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Proceedings Papers

Direct Measurements of Turbulent Boundary Layer Wall Pressure Wavenumber-Frequency Spectra

Bruce M. Abraham, William L. Keith
Proc. ASME. IMECE96, Noise Control and Acoustics: Volume 1 — Active Noise and Vibration Control; Complexity in Acoustics; Noise Sources in Internal Combustion Engines; Vehicle Flow/Structure Noises; Aeroacoustic Sound Propagation in Ducts and Jets; Turbomachinery Noise; BS/MS Student Paper Competition, 177-187, November 17–22, 1996
Paper No: IMECE1996-0524
https://doi.org/10.1115/IMECE1996-0524
View Paper titled, Direct Measurements of Turbulent Boundary Layer Wall Pressure Wavenumber-Frequency Spectra
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Topics: Boundary layer turbulence, Pressure, Spectra (Spectroscopy), Boundary layers, Acoustics, Displacement, Fluctuations (Physics), Momentum, Pressure sensors, Resolution (Optics)
Proceedings Papers

Micro-Electro-Mechanical-Systems and Industrial Applications

Manfred Möllendorf
Proc. ASME. IMECE96, Aerospace, 761-767, November 17–22, 1996
Paper No: IMECE1996-0692
https://doi.org/10.1115/IMECE1996-0692
View Paper titled, Micro-Electro-Mechanical-Systems and Industrial Applications
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Topics: Microelectromechanical systems, Micromachining, Pressure sensors, Sensors
Proceedings Papers

Large Deflection Effects on Micro Diaphragms: A Theoretical and Experimental Study

Liwei Lin, Huey-Chi Chu
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 447-452, November 17–22, 1996
Paper No: IMECE1996-1388
https://doi.org/10.1115/IMECE1996-1388
View Paper titled, Large Deflection Effects on Micro Diaphragms: A Theoretical and Experimental Study
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Topics: Deflection, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure sensors, Errors, Shapes, Plates (structures), Resistors, Shells, Transducers
Proceedings Papers

An Integrated Silicon Based Wall Pressure-Shear Stress Sensor for Measurements in Turbulent Flows

L. Löfdahl, E. Kälvesten, T. Hadzianagnostakis, G. Stemme
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 245-251, November 17–22, 1996
Paper No: IMECE1996-1358
https://doi.org/10.1115/IMECE1996-1358
View Paper titled, An Integrated Silicon Based Wall Pressure-Shear Stress Sensor for Measurements in Turbulent Flows
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Topics: Pressure, Sensors, Shear (Mechanics), Silicon, Stress, Turbulence, Shear stress, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure sensors
Proceedings Papers

Effects of Infill on the Additive Manufacturing of Piezoresistive Pressure Sensors

James D. Banks, Meysam Khaleghian, Anahita Emami
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A022, October 30–November 3, 2022
Paper No: IMECE2022-91749
https://doi.org/10.1115/IMECE2022-91749
View Paper titled, Effects of Infill on the Additive Manufacturing of Piezoresistive Pressure Sensors
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Topics: Additive manufacturing, Polymer composites, Pressure sensors
Proceedings Papers

Effect of Metastructure Design on the Performance of Pressure Sensors

Huan Zhao, Julia E. Huddy, William J. Scheideler, Yan Li
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A049, October 30–November 3, 2022
Paper No: IMECE2022-95099
https://doi.org/10.1115/IMECE2022-95099
View Paper titled, Effect of Metastructure Design on the Performance of Pressure Sensors
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Topics: Additive manufacturing, Design, Pressure sensors
Proceedings Papers

Extended Analysis of Micro Fin Array Configurations for Single- and Two-Phase Flow

Colton Frear, Gerardo Carbajal, Edwar Romero-Ramirez
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A038, October 30–November 3, 2022
Paper No: IMECE2022-95984
https://doi.org/10.1115/IMECE2022-95984
View Paper titled, Extended Analysis of Micro Fin Array Configurations for Single- and Two-Phase Flow
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Topics: Cooling, Fluids, Heat transfer, Microchannels, Two-phase flow, Flow (Dynamics), Boiling, Temperature, Design, Heat
Proceedings Papers

Compression Simulation, Heat Transfer and Work in Reciprocating Type Refrigeration Compressors

Sot. K. Chatzidakis, Alex. K. Rouvas, Kon. S. Chatzidakis, Ath. D. Kouremenos
Proc. ASME. IMECE97, Advanced Energy Systems, 469-476, November 16–21, 1997
Paper No: IMECE1997-1020
https://doi.org/10.1115/IMECE1997-1020
View Paper titled, Compression Simulation, Heat Transfer and Work in Reciprocating Type Refrigeration Compressors
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Topics: Compression, Compressors, Heat transfer, Refrigeration, Simulation, Cylinders, Refrigerants, Geometry, Heat, Pistons
Proceedings Papers

Sensor/Model Fusion for Improved Process Understanding and Control in Injection Molding

Li-Jen Chien, Charles L. Thomas, Del R. Lawson
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 189-197, November 16–21, 1997
Paper No: IMECE1997-0629
https://doi.org/10.1115/IMECE1997-0629
View Paper titled, Sensor/Model Fusion for Improved Process Understanding and Control in Injection Molding
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Topics: Injection molding, Sensors, Molding, Pressure sensors, Ultrasonic transducers, Cavities, Machinery, Polymers, Signals, Temperature
Proceedings Papers

Liquid Mass Flow Sensor Using Dynamic Pressure Detection

M. Ashauer, H. Glosch, H. Ashauer, H. Sandmaier, W. Lang
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 421-425, November 15–20, 1998
Paper No: IMECE1998-1279
https://doi.org/10.1115/IMECE1998-1279
View Paper titled, Liquid Mass Flow Sensor Using Dynamic Pressure Detection
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Topics: Flow sensors, Pressure, Sensors, Dimensions, Engineering prototypes, Flow (Dynamics), Pressure sensors, Silicon
Proceedings Papers

An 8x8 Robust Capacitive Pressure Sensor Array

Sung-Pil Chang, Jeong-Bong Lee, Mark G. Allen
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 513-517, November 15–20, 1998
Paper No: IMECE1998-1293
https://doi.org/10.1115/IMECE1998-1293
View Paper titled, An 8x8 Robust Capacitive Pressure Sensor Array
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Topics: Pressure sensors, Micromachining, Sensors, Manufacturing, Stainless steel, Capacitance, Design, Electrodes, Flow (Dynamics), Lamination
Proceedings Papers

Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment

J. Kurth Reynolds, David C. Catling, Randy C. Blue, Nadim Maluf, Thomas W. Kenny
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 401-406, November 15–20, 1998
Paper No: IMECE1998-1276
https://doi.org/10.1115/IMECE1998-1276
View Paper titled, Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment
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Topics: Instrumentation, Packaging, Pressure sensors, Sensors, Temperature, Atmospheric pressure, Calibration, Errors, Fluctuations (Physics), NASA
Proceedings Papers

A Pneumatic Frequency Generator for Experimental Analysis of Unsteady Microflows

Stéphane Colin, Marc Anduze, Robert Caen
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 231-238, November 15–20, 1998
Paper No: IMECE1998-1247
https://doi.org/10.1115/IMECE1998-1247
View Paper titled, A Pneumatic Frequency Generator for Experimental Analysis of Unsteady Microflows
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Topics: Experimental analysis, Generators, Microchannels, Pressure, Signals, Pressure sensors
Proceedings Papers

Numerical Simulation and Design of the Four-Terminal Piezoresistive Pressure Transducer

Chahid K. Ghaddar, Mark G. da Silva, John R. Gilbert, Stephen F. Bart
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 329-334, November 15–20, 1998
Paper No: IMECE1998-1263
https://doi.org/10.1115/IMECE1998-1263
View Paper titled, Numerical Simulation and Design of the Four-Terminal Piezoresistive Pressure Transducer
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Topics: Computer simulation, Design, Pressure transducers, Resistors, Diaphragms (Mechanical devices), Diaphragms (Structural), Bridges (Structures), Sensors, Dimensions, Pressure sensors
Proceedings Papers

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Yifan Guo, Dianne Mitchell, Vijay Sarihan, Dawei Zheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 135-140, November 15–20, 1998
Paper No: IMECE1998-0438
https://doi.org/10.1115/IMECE1998-0438
View Paper titled, A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process
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Topics: Semiconductor wafers, Stress, Testing, Membranes, Sensors, Pressure sensors, Deformation, Residual stresses, Signals
Proceedings Papers

Experimental and Computational Investigations of a Cylinder in Crossflow

Nathan J. Patterson, Prabhakar Venkateswaran
Proc. ASME. IMECE2021, Volume 9: Engineering Education, V009T09A050, November 1–5, 2021
Paper No: IMECE2021-70342
https://doi.org/10.1115/IMECE2021-70342
View Paper titled, Experimental and Computational Investigations of a Cylinder in Crossflow
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Topics: Cylinders, Students, Flow (Dynamics), Fluid dynamics, Computer programming, Pressure sensors, Transients (Dynamics), Analytical methods, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

On the Modeling of the Wheatstone-Bridge Piezoresistive Pressure Sensor: A Finite-Element-Based Approach

Chahid K. Ghaddar, John R. Gilbert
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 195-200, November 14–19, 1999
Paper No: IMECE1999-0267
https://doi.org/10.1115/IMECE1999-0267
View Paper titled, On the Modeling of the Wheatstone-Bridge Piezoresistive Pressure Sensor: A Finite-Element-Based Approach
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Topics: Bridges (Structures), Modeling, Pressure sensors, Resistors, Design, Diaphragms (Mechanical devices), Diaphragms (Structural), Diffusion (Physics), Dimensions, Engineering simulation
Proceedings Papers

Pressure Sensors in Automotive Applications and Future Challenges

J. Albert Chiou
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 525-530, November 14–19, 1999
Paper No: IMECE1999-0315
https://doi.org/10.1115/IMECE1999-0315
View Paper titled, Pressure Sensors in Automotive Applications and Future Challenges
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Topics: Automotive industry, Pressure sensors, Sensors, Automobiles, Circuits, Design, Emissions, Health care, Materials properties, Micromachining
Proceedings Papers

Integrated LTCC Coils for Multiple Applications in Meso-Electro-Mechanical Systems

Mario Gongora-Rubio, Jorge J. Santiago-Aviles, Luis Sola-Laguna, Michael Smith
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 189-194, November 14–19, 1999
Paper No: IMECE1999-0266
https://doi.org/10.1115/IMECE1999-0266
View Paper titled, Integrated LTCC Coils for Multiple Applications in Meso-Electro-Mechanical Systems
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Topics: Actuators, Ceramics, Displacement, Electromechanical systems, Energy consumption, Joules, Low temperature, Microelectronic packaging, Pressure sensors, Sensors
Proceedings Papers

Assembly and Testing of Surface Micromachined, Piezoresistive Polysilicon Pressure Sensors

Todd F. Miller, David J. Monk, Gary O’Brien, William P. Eaton, James H. Smith
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 169-174, November 14–19, 1999
Paper No: IMECE1999-0263
https://doi.org/10.1115/IMECE1999-0263
View Paper titled, Assembly and Testing of Surface Micromachined, Piezoresistive Polysilicon Pressure Sensors
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Topics: Manufacturing, Micromachining, Polysilicon, Pressure sensors, Testing, Microelectromechanical systems, Circuits, Crystals, Noise (Sound), Packaging