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Proceedings Papers

Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates

Hakan Ozaltun, Hee Seok Roh, Walid Mohamed

Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A046, October 30–November 3, 2022

Paper No: IMECE2022-93718

DOI: https://doi.org/10.1115/IMECE2022-93718

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Topics: Fuels, Plates (structures), Geometry, Irradiation (Radiation exposure), Aluminum, Constitutive equations, Creep, Density, Design, Diffusion (Physics)

Proceedings Papers

Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings

Xu Long, Jiaqi Zhu, Yutai Su, Kim S. Siow, Chuantong Chen

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A009, October 30–November 3, 2022

Paper No: IMECE2022-96468

DOI: https://doi.org/10.1115/IMECE2022-96468

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Topics: Fracture (Materials), Fracture (Process), Modeling, Thermomechanics

Proceedings Papers

Sustainable Production of Rotationally Symmetrical Components: Approaches to Resource Saving on Tool and Workpiece

Pascal Volke, Gabriel Brock, Sebastian Berger, Jannis Saelzer, Jan Nickel, Dirk Biermann

Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A005, October 30–November 3, 2022

Paper No: IMECE2022-95378

DOI: https://doi.org/10.1115/IMECE2022-95378

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Topics: Cutting, Friction, Simulation, Sustainability, Symmetry (Physics), Wear, Additive manufacturing, Computer simulation, Cutting tools, Finite element analysis

Proceedings Papers

Thermo-Mechanical Process Modeling of Additive Friction Stir Deposition of Ti-6Al-4V Alloy

Gazi Abu Raihan, Uttam K. Chakravarty

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A018, October 30–November 3, 2022

Paper No: IMECE2022-94717

DOI: https://doi.org/10.1115/IMECE2022-94717

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Topics: Additive manufacturing, Alloys, Computational fluid dynamics, Friction, Modeling, Thermomechanics

Proceedings Papers

Thermo-Mechanical Behavior of Multi-Layer Deposition for Wire Arc Additive Manufacturing of Structural Steel: Wire Arc Additive Manufacturing

Amritesh Kumar, Swarup Bag, V. C. Srivastava, M. Ruhul Amin

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A024, October 30–November 3, 2022

Paper No: IMECE2022-88917

DOI: https://doi.org/10.1115/IMECE2022-88917

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Topics: Additive manufacturing, Cooling, Stress, Structural steel, Thermomechanics, Wire

Proceedings Papers

Thermo-Mechanical Properties of SiC-Mineral Binder Composites for Space Applications

Sujithra Chandrasekaran, Ahmed El-Ghannam, James A. Monroe, Chengying Xu

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A004, October 30–November 3, 2022

Paper No: IMECE2022-95056

DOI: https://doi.org/10.1115/IMECE2022-95056

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Topics: Binders (Materials), Composite materials, Minerals, Mirrors, Thermal shock, Thermomechanics

Proceedings Papers

Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication

Isaiah Yasko, Lloyd Furuta, Collier Fais, Muhammad Ali, Brian Wisner

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A054, October 30–November 3, 2022

Paper No: IMECE2022-94853

DOI: https://doi.org/10.1115/IMECE2022-94853

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Topics: Bearings, Composite materials, Manufacturing, Thermal expansion, Thermomechanics, Thrust bearings

Proceedings Papers

Topology Optimization Through Deep Neural Network for Different Mechanical and Thermomechanical Problems

Md. Imrul Reza Shishir, Alireza Tabarraei

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A010, October 30–November 3, 2022

Paper No: IMECE2022-94604

DOI: https://doi.org/10.1115/IMECE2022-94604

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Topics: Artificial neural networks, Thermomechanics, Topology optimization

Proceedings Papers

Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior

Wenyu Cao, Hualiang Zhang

Paper No: IMECE2022-94802

DOI: https://doi.org/10.1115/IMECE2022-94802

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Topics: Creep, Fatigue, Modeling, Thermomechanics

Proceedings Papers

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

U. Icardi, L. Librescu, M. Di Sciuva

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 197-214, November 16–21, 1997

Paper No: IMECE1997-0723

DOI: https://doi.org/10.1115/IMECE1997-0723

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Topics: Bonding, Thermomechanics, Composite materials, Anisotropy, Stress, Temperature

Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997

Paper No: IMECE1997-1071

DOI: https://doi.org/10.1115/IMECE1997-1071

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Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection

Proceedings Papers

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

Javier Royo, Alejandro Zaleta, Antonio Valero

Proc. ASME. IMECE97, Advanced Energy Systems, 103-108, November 16–21, 1997

Paper No: IMECE1997-0979

DOI: https://doi.org/10.1115/IMECE1997-0979

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Topics: Cycles, Economic analysis, Energy dissipation, Gates (Closures), High pressure (Physics), Maintenance, Power stations, Simulation, Steam turbines, Temperature

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997

Paper No: IMECE1997-1225

DOI: https://doi.org/10.1115/IMECE1997-1225

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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics

Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997

Paper No: IMECE1997-1234

DOI: https://doi.org/10.1115/IMECE1997-1234

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Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film

Proceedings Papers

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Diego R. Tamburini, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 33-45, November 16–21, 1997

Paper No: IMECE1997-1212

DOI: https://doi.org/10.1115/IMECE1997-1212

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Topics: Thermomechanics, Design, Arches, Computer programming, Electrical wires, Geometry, Manufacturing, Mentoring, Product design, Thrust

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997

Paper No: IMECE1997-1211

DOI: https://doi.org/10.1115/IMECE1997-1211

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Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

NARROW

Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates

Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings

Sustainable Production of Rotationally Symmetrical Components: Approaches to Resource Saving on Tool and Workpiece

Thermo-Mechanical Process Modeling of Additive Friction Stir Deposition of Ti-6Al-4V Alloy

Thermo-Mechanical Behavior of Multi-Layer Deposition for Wire Arc Additive Manufacturing of Structural Steel: Wire Arc Additive Manufacturing

Thermo-Mechanical Properties of SiC-Mineral Binder Composites for Space Applications

Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication

Topology Optimization Through Deep Neural Network for Different Mechanical and Thermomechanical Problems

Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

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