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Proceedings Papers

Strength Distribution and Size Effects for the Fracture of Fibrous Composite Materials

S. Leigh Phoenix, Irene J. Beyerlein

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 23-34, November 16–21, 1997

Paper No: IMECE1997-0706

DOI: https://doi.org/10.1115/IMECE1997-0706

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Topics: Fiber reinforced composites, Fracture (Materials), Size effect, Approximation, Breakdown (Electricity), Brittle fracture, Failure, Network models, Physics, Simulation

Proceedings Papers

Mechanisms for Size Effects in Bending of Fiber Composites

Stephen R. Swanson

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 49-57, November 16–21, 1997

Paper No: IMECE1997-0708

DOI: https://doi.org/10.1115/IMECE1997-0708

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Topics: Composite materials, Fibers, Compressive strength, Compression, Shear stress, Displacement, Failure, Size effect, Stress, Tension

Proceedings Papers

Scaling Effects in Composite Laminates Under Tensile, Flexural, and Compressive Loading

David P. Johnson, Joseph H. Felts, Michael T. Ho

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 59-66, November 16–21, 1997

Paper No: IMECE1997-0709

DOI: https://doi.org/10.1115/IMECE1997-0709

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Topics: Composite materials, Laminates, Design, Failure

Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997

Paper No: IMECE1997-0822

DOI: https://doi.org/10.1115/IMECE1997-0822

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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997

Paper No: IMECE1997-0816

DOI: https://doi.org/10.1115/IMECE1997-0816

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Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997

Paper No: IMECE1997-0810

DOI: https://doi.org/10.1115/IMECE1997-0810

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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997

Paper No: IMECE1997-1236

DOI: https://doi.org/10.1115/IMECE1997-1236

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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies

Proceedings Papers

Woven Fabric Composite Material Model With Material Nonlinearity for Nonlinear Finite Element Simulation

A. Tabiei, Y. Jiang

Proc. ASME. IMECE97, Crashworthiness, Occupant Protection and Biomechanics in Transportation Systems, 175-189, November 16–21, 1997

Paper No: IMECE1997-1195

DOI: https://doi.org/10.1115/IMECE1997-1195

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Topics: Composite materials, Finite element analysis, Simulation, Textiles, Stress, Stress-strain relations, Structural analysis, Constitutive equations, Crashworthiness, Failure

Proceedings Papers

Experimental Study of Automotive Brake System Temperatures

A. F. Emery, P. Kumar, J. C. Firey

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 55-64, November 16–21, 1997

Paper No: IMECE1997-1214

DOI: https://doi.org/10.1115/IMECE1997-1214

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Topics: Automotive brakes, Temperature, Brakes, Braking, Fluids, Boiling, Disks, Vehicles, Energy dissipation, Failure

Proceedings Papers

Numerical Characterization of the Viscoelastic Behavior of the Butyl Rubber in the Hybrid III Dummy Neck

Yih-Charng Deng, Xiaowei Li

Proc. ASME. IMECE97, Crashworthiness, Occupant Protection and Biomechanics in Transportation Systems, 291-314, November 16–21, 1997

Paper No: IMECE1997-1204

DOI: https://doi.org/10.1115/IMECE1997-1204

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Topics: Butyl rubber, Viscoelasticity, Rubber, Relaxation (Physics), Deformation, Elasticity, Failure, Stress

Proceedings Papers

Root Cause Investigation of the Centrifugal Compressor Pulsation/Vibration Problems

Roman W. Motriuk, Douglas P. Harvey

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume II, 483-489, November 16–21, 1997

Paper No: IMECE1997-0144

DOI: https://doi.org/10.1115/IMECE1997-0144

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Topics: Compressors, Vibration, Failure, Flow (Dynamics), Pipes, Blades, Diffusers, Impellers, Machinery, Boundary layers

Proceedings Papers

An Empirical Wear Projection Technology With Steam Generator Tube Applications and Relations to Work-Rate and Wear Simulations / Tests

Thomas M. Frick

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume II, 275-282, November 16–21, 1997

Paper No: IMECE1997-0121

DOI: https://doi.org/10.1115/IMECE1997-0121

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Topics: Boilers, Engineering simulation, Simulation, Wear, Vibration, Errors, Failure, Fluids, In-service inspection, Inspection

Proceedings Papers

Failure Mechanism of a Thermocouple Well Caused by Flow-Induced Vibration: (2) — Interaction Between Flow-Induced Vibration and Fatigue Crack Growth in a Thermocouple Well

Yusaku Wada, Masaki Morishita, Akira Yamaguchi, Koji Iwata, Masakazu Ichimiya

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 149-157, November 16–21, 1997

Paper No: IMECE1997-0054

DOI: https://doi.org/10.1115/IMECE1997-0054

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Topics: Failure mechanisms, Fatigue cracks, Flow-induced vibrations, Thermocouples, Fracture (Materials), Displacement, Failure, Damping, Fatigue, High cycle fatigue

Proceedings Papers

Flow-Induced Vibration Failure in a Steam Condenser and its Successful Redesign

A. Keith Escoe

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume II, 239-248, November 16–21, 1997

Paper No: IMECE1997-0117

DOI: https://doi.org/10.1115/IMECE1997-0117

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Topics: Condensers (steam plant), Failure, Flow-induced vibrations, Design, Collisions (Physics), Flow (Dynamics), Turbulence, Computation, Computer software, Consulting practices

Proceedings Papers

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

Ashraf -F. Bastawros, Kyung -S. Kim

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 139-144, November 16–21, 1997

Paper No: IMECE1997-0509

DOI: https://doi.org/10.1115/IMECE1997-0509

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Topics: Damage, Electric current, Fracture (Materials), Heating, Thin films, Aluminum, Electrodes, Temperature, Melting, Coating processes

Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997

Paper No: IMECE1997-0498

DOI: https://doi.org/10.1115/IMECE1997-0498

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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

2 3 4 5

NARROW

Strength Distribution and Size Effects for the Fracture of Fibrous Composite Materials

Mechanisms for Size Effects in Bending of Fiber Composites

Scaling Effects in Composite Laminates Under Tensile, Flexural, and Compressive Loading

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Design Considerations in Avionics Electronic Packaging

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Woven Fabric Composite Material Model With Material Nonlinearity for Nonlinear Finite Element Simulation

Experimental Study of Automotive Brake System Temperatures

Numerical Characterization of the Viscoelastic Behavior of the Butyl Rubber in the Hybrid III Dummy Neck

Root Cause Investigation of the Centrifugal Compressor Pulsation/Vibration Problems

An Empirical Wear Projection Technology With Steam Generator Tube Applications and Relations to Work-Rate and Wear Simulations / Tests

Failure Mechanism of a Thermocouple Well Caused by Flow-Induced Vibration: (2) — Interaction Between Flow-Induced Vibration and Fatigue Crack Growth in a Thermocouple Well

Flow-Induced Vibration Failure in a Steam Condenser and its Successful Redesign

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

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