramics, Flip-chip, Flip-chip devices, Shear (Mechanics)

Proceedings Papers

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Muthiah Venkateswaran, Peter Borgesen, K. Srihari

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 111-115, November 17–22, 2002

Paper No: IMECE2002-39252

DOI: https://doi.org/10.1115/IMECE2002-39252

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Topics: Adhesives, Flip-chip assemblies

Proceedings Papers

Evaluating the Assembly of Mirrored Large High-Density BGA Packages

Joe Chu, Maosen Chen, Wyeman Chen

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 215-225, November 17–22, 2002

Paper No: IMECE2002-39499

DOI: https://doi.org/10.1115/IMECE2002-39499

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Topics: Ball-Grid-Array packages, Density, Manufacturing, Design, Design for Manufacturing, Electronics

Proceedings Papers

Failure Prediction of Flip Chip Packages Using Finite Element Technique

Abm Hasan, H. Mahfuz, M. Saha, S. Jeelani

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 319-328, November 17–22, 2002

Paper No: IMECE2002-39675

DOI: https://doi.org/10.1115/IMECE2002-39675

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Topics: Failure, Finite element analysis, Flip-chip packages

Proceedings Papers

Optimization of Multiple Head SMT Placement Machine: Model and Approaches

Youjiao Zeng, Junqi Yan, Ye Jin, Tao Jiang

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 227-232, November 17–22, 2002

Paper No: IMECE2002-39500

DOI: https://doi.org/10.1115/IMECE2002-39500

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Topics: Machinery, Optimization, Printed circuit boards, Weight (Mass), Algorithms, Computer software, Cycles

Proceedings Papers

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

Mohammad Yunus, Muthiah Venkateswaran, Peter Borgesen

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 117-123, November 17–22, 2002

Paper No: IMECE2002-39253

DOI: https://doi.org/10.1115/IMECE2002-39253

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Topics: Alloys, Flip-chip, Flip-chip devices, Lead-free solders, Tin, Solders, Alpha particles, Ceramics, Copper alloys, Electronic products

Proceedings Papers

Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation

Zhaohui Shan, Suresh K. Sitaraman

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 263-267, November 17–22, 2002

Paper No: IMECE2002-39668

DOI: https://doi.org/10.1115/IMECE2002-39668

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Topics: Finite element analysis, Mechanical properties, Nanoindentation, Simulation, Thin films

Proceedings Papers

Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints

Qiang Yu, Doseop Kim, Jaechul Jin, Yasuhiro Takahashi, Masaki Shiratori

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 437-443, November 17–22, 2002

Paper No: IMECE2002-39686

DOI: https://doi.org/10.1115/IMECE2002-39686

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Topics: Fatigue strength, Lead-free solders, Tin, Solders, Solder joints, Corners (Structural elements), Fatigue life, Finite element methods, Fracture (Materials), Intermetallic compounds

2 3 4 5

NARROW

Experimental Estimation of the Phase Front Under Local Thermal Non-Equilibrium Condition: Phase Change Phenomena in Porous Media

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks

Effective Thermal-Mechanical Modeling of Solder Joints

Thermal Stress Induced Void Formation in Semiconductor Interconnect

Deterministic and Statistical Reliability of Surface Mount Components

Lead-Free Flip Chip Assembly

The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries

An Integrated Wafer-Scale Packaging Process for MEMS

Component Failure Analysis in MEMS Packaging

Deformation of Conductive Particles and Reliability of Electronic Devices Using COG

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Evaluating the Assembly of Mirrored Large High-Density BGA Packages

Failure Prediction of Flip Chip Packages Using Finite Element Technique

Optimization of Multiple Head SMT Placement Machine: Model and Approaches

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation

Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints

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