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Proceedings Papers

Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications

Yu-Lin Shen

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 385-392, November 16–21, 1997

Paper No: IMECE1997-0689

DOI: https://doi.org/10.1115/IMECE1997-0689

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Topics: Ceramic composites, Thermal expansion, Thermal management, Composite materials, Particulate matter, Computer simulation, Deformation, Finite element methods, Micromechanical devices, Porosity

Proceedings Papers

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

David M. Wilt, Donald L. Chubb

Proc. ASME. IMECE97, Advanced Energy Systems, 47-52, November 16–21, 1997

Paper No: IMECE1997-0972

DOI: https://doi.org/10.1115/IMECE1997-0972

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Topics: Energy conversion, NASA, Technology development, Emissions, Design, Photovoltaic cells, Power density, Silicon, Temperature, Aluminum

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

Analysis of Soil Heat Exchangers for Thermal Management of Outdoor Electronic Cabinets

Hisham E. Hegab, Eric B. Zimmerman, Gene T. Colwell

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 191-196, November 15–20, 1998

Paper No: IMECE1998-0652

DOI: https://doi.org/10.1115/IMECE1998-0652

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Topics: Heat exchangers, Soil, Thermal management, Cooling, Electronics, Heat, Stress, Temperature, Transients (Dynamics), Computer simulation

Proceedings Papers

Heat Transfer Education: Keeping it Relevant and Vibrant

Ali M. Khounsary, James R. Mondt, Terry Simon, Dereje Agonafer, David P. DeWitt, Richard S. Figliola, William L. Grosshandler, Frank Kreith

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 17-23, November 15–20, 1998

Paper No: IMECE1998-0632

DOI: https://doi.org/10.1115/IMECE1998-0632

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Topics: Education, Heat transfer, Students, Engineering teachers, Engineers, Thermal management, Collaboration, Feedback, Governments, Mechanical engineering

Proceedings Papers

Effect of Glycol Aqueous Solution Properties on Battery Cooling Performance Based on Cold Plate

Hongya Zhang, Chengshuai Li, Yangsu Xie, Ali Radwan, Haisheng Fang

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A038, November 1–5, 2021

Paper No: IMECE2021-69055

DOI: https://doi.org/10.1115/IMECE2021-69055

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Topics: Batteries, Cooling, Lithium-ion batteries, Thermal management, Flow (Dynamics), Temperature, Modeling, Simulation, Heat, Plates (structures)

Proceedings Papers

Additively Manufactured Two-Phase Heat Exchanger Integrating PCMs for Spacecraft Thermal Management

Mehdi Kabir, Takele Gemeda, Evan Preller, Raid Mohammed, Jiajun Xu

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A001, November 1–5, 2021

Paper No: IMECE2021-68951

DOI: https://doi.org/10.1115/IMECE2021-68951

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Topics: Additive manufacturing, Heat exchangers, Phase change materials, Space vehicles, Thermal management

Proceedings Papers

Enhanced Pool Boiling Critical Heat Flux on Tilted Heating Surfaces Using Columnar-Post Wicks

Mohammad Borumand, Gisuk Hwang

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A028, November 1–5, 2021

Paper No: IMECE2021-70054

DOI: https://doi.org/10.1115/IMECE2021-70054

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Topics: Critical heat flux, Flow (Dynamics), Heating, Hydrodynamic stability, Pool boiling, Vapors, Wavelength, Design, Fluids, Heat flux

Proceedings Papers

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Nancy E. Mathis

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 37-41, November 14–19, 1999

Paper No: IMECE1999-0968

DOI: https://doi.org/10.1115/IMECE1999-0968

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Topics: Fillers (Materials), Thermal management, Electronic packaging, Fibers, Thermal conductivity

Proceedings Papers

Enhanced Thermal Management Using Encapsulated Phase Change Materials: An Overview

David P. Colvin

Proc. ASME. IMECE99, Advances in Heat and Mass Transfer in Biotechnology, 199-206, November 14–19, 1999

Paper No: IMECE1999-0604

DOI: https://doi.org/10.1115/IMECE1999-0604

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Topics: Phase change materials, Thermal management, Coolants, Air Force, Heat, Industrial research, Marines, NASA, Navy, Capacitance

Proceedings Papers

The Use of Microencapsulated Phase-Change Materials to Enhance the Thermal Performance of Apparel

Mark E. Holman

Proc. ASME. IMECE99, Advances in Heat and Mass Transfer in Biotechnology, 235-239, November 14–19, 1999

Paper No: IMECE1999-0608

DOI: https://doi.org/10.1115/IMECE1999-0608

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Topics: Phase change materials, Capacitance, Fluids, Heat, Industrial research, Latent heat, Microencapsulation, Shells, Solids, Thermal management

Proceedings Papers

A Simplified Model for Encapsulated Phase Change Material

Linda J. Hayes, Michael A. Spieker, Eugene H. Wissler, David P. Colvin

Proc. ASME. IMECE99, Advances in Heat and Mass Transfer in Biotechnology, 163-166, November 14–19, 1999

Paper No: IMECE1999-0598

DOI: https://doi.org/10.1115/IMECE1999-0598

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Topics: Phase change materials, Coolants, Latent heat, Temperature, Thermal management, Avionics, Coatings, Composite materials, Fibers, Flow (Dynamics)

Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001

Paper No: IMECE2001/HTD-24377

DOI: https://doi.org/10.1115/IMECE2001/HTD-24377

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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)

Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001

Paper No: IMECE2001/HTD-24389

DOI: https://doi.org/10.1115/IMECE2001/HTD-24389

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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software

Proceedings Papers

Vibration-Induced Droplet Atomization (VIDA) for Two-Phase Thermal Management

Bojan Vukasinovic, Samuel N. Heffington, Marc K. Smith, Ari Glezer

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 17-24, November 11–16, 2001

Paper No: IMECE2001/EPP-24702

DOI: https://doi.org/10.1115/IMECE2001/EPP-24702

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Topics: Drops, Thermal management, Vibration, Heat transfer, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural), Heat pipes, Condensation, Condensed matter

Proceedings Papers

Recent Developments in High-Performance Refrigeration for the First Compact Cryogenic Freeze-Dryer

L. Reznikov, D. Sutherland

Proc. ASME. IMECE2001, Process Industries, 191-202, November 11–16, 2001

Paper No: IMECE2001/PID-25622

DOI: https://doi.org/10.1115/IMECE2001/PID-25622

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Topics: Drying, Freeze drying equipment, Heat transfer, Refrigeration, Cryogenics, Design, Drugs, Freezing, Pumps, Temperature control

Proceedings Papers

Small Diameter Effects on Internal Flow Boiling

Gail E. Kendall, Peter Griffith, Arthur E. Bergles, John H. Lienhard, V

Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 153-169, November 11–16, 2001

Paper No: IMECE2001/HTD-24211

DOI: https://doi.org/10.1115/IMECE2001/HTD-24211

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Topics: Boiling, Computation, Critical heat flux, Design, Electrical conductance, Electronics, Flow (Dynamics), Flow instability, Heat transfer, HVAC equipment

Proceedings Papers

Experimental Demonstration of Heat Pipe/Two-Phase Flow Systems for Vehicle Passenger Cabin Cooling

Terry J. Hendricks, Thomas Thoensen

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 273-282, November 11–16, 2001

Paper No: IMECE2001/HTD-24404

DOI: https://doi.org/10.1115/IMECE2001/HTD-24404

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Topics: Cooling, Heat pipes, Two-phase flow, Vehicles, Temperature, Solar energy, Testing, Thermal management, Air conditioning, Batteries

Proceedings Papers

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study

Ajit R. Dhamdhere, W. F. Schmidt, Ajay P. Malshe, W. D. Brown, S. N. Yedave

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 193-200, November 11–16, 2001

Paper No: IMECE2001/EPP-24724

DOI: https://doi.org/10.1115/IMECE2001/EPP-24724

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Topics: Failure mechanisms, Lasers, Modeling, Optical instruments, Packaging, Power semiconductor devices, Reliability, Semiconductor lasers, Solders, Stress

Proceedings Papers

Design and Experimental Results of Small-Scale Rotary Engines

Kelvin Fu, Aaron J. Knobloch, Fabian C. Martinez, David C. Walther, Carlos Fernandez-Pello, Al P. Pisano, Dorian Liepmann, Kenji Miyaska, Kaoru Maruta

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 867-873, November 11–16, 2001

Paper No: IMECE2001/MEMS-23924

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23924

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Topics: Design, Engines, Microelectromechanical systems, Manufacturing, Testing, Sealing (Process), Ignition, Internal combustion engines, Combustion, Construction

2 3 4 5

NARROW

Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Analysis of Soil Heat Exchangers for Thermal Management of Outdoor Electronic Cabinets

Heat Transfer Education: Keeping it Relevant and Vibrant

Effect of Glycol Aqueous Solution Properties on Battery Cooling Performance Based on Cold Plate

Additively Manufactured Two-Phase Heat Exchanger Integrating PCMs for Spacecraft Thermal Management

Enhanced Pool Boiling Critical Heat Flux on Tilted Heating Surfaces Using Columnar-Post Wicks

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Enhanced Thermal Management Using Encapsulated Phase Change Materials: An Overview

The Use of Microencapsulated Phase-Change Materials to Enhance the Thermal Performance of Apparel

A Simplified Model for Encapsulated Phase Change Material

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Vibration-Induced Droplet Atomization (VIDA) for Two-Phase Thermal Management

Recent Developments in High-Performance Refrigeration for the First Compact Cryogenic Freeze-Dryer

Small Diameter Effects on Internal Flow Boiling

Experimental Demonstration of Heat Pipe/Two-Phase Flow Systems for Vehicle Passenger Cabin Cooling

Failure Mechanisms and Modeling in High Power Optical Device Packaging: Semiconductor Laser Diodes — A Case Study

Design and Experimental Results of Small-Scale Rotary Engines

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