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Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997
Paper No: IMECE1997-0853
DOI: https://doi.org/10.1115/IMECE1997-0853
View Paper titled, Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package
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Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number
Proceedings Papers

Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials

Jay C. Rozzi, Frank P. Incropera, Yung C. Shin
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 75-85, November 16–21, 1997
Paper No: IMECE1997-0833
DOI: https://doi.org/10.1115/IMECE1997-0833
View Paper titled, Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials
Click here to open pdf in another window PDF for Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials
Topics: Ceramics, Heat transfer, Lasers, Machining, Transients (Dynamics), Temperature, Cutting tools, Temperature distribution, Carbon dioxide lasers, Silicon nitride ceramics
Proceedings Papers

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Hesham F. Younis, Rudy S. Dahbura, John H. Lienhard, V
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 127-134, November 16–21, 1997
Paper No: IMECE1997-0901
DOI: https://doi.org/10.1115/IMECE1997-0901
View Paper titled, Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments
Click here to open pdf in another window PDF for Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments
Topics: Cooling, Heat flux, Thin films, Flux (Metallurgy), Heat, Ceramics, Metals, Plasmas (Ionized gases), Bulk solids, Design
Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997
Paper No: IMECE1997-1107
DOI: https://doi.org/10.1115/IMECE1997-1107
View Paper titled, Thermal Performance Evaluation of VBGA Packages
Click here to open pdf in another window PDF for Thermal Performance Evaluation of VBGA Packages
Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance
Proceedings Papers

The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes

Scott K. Thomas, Kevin S. Klasing, Kirk L. Yerkes
Proc. ASME. IMECE97, Advanced Energy Systems, 3-15, November 16–21, 1997
Paper No: IMECE1997-0968
DOI: https://doi.org/10.1115/IMECE1997-0968
View Paper titled, The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes
Click here to open pdf in another window PDF for The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes
Topics: Heat pipes, Fluids, Geometry, Heat, Thermal resistance, Copper, Ethanol, Pipes, Steady state, Temperature
Proceedings Papers

Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector

Wei Tong
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 249-253, November 15–20, 1998
Paper No: IMECE1998-0658
DOI: https://doi.org/10.1115/IMECE1998-0658
View Paper titled, Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector
Click here to open pdf in another window PDF for Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector
Topics: Generators, Heat transfer, Resistance thermometers, Copper, Heat, Temperature, Cooling, Engineers, Ferrosilicon, Finite element methods
Proceedings Papers

Protective Clothing Containing Encapsulated Phase Change Materials

David P. Colvin, Yvonne G. Bryant
Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 123-132, November 15–20, 1998
Paper No: IMECE1998-0807
DOI: https://doi.org/10.1115/IMECE1998-0807
View Paper titled, Protective Clothing Containing Encapsulated Phase Change Materials
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Topics: Phase change materials, Protective clothing, Fibers, Foams (Chemistry), Particulate matter, Thermal energy storage, Air Force, Arctic region, Capacitance, Coatings
Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram
Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998
Paper No: IMECE1998-0875
DOI: https://doi.org/10.1115/IMECE1998-0875
View Paper titled, Temperature Effect on Power MOSFET Devices
Click here to open pdf in another window PDF for Temperature Effect on Power MOSFET Devices
Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature
Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Paper No: IMECE1998-1089
DOI: https://doi.org/10.1115/IMECE1998-1089
View Paper titled, Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Click here to open pdf in another window PDF for Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks
Proceedings Papers

Assessment of Coupled Natural Convection and Radiation Within Enclosed Vertical Annuli

Joseph C. Sanders
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 273-280, November 15–20, 1998
Paper No: IMECE1998-0661
DOI: https://doi.org/10.1115/IMECE1998-0661
View Paper titled, Assessment of Coupled Natural Convection and Radiation Within Enclosed Vertical Annuli
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Topics: Annulus, Natural convection, Radiation (Physics), Storage, Metals, Temperature, Boundary-value problems, Containers, Heat, Heat transfer
Proceedings Papers

Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop

J. H. Boo, M. S. Chun
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 121-127, November 15–20, 1998
Paper No: IMECE1998-0644
DOI: https://doi.org/10.1115/IMECE1998-0644
View Paper titled, Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop
Click here to open pdf in another window PDF for Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop
Topics: Condensers (steam plant), Cooling, Vapors, Heat flux, Convection, Copper, Dimensions, Ethanol, Flow (Dynamics), Fluids
Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998
Paper No: IMECE1998-0650
DOI: https://doi.org/10.1115/IMECE1998-0650
View Paper titled, Micro Channel Heat Exchanger for Cooling Electrical Equipment
Click here to open pdf in another window PDF for Micro Channel Heat Exchanger for Cooling Electrical Equipment
Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits
Proceedings Papers

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

Tomoyuki Suzuki, Akira Kano, Kenji Hirohata
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A003, November 1–5, 2021
Paper No: IMECE2021-70639
DOI: https://doi.org/10.1115/IMECE2021-70639
View Paper titled, Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws
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Topics: Design, Forced convection, Heat capacity, Heat transfer, Machine learning, Maintenance, Natural convection, Network models, Nonlinear dynamical systems, Physical laws
Proceedings Papers

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Hamid Fazeli
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A054, November 1–5, 2021
Paper No: IMECE2021-68217
DOI: https://doi.org/10.1115/IMECE2021-68217
View Paper titled, Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study
Click here to open pdf in another window PDF for Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study
Topics: Genetic algorithms, Heat sinks, Microchannels, Nanofluids, Optimization, Water, Carbon nanotubes, Nanoparticles, Design, Thermal resistance
Proceedings Papers

Optimal Shapes of Fully Embedded Channels for Conjugate Cooling

T. S. Fisher, K. E. Torrance
Proc. ASME. IMECE99, Advanced Energy Systems, 29-35, November 14–19, 1999
Paper No: IMECE1999-0806
DOI: https://doi.org/10.1115/IMECE1999-0806
View Paper titled, Optimal Shapes of Fully Embedded Channels for Conjugate Cooling
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Topics: Cooling, Shapes, Arches, Coolants, Diamonds, Flow (Dynamics), Pressure drop, Pumps, Thermal resistance, Wall thickness
Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Paper No: IMECE1999-0966
DOI: https://doi.org/10.1115/IMECE1999-0966
View Paper titled, An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
Click here to open pdf in another window PDF for An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages
Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999
Paper No: IMECE1999-0967
DOI: https://doi.org/10.1115/IMECE1999-0967
View Paper titled, A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
Click here to open pdf in another window PDF for A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems
Proceedings Papers

Melting Rate of a Solid With Periodic Melt Removal

Valerian Nemchinsky
Proc. ASME. IMECE99, Heat Transfer: Volume 2, 247-254, November 14–19, 1999
Paper No: IMECE1999-1035
DOI: https://doi.org/10.1115/IMECE1999-1035
View Paper titled, Melting Rate of a Solid With Periodic Melt Removal
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Topics: Melting, Electrodes, Heat, Arc welding, Electromagnetic force, Gravity (Force), Heat flux, Heat transfer, Thermal resistance
Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999
Paper No: IMECE1999-1066
DOI: https://doi.org/10.1115/IMECE1999-1066
View Paper titled, Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components
Click here to open pdf in another window PDF for Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components
Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)
Proceedings Papers

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

Kumar R. Cheruparambil, Bakhtier Farouk, Joseph E. Yehoda, Nelson A. Macken
Proc. ASME. IMECE99, Heat Transfer: Volume 4, 103-111, November 14–19, 1999
Paper No: IMECE1999-1109
DOI: https://doi.org/10.1115/IMECE1999-1109
View Paper titled, Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method
Click here to open pdf in another window PDF for Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method
Topics: Diamond films, Synthetic diamonds, Thermal conductivity, Thermal conductivity measurement, Calibration, Chemical vapor deposition, Heat transfer, Thermal resistance, Anisotropy, Bulk solids