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Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997
Paper No: IMECE1997-1121
DOI: https://doi.org/10.1115/IMECE1997-1121
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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Proceedings Papers

Wafer Surface Measurements Using Shadow Moiré With Talbot Effect

S. Wu, S. Wei, I. Kao, F. P. Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 369-376, November 16–21, 1997
Paper No: IMECE1997-1112
DOI: https://doi.org/10.1115/IMECE1997-1112
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Topics: Semiconductor wafers, Shades and shadows
Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997
Paper No: IMECE1997-1225
DOI: https://doi.org/10.1115/IMECE1997-1225
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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics
Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997
Paper No: IMECE1997-1224
DOI: https://doi.org/10.1115/IMECE1997-1224
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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers
Proceedings Papers

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

G. Andrew Rabroker, C. Steve Suh, Christian P. Burger, Ravinder Chona
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 45-50, November 16–21, 1997
Paper No: IMECE1997-1226
DOI: https://doi.org/10.1115/IMECE1997-1226
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Topics: Lasers, Semiconductor wafers, Stress, Temperature measurement, Waves, Temperature, Anisotropy, Dispersion relations, Elastic constants, Rapid thermal processing
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Paper No: IMECE1997-1228
DOI: https://doi.org/10.1115/IMECE1997-1228
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Transient Temperature Measurements in a Simulated RTCVD Reactor

J. F. Horton, J. E. Peterson
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 217-224, November 16–21, 1997
Paper No: IMECE1997-0912
DOI: https://doi.org/10.1115/IMECE1997-0912
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Topics: Temperature measurement, Transients (Dynamics), Temperature, Buoyancy, Density, Semiconductor wafers, Uncertainty, Chemical vapor deposition, Flow (Dynamics), Flow visualization
Proceedings Papers

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Jonathan Simon, Long-Sun Huang, Balaji Sridharan, Chang-Jin Kim
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 29-34, November 16–21, 1997
Paper No: IMECE1997-0935
DOI: https://doi.org/10.1115/IMECE1997-0935
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Topics: Joining, Microelectromechanical systems, Semiconductor wafers, Temperature, Adhesives, Low temperature, Reservoirs, Sealing (Process), Epoxy adhesives, Hardening (Curing)
Proceedings Papers

Single Actuator and Multi-Mode Acceleration Feedback Control

Maxime P. Bayon de Noyer, Sathya V. Hanagud
Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 227-235, November 16–21, 1997
Paper No: IMECE1997-0196
DOI: https://doi.org/10.1115/IMECE1997-0196
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Topics: Actuators, Feedback, Design, Control equipment, Accelerometers, Piezoelectric ceramics, Semiconductor wafers, Sensors, Simulation, Vibration
Proceedings Papers

A High Performance Hand-Held Gas Chromatograph

Conrad M. Yu, Matthew Lucas, Jackson C. Koo, Paul Stratton, Terri DeLima, Elaine Behymer
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 481-486, November 15–20, 1998
Paper No: IMECE1998-1288
DOI: https://doi.org/10.1115/IMECE1998-1288
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Topics: Gas chromatography, Microelectromechanical systems, Sensors, Ejectors, Separation (Technology), Batteries, Bridges (Structures), Computer software, Electrical measurement, Electricity (Physics)
Proceedings Papers

Thin Film Microresonator for Vacuum Sensing

F. Yuan, C. L. Tom, C. H. Mastrangelo, J. Martin, R. Pfenninger
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 241-246, November 15–20, 1998
Paper No: IMECE1998-1248
DOI: https://doi.org/10.1115/IMECE1998-1248
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Topics: Micromechanical resonators, Thin films, Vacuum, Semiconductor wafers, Silicon, Borosilicate glasses, Glass, Manufacturing, Micromachining, Pressure
Proceedings Papers

Self-Assembled Microslider for Microjoinery

L.-S. Huang, B. Sridharan, C.-J. Kim, S. D. Collins, C. González, R. L. Smith
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 499-504, November 15–20, 1998
Paper No: IMECE1998-1291
DOI: https://doi.org/10.1115/IMECE1998-1291
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Topics: Self-assembly, Manufacturing, Semiconductor wafers, Bonding, Etching, Anisotropy, Clearances (Engineering), Friction, Micromachining, Polishing
Proceedings Papers

Design and Fabrication of Piezoresistive Cantilever Microaccelerometer Arrays With a Symmetrically Bonded Proof-Mass

Jong Soo Ko, Young-Ho Cho, Byung Man Kwak, Kwanhum Park
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 353-356, November 15–20, 1998
Paper No: IMECE1998-1267
DOI: https://doi.org/10.1115/IMECE1998-1267
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Topics: Cantilevers, Design, Manufacturing, Accelerometers, Microfabrication, Cantilever beams, Mass production, Resonance, Sawing, Semiconductor wafers
Proceedings Papers

Fabrication and Testing of a Multilayer Silicon Fluidic Laminar Proportional Amplifier

Brett H. Piekarski, Robert J. Zeto, Steve M. Tenney, Matthew H. Ervin
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 97-101, November 15–20, 1998
Paper No: IMECE1998-1228
DOI: https://doi.org/10.1115/IMECE1998-1228
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Topics: Manufacturing, Silicon, Testing, Design, Stainless steel, Etching, Flow (Dynamics), Laminates, Milling, Photolithography
Proceedings Papers

Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique

Wen-Tien Chang Chien, Liwei Lin, Yi-Chung Lo, Chia-Ou Chang
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 361-364, November 15–20, 1998
Paper No: IMECE1998-1269
DOI: https://doi.org/10.1115/IMECE1998-1269
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Topics: Anisotropy, Etching, Manufacturing, Shapes, Design, Microelectromechanical systems, Semiconductor wafers
Proceedings Papers

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Jeung Sang Go, Young-Ho Cho
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 357-360, November 15–20, 1998
Paper No: IMECE1998-1268
DOI: https://doi.org/10.1115/IMECE1998-1268
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Topics: Cavities, Design, MEMS packaging, Semiconductor wafers, Bonding, Plates (structures), Pressure, Design methodology, Failure, Finite element analysis
Proceedings Papers

Silicon-Micromachined Vortex-Controlled Thrusters

Changho Cho, Jongpal Kim, Byung-gwi Choi, Dongjoo Kim, Haecheon Choi, Dong-il Dan Cho
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 125-132, November 15–20, 1998
Paper No: IMECE1998-1232
DOI: https://doi.org/10.1115/IMECE1998-1232
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Topics: Micromachining, Silicon, Vortices, Nozzles, Pressure, Signals, Flow (Dynamics), Fluidic devices, Gates (Closures), Manganese (Metal)
Proceedings Papers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Haruna Tada, Ioannis N. Miaoulis, Peter Y. Wong
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 37-44, November 15–20, 1998
Paper No: IMECE1998-1221
DOI: https://doi.org/10.1115/IMECE1998-1221
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Topics: Computer simulation, Microcantilevers, Semiconductor wafers, Etching, Temperature gradient, Emissivity, Separation (Technology), Temperature, Thin films, Design
Proceedings Papers

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Yifan Guo, Dianne Mitchell, Vijay Sarihan, Dawei Zheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 135-140, November 15–20, 1998
Paper No: IMECE1998-0438
DOI: https://doi.org/10.1115/IMECE1998-0438
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Topics: Semiconductor wafers, Stress, Testing, Membranes, Sensors, Pressure sensors, Deformation, Residual stresses, Signals
Proceedings Papers

Thermo-Solutal Issues in Very Large Diameter Silicon Crystal Growth

T. Zhang, G.-X. Wang, F. Ladeinde, V. Prasad
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 797-806, November 15–20, 1998
Paper No: IMECE1998-1094
DOI: https://doi.org/10.1115/IMECE1998-1094
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Topics: Silicon crystals, Crystals, Semiconductor wafers, Turbulence, Dynamics (Mechanics), Flow (Dynamics), Heat, Heat transfer, Oxygen, Semiconductors (Materials)