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Proceedings Papers

Thin Film Shape Memory Alloy Microactuators

P. Krulevitch, A. P. Lee, P. B. Ramsey, J. Trevino, M. A. Northrup
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 301-306, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1365
https://doi.org/10.1115/IMECE1996-1365
View Paper titled, Thin Film Shape Memory Alloy Microactuators
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Topics: Microactuators, Shape memory thin films, Shapes, Stress, Cycles, Design, Dimensions, Fatigue, Temperature, Thermomechanics
Proceedings Papers

Nanojoule Thermal Transfer in Micromechanical Heterostructures

Rüdiger Berger, Christoph Gerber, James K. Gimzewski, Ernst Meyer, Hans-Joachim Güntherodt
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 49-53, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1335
https://doi.org/10.1115/IMECE1996-1335
View Paper titled, Nanojoule Thermal Transfer in Micromechanical Heterostructures
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Topics: Ethanol, Heat losses, Heat transfer, Heating, Lasers, Nanoscale phenomena, Phase transitions, Silicon nitride ceramics, Thermomechanics, Vacuum
Proceedings Papers

Thermoelastoplastic Stresses in a Rotating Disk of Temperature Dependent Properties With Temperature Gradient

Shahriar Jahanian
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 67-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0861
https://doi.org/10.1115/IMECE1996-0861
View Paper titled, Thermoelastoplastic Stresses in a Rotating Disk of Temperature Dependent Properties With Temperature Gradient
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Topics: Rotating disks, Stress, Temperature, Temperature gradient, Deformation, Numerical analysis, Collapse, Cooling, Disks, Steady state
Proceedings Papers

A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials

Minfu Lu, Sheng Liu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 87-92, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0894
https://doi.org/10.1115/IMECE1996-0894
View Paper titled, A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials
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Topics: Electronic packaging, Fatigue, Thermomechanics, Alloys, Calibration, Copper, Lead-free solders, Machinery, Testing, Wire
Proceedings Papers

Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models

Chiayu Fu, I. Charles Ume, David L. McDowell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
https://doi.org/10.1115/IMECE1996-0891
View Paper titled, Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models
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Topics: Constitutive equations, Printed circuit boards, Stress analysis (Engineering), Thermomechanics, Fatigue, Fatigue cracks, Stress, Temperature, Thermal stresses, Copper
Proceedings Papers

Populating Product Data for Engineering Analysis With Applications to Printed Wiring Assemblies

Diego R. Tamburini, Russell S. Peak, Robert E. Fulton
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 33-46, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1000
https://doi.org/10.1115/IMECE1996-1000
View Paper titled, Populating Product Data for Engineering Analysis With Applications to Printed Wiring Assemblies
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Topics: Electrical wires, Design, Cycles, Errors, Information retrieval, Mechanical computer-aided design, Product development, Thermomechanics
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
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Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Singular Solutions of Interfacial Stresses in Multilayered Structures

Wan-Lee Yin
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 59-65, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0723
https://doi.org/10.1115/IMECE1996-0723
View Paper titled, Singular Solutions of Interfacial Stresses in Multilayered Structures
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Topics: Stress, Elasticity, Eigenfunctions, Boundary-value problems, Finite element analysis, Temperature, Thermomechanics, Traction, Variational techniques
Proceedings Papers

A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys

Cemal Basaran
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 149-153, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0729
https://doi.org/10.1115/IMECE1996-0729
View Paper titled, A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys
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Topics: Alloys, Constitutive equations, Solders, Tin, Deformation, Plasticity, Modeling, Thermomechanics, Viscoplasticity
Proceedings Papers

Structural Response of Oxidation Resistant Carbon-Carbon Composites

T. H. Ashley, O. O. Ochoa
Proc. ASME. IMECE96, Aerospace and Materials, 211-220, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0478
https://doi.org/10.1115/IMECE1996-0478
View Paper titled, Structural Response of Oxidation Resistant Carbon-Carbon Composites
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Topics: Carbon, Composite materials, Oxidation, Laminates, Materials properties, Boron, Chemical vapor deposition, Finite element analysis, Particulate matter, Satin
Proceedings Papers

Effects of High Heat on the Strength and Fatigue Life of Unidirectional Polymer-Matrix Composites

Philip V. D. McLaughlin, Jr., Henry A. McShane, Roland Cochran, Eileen Armstrong-Carroll
Proc. ASME. IMECE96, Aerospace and Materials, 427-441, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0495
https://doi.org/10.1115/IMECE1996-0495
View Paper titled, Effects of High Heat on the Strength and Fatigue Life of Unidirectional Polymer-Matrix Composites
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Topics: Composite materials, Fatigue life, Heat, Polymers, Temperature, Epoxy adhesives, Epoxy resins, Damage, Fibers, Graphite
Proceedings Papers

Durability and Damage Bahavior of 2-D and 3-D SiC/SiC Composites

Azar Parvizi-Majidi
Proc. ASME. IMECE96, Aerospace and Materials, 387-413, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0493
https://doi.org/10.1115/IMECE1996-0493
View Paper titled, Durability and Damage Bahavior of 2-D and 3-D SiC/SiC Composites
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Topics: Composite materials, Damage, Durability, Fibers, Porosity, Compression, Damage mechanics, Failure, Fracture (Materials), Fracture (Process)
Proceedings Papers

Performance Simulation of High-Temperature Polymeric Composite Materials Using MRLife

Scott Case, Ari Caliskan, Nirmal Iyengar, Kenneth Reifsnider
Proc. ASME. IMECE96, Aerospace, 375-380, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0647
https://doi.org/10.1115/IMECE1996-0647
View Paper titled, Performance Simulation of High-Temperature Polymeric Composite Materials Using MRLife
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Topics: High temperature, Polymer composites, Simulation, Composite materials, Cracking (Materials), Creep, Cycles, Damage, Fatigue, Fracture (Process)
Proceedings Papers

Topology Optimization Through Deep Neural Network for Different Mechanical and Thermomechanical Problems

Md. Imrul Reza Shishir, Alireza Tabarraei
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A010, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94604
https://doi.org/10.1115/IMECE2022-94604
View Paper titled, Topology Optimization Through Deep Neural Network for Different Mechanical and Thermomechanical Problems
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Topics: Artificial neural networks, Thermomechanics, Topology optimization
Proceedings Papers

Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior

Wenyu Cao, Hualiang Zhang
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A037, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94802
https://doi.org/10.1115/IMECE2022-94802
View Paper titled, Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior
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Topics: Creep, Fatigue, Modeling, Thermomechanics
Proceedings Papers

Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates

Hakan Ozaltun, Hee Seok Roh, Walid Mohamed
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A046, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-93718
https://doi.org/10.1115/IMECE2022-93718
View Paper titled, Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates
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Topics: Fuels, Plates (structures), Geometry, Irradiation (Radiation exposure), Aluminum, Constitutive equations, Creep, Density, Design, Diffusion (Physics)
Proceedings Papers

Sustainable Production of Rotationally Symmetrical Components: Approaches to Resource Saving on Tool and Workpiece

Pascal Volke, Gabriel Brock, Sebastian Berger, Jannis Saelzer, Jan Nickel, Dirk Biermann
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A005, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95378
https://doi.org/10.1115/IMECE2022-95378
View Paper titled, Sustainable Production of Rotationally Symmetrical Components: Approaches to Resource Saving on Tool and Workpiece
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Topics: Cutting, Friction, Simulation, Sustainability, Symmetry (Physics), Wear, Additive manufacturing, Computer simulation, Cutting tools, Finite element analysis
Proceedings Papers

Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication

Isaiah Yasko, Lloyd Furuta, Collier Fais, Muhammad Ali, Brian Wisner
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A054, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94853
https://doi.org/10.1115/IMECE2022-94853
View Paper titled, Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication
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Topics: Bearings, Composite materials, Manufacturing, Thermal expansion, Thermomechanics, Thrust bearings
Proceedings Papers

Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings

Xu Long, Jiaqi Zhu, Yutai Su, Kim S. Siow, Chuantong Chen
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A009, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-96468
https://doi.org/10.1115/IMECE2022-96468
View Paper titled, Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings
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Topics: Fracture (Materials), Fracture (Process), Modeling, Thermomechanics