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Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997
Paper No: IMECE1997-0816
DOI: https://doi.org/10.1115/IMECE1997-0816
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures
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Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis
Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Paper No: IMECE1997-0817
DOI: https://doi.org/10.1115/IMECE1997-0817
View Paper titled, Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs
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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Proceedings Papers

MEMS for Fluidic Controls

Chih-Ming Ho, Yu-Chong Tai
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 27, November 16–21, 1997
Paper No: IMECE1997-0934
DOI: https://doi.org/10.1115/IMECE1997-0934
View Paper titled, MEMS for Fluidic Controls
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Topics: Microelectromechanical systems, Sensors, Actuators, Circuits, Shear stress, Transducers, Computers, Integrated circuit fabrication, Micromachining, Artificial neural networks
Proceedings Papers

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. M. Liechti
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997
Paper No: IMECE1997-1232
DOI: https://doi.org/10.1115/IMECE1997-1232
View Paper titled, Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners
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Topics: Corners (Structural elements), Fracture (Materials), Nucleation (Physics), Eigenvalues, Stress, Elasticity, Geometry, Microelectronic devices, Structural elements (Construction)
Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Paper No: IMECE1997-0493
DOI: https://doi.org/10.1115/IMECE1997-0493
View Paper titled, The Effect of Temperature and Humidity Exposure on Adhesion
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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams
Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998
Paper No: IMECE1998-1290
DOI: https://doi.org/10.1115/IMECE1998-1290
View Paper titled, Ceramic Tape-Based Meso Systems Technology
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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems
Proceedings Papers

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998
Paper No: IMECE1998-0434
DOI: https://doi.org/10.1115/IMECE1998-0434
View Paper titled, Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry
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Topics: Interferometry, Microelectronic devices, Warping, Surface roughness, Computers, Design for Manufacturing, Infrared radiation, Surface topography
Proceedings Papers

A Large Stroke, Nanometer Precision X-Y Stage for Lithography

Lowell D. Jones, Jeffrey S. N. Paine
Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 89-94, November 15–20, 1998
Paper No: IMECE1998-0942
DOI: https://doi.org/10.1115/IMECE1998-0942
View Paper titled, A Large Stroke, Nanometer Precision X-Y Stage for Lithography
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Topics: Lithography, Design, Heat, Actuators, Cables, Flexure mechanisms, Inertia (Mechanics), Innovation, Magnetic levitation, Microelectronic devices
Proceedings Papers

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

Haruna Tada, Alexis R. Abramson, Ioannis N. Miaoulis, Peter Y. Wong, Patricia Nieva, Paul Zavracky
Proc. ASME. IMECE98, Heat Transfer: Volume 2 — Combustion and Radiation Heat Transfer, 93-98, November 15–20, 1998
Paper No: IMECE1998-0623
DOI: https://doi.org/10.1115/IMECE1998-0623
View Paper titled, Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing
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Topics: Rapid thermal processing, Thin films, Semiconductor wafers, Heating, Reflectance, Temperature, Absorption, Computer simulation, Energy gap, High temperature
Proceedings Papers

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Andrzej J. Przekwas, Zhijian Chen, Marek Turowski
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999
Paper No: IMECE1999-0308
DOI: https://doi.org/10.1115/IMECE1999-0308
View Paper titled, High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics
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Topics: Aerodynamics, Jets, Microelectronic devices, Modeling, Simulation, Aerodynamic flow, Computational fluid dynamics, Computer cooling, Flow (Dynamics), Fluid mechanics
Proceedings Papers

Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72

K. N. Rainey, S. M. You
Proc. ASME. IMECE99, Heat Transfer: Volume 4, 245-253, November 14–19, 1999
Paper No: IMECE1999-1125
DOI: https://doi.org/10.1115/IMECE1999-1125
View Paper titled, Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72
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Topics: Heat transfer, Pool boiling, Critical heat flux, Nucleate boiling, Coating processes, Coatings, Fins, Atmospheric pressure, Bubbles, Density
Proceedings Papers

Design and Analysis of a Meso-Scale Refrigerator

N. S. Ashraf, H. C. Carter, III, K. Casey, L. C. Chow, S. Corban, M. K. Drost, A. J. Gumm, Z. Hao, A. Q. Hasan, J. S. Kapat, L. Kramer, M. Newton, K. B. Sundaram, J. Vaidya, C. C. Wong, K. Yerkes
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 109-116, November 14–19, 1999
Paper No: IMECE1999-1068
DOI: https://doi.org/10.1115/IMECE1999-1068
View Paper titled, Design and Analysis of a Meso-Scale Refrigerator
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Topics: Design, Compression, Engines, Motors, Capacitance, Compressors, Electromagnetic induction, Electronics, Heat, Microelectronic devices
Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001
Paper No: IMECE2001/HTD-24382
DOI: https://doi.org/10.1115/IMECE2001/HTD-24382
View Paper titled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability
Proceedings Papers

Bias-Dependent Peltier Coefficient in Bipolar Devices

Kevin P. Pipe, Rajeev J. Ram, Ali Shakouri
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 219-222, November 11–16, 2001
Paper No: IMECE2001/HTD-24396
DOI: https://doi.org/10.1115/IMECE2001/HTD-24396
View Paper titled, Bias-Dependent Peltier Coefficient in Bipolar Devices
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Topics: Cooling, Design, Diffusion (Physics), Heating, Microelectronic devices, Semiconductor lasers, Temperature, Thermoelectric cooling
Proceedings Papers

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

Kwong-Luck Tan, Andrew Miner, Xiaofeng Fan, Chris LaBounty, Gehong Zheng, John E. Bowers, Edward T. Croke, Ali Shakouri, Arun Majumdar
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 193-197, November 11–16, 2001
Paper No: IMECE2001/HTD-24393
DOI: https://doi.org/10.1115/IMECE2001/HTD-24393
View Paper titled, Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy
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Topics: Imaging, Microscopy, Nanoscale phenomena, Coolers, Cooling, Superlattices, Temperature, Thermocouples, Microelectronic devices, Optoelectronic devices
Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001
Paper No: IMECE2001/HTD-24381
DOI: https://doi.org/10.1115/IMECE2001/HTD-24381
View Paper titled, A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets
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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation
Proceedings Papers

Stress Relaxation of Gold/Polysilicon Layered MEMS Microstructures Subjected to Thermal Loading

Yanhang Zhang, Martin L. Dunn
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 149-156, November 11–16, 2001
Paper No: IMECE2001/MEMS-23822
DOI: https://doi.org/10.1115/IMECE2001/MEMS-23822
View Paper titled, Stress Relaxation of Gold/Polysilicon Layered MEMS Microstructures Subjected to Thermal Loading
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Topics: Microelectromechanical systems, Polysilicon, Relaxation (Physics), Stress, Temperature, Cooling, Creep, Cycles, Deformation, Microelectronic devices
Proceedings Papers

Issues and Directions of MEMS Research for the Electronics Industry

Y. Eugene Pak
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 3-8, November 11–16, 2001
Paper No: IMECE2001/MEMS-23800
DOI: https://doi.org/10.1115/IMECE2001/MEMS-23800
View Paper titled, Issues and Directions of MEMS Research for the Electronics Industry
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Topics: Electronics, Microelectromechanical systems, Biotechnology, Electromechanical systems, Machining, Manufacturing, Microelectronic devices
Proceedings Papers

Small Heat Source Effects in Sub-Micron Heat Conduction

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 237-238, November 11–16, 2001
Paper No: IMECE2001/HTD-24399
DOI: https://doi.org/10.1115/IMECE2001/HTD-24399
View Paper titled, Small Heat Source Effects in Sub-Micron Heat Conduction
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Topics: Heat, Heat conduction, Phonons, Dimensions, Mean free path, Approximation, Electric fields, Electromagnetic scattering, Failure, Finite volume methods
Proceedings Papers

Diamond and Diamondlike Composites

R. J. Narayan, Q. Wei, J. Sankar, J. Narayan
Proc. ASME. IMECE2001, Effects of Processing on Properties of Advanced Ceramics, 37-48, November 11–16, 2001
Paper No: IMECE2001/MD-24804
DOI: https://doi.org/10.1115/IMECE2001/MD-24804
View Paper titled, Diamond and Diamondlike Composites
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Topics: Composite materials, Diamonds, Adhesion, Bonding, Carbon, Ceramics, Coatings, Metals, Thin films, Biomedicine