Search Results | IMECE | ASME Digital Collection

1-20 of 57

2 3

Sort by

Sort Order Select

Proceedings Papers

CFD and Experimental Investigation of Graphite Heat Spreader Based Cooling for Li-Ion Batteries for Electric Vehicles and EVTOL (Electric Vertical Take-Off and Landing) Aircraft Applications

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A050, October 30–November 3, 2022

Paper No: IMECE2022-97123

DOI: https://doi.org/10.1115/IMECE2022-97123

View Paper

Topics: Aircraft, Computational fluid dynamics, Cooling, Electric vehicles, Flat heat pipes, Graphite, Lithium-ion batteries, Modeling

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

View Paper

Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

M. Gao, Y. Cao

Proc. ASME. IMECE98, Advanced Energy Systems, 503-508, November 15–20, 1998

Paper No: IMECE1998-0879

DOI: https://doi.org/10.1115/IMECE1998-0879

View Paper

Topics: Boiling, Electronics, Flat heat pipes, Heat transfer, Cooling, Fluids, Heat, Heat flux, Copper, Design

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

View Paper

Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999

Paper No: IMECE1999-0966

DOI: https://doi.org/10.1115/IMECE1999-0966

View Paper

Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages

Proceedings Papers

Capillary Pumped Loop Heat Spreader for Electronics Cooling

Jaewon Chung, Costas P. Grigoropoulos, Ralph Greif

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001

Paper No: IMECE2001/HTD-24405

DOI: https://doi.org/10.1115/IMECE2001/HTD-24405

View Paper

Topics: Computer cooling, Flat heat pipes

Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001

Paper No: IMECE2001/HTD-24381

DOI: https://doi.org/10.1115/IMECE2001/HTD-24381

View Paper

Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation

Proceedings Papers

Time-Periodic Forced Convection in Micro Heat Spreaders

Cuneyt Sert, Ali Beskok

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 375-384, November 5–10, 2000

Paper No: IMECE2000-1119

DOI: https://doi.org/10.1115/IMECE2000-1119

View Paper

Topics: Flat heat pipes, Forced convection, Cooling, Energy dissipation, Heat, Dimensions, Laminar flow, Microfluidics, Stress

Proceedings Papers

Cooling of a PWB With Irregular Populated Chips

Yiwu Ding, Dereje Agonafer, Elliott Short

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 293-298, November 5–10, 2000

Paper No: IMECE2000-2276

DOI: https://doi.org/10.1115/IMECE2000-2276

View Paper

Topics: Cooling, Printed circuit boards, Temperature, Computational fluid dynamics, Buoyancy, Flat heat pipes, Simulation, Thermal conductivity, Heat conduction, Heat sinks

Proceedings Papers

Characterization of the Performance of Flat Heat Pipes for Electronics Cooling

Unnikrishnan Vadakkan, Suresh V. Garimella, Choondal B. Sobhan

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 261-268, November 5–10, 2000

Paper No: IMECE2000-2272

DOI: https://doi.org/10.1115/IMECE2000-2272

View Paper

Topics: Computer cooling, Flat heat pipes, Heat pipes

Proceedings Papers

Formulae to Size Axisymmetric Heat Spreaders Above Dielectric Layers

Marc Hodes

Proc. ASME. IMECE2000, Manufacturing Engineering, 443-451, November 5–10, 2000

Paper No: IMECE2000-1839

DOI: https://doi.org/10.1115/IMECE2000-1839

View Paper

Topics: Flat heat pipes, Thermal resistance, Heat sinks

Proceedings Papers

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

Ravi S. Prasher, Craig Simmons, Gary Solbrekken

Proc. ASME. IMECE2000, Manufacturing Engineering, 461-466, November 5–10, 2000

Paper No: IMECE2000-1841

DOI: https://doi.org/10.1115/IMECE2000-1841

View Paper

Topics: Contact resistance, Thermal conductivity, Phase change materials, Polymers, Flat heat pipes, Computer cooling, Electronic packages, Fluids, Heat sinks, Particulate matter

Proceedings Papers

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

V. H. Adams, V. A. Chiriac, T.-Y. Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 433-442, November 5–10, 2000

Paper No: IMECE2000-1838

DOI: https://doi.org/10.1115/IMECE2000-1838

View Paper

Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Cooling, Copper, Design, Energy dissipation, Engineering simulation, Flat heat pipes, Heat, Heat conduction

Proceedings Papers

Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting With Advanced Heat Spreader Technology

Umut Zeynep Uras, Enes Tamdoğan, Mehmet Arık

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A050, November 11–17, 2016

Paper No: IMECE2016-65602

DOI: https://doi.org/10.1115/IMECE2016-65602

View Paper

Topics: Engines, Flat heat pipes, Light-emitting diodes, Metals, Thermal conductivity, Vapors, Flexible electronics, Internet of things, Lumber, Printed circuit boards

Proceedings Papers

Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications

Steven A. Isaacs, Diego A. Arias, Peter E. Hamlington, Derek Hengeveld

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A053, November 11–17, 2016

Paper No: IMECE2016-67229

DOI: https://doi.org/10.1115/IMECE2016-67229

View Paper

Topics: Copper, Design, Flat heat pipes, Fluids, Genetic algorithms, Heat, Modeling, Optimization, Pressure, Stress

Proceedings Papers

Study on Periodic Thermal-Switching Behavior of Flat Heat Pipe

Shigeki Hirasawa, Tatsuya Nakamu, Tsuyoshi Kawanami, Katsuaki Shirai

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A001, November 13–19, 2015

Paper No: IMECE2015-50158

DOI: https://doi.org/10.1115/IMECE2015-50158

View Paper

Topics: Flat heat pipes, Heat, Condensers (steam plant), Heat transfer, Temperature, Switches, Computer simulation, Flow (Dynamics), Heat capacity, Heat pipes

Proceedings Papers

Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Rajesh Jha

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A023, November 13–19, 2015

Paper No: IMECE2015-52804

DOI: https://doi.org/10.1115/IMECE2015-52804

View Paper

Topics: Flat heat pipes, Temperature, Thin films, Airfoils, Circuits, Coating processes, Coatings, Cross section (Physics), Diamonds, Fins

Proceedings Papers

Passivation and Performance of Inorganic Aqueous Solutions in a Grooved, Aluminum Flat Heat Pipe

Michael Stubblebine, Ladan Amouzegar, Ivan Catton

Proc. ASME. IMECE2013, Volume 8C: Heat Transfer and Thermal Engineering, V08CT09A061, November 15–21, 2013

Paper No: IMECE2013-65641

DOI: https://doi.org/10.1115/IMECE2013-65641

View Paper

Topics: Aluminum, Flat heat pipes, Heat pipes, Water, Condensers (steam plant), Copper, Fluids, Heat, Weight (Mass), Aerospace industry

Proceedings Papers

An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold

Shailesh N. Joshi, Matthew J. Rau, Ercan M. Dede

Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A021, November 15–21, 2013

Paper No: IMECE2013-63249

DOI: https://doi.org/10.1115/IMECE2013-63249

View Paper

Topics: Manifolds, Vapors, Pressure, Coolants, Design, Flat heat pipes, Heat transfer coefficients, Heat transfer, Containment, Cooling

Proceedings Papers

Removing the Hot-Spots in High Power Devices Using the Thermoelectric Cooler and Micro Heat Pipe

Agat Hirachan, Dereje Agonafer

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1189-1195, November 9–15, 2012

Paper No: IMECE2012-89998

DOI: https://doi.org/10.1115/IMECE2012-89998

View Paper

Topics: Heat pipes, Thermoelectric coolers, Silicon, Cooling, Heat, Patents, Computer software, Copper, Electronic packaging, Flat heat pipes

2 3

NARROW

CFD and Experimental Investigation of Graphite Heat Spreader Based Cooling for Li-Ion Batteries for Electric Vehicles and EVTOL (Electric Vertical Take-Off and Landing) Aircraft Applications

Reliability of Underfill-Encapsulated Flip-Chip Packages

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Capillary Pumped Loop Heat Spreader for Electronics Cooling

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Time-Periodic Forced Convection in Micro Heat Spreaders

Cooling of a PWB With Irregular Populated Chips

Characterization of the Performance of Flat Heat Pipes for Electronics Cooling

Formulae to Size Axisymmetric Heat Spreaders Above Dielectric Layers

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting With Advanced Heat Spreader Technology

Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications

Study on Periodic Thermal-Switching Behavior of Flat Heat Pipe

Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots

Passivation and Performance of Inorganic Aqueous Solutions in a Grooved, Aluminum Flat Heat Pipe

An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold

Removing the Hot-Spots in High Power Devices Using the Thermoelectric Cooler and Micro Heat Pipe

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only