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Proceedings Papers

An Autonomous System for the Active Control of Noise on a High Speed Patrol Craft

M. Dignan, G. Schudel, M. Sutterlin, D. Kewley
Proc. ASME. IMECE96, Noise Control and Acoustics: Volume 1 — Active Noise and Vibration Control; Complexity in Acoustics; Noise Sources in Internal Combustion Engines; Vehicle Flow/Structure Noises; Aeroacoustic Sound Propagation in Ducts and Jets; Turbomachinery Noise; BS/MS Student Paper Competition, 3-6, November 17–22, 1996
Paper No: IMECE1996-0502
https://doi.org/10.1115/IMECE1996-0502
View Paper titled, An Autonomous System for the Active Control of Noise on a High Speed Patrol Craft
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Topics: Noise (Sound), Propellers, Algorithms, Blades, Cables, Cavitation, Electronics, Feedback, Loudspeakers, Machinery
Proceedings Papers

Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates

Eric B. Zimmerman, Hisham Hegab, Gene T. Colwell
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 83-87, November 17–22, 1996
Paper No: IMECE1996-1006
https://doi.org/10.1115/IMECE1996-1006
View Paper titled, Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates
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Topics: Air flow, Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans
Proceedings Papers

High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems

Andrzej J. Przekwas, Mahesh M. Athavale, Yin-H. Ho
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 27-32, November 17–22, 1996
Paper No: IMECE1996-0999
https://doi.org/10.1115/IMECE1996-0999
View Paper titled, High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems
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Topics: Design, Electronics, Resolution (Optics), Computer simulation, Heat, Heat sinks, Computer cooling, Computers, Cooling, Defense industry
Proceedings Papers

Differential PWM Operated Solenoid Valves in the Pilot Stage of Mini Excavators: Modeling and Identification

S. Tafazoli, P. Peussa, P. D. Lawrence, S. E. Salcudean, C. W. de Silva
Proc. ASME. IMECE96, Fluid Power Systems and Technology, 93-99, November 17–22, 1996
Paper No: IMECE1996-0548
https://doi.org/10.1115/IMECE1996-0548
View Paper titled, Differential PWM Operated Solenoid Valves in the Pilot Stage of Mini Excavators: Modeling and Identification
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Topics: Modeling, Solenoids, Trenching machinery, Valves, Computer control, Dynamics (Mechanics), Electronics, Pressure, Pulse width modulation
Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

Thermal Management of Flip Chips on Printed Circuit Boards

Ron Zhang, Darrel Peugh, Bruce Myers
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 73-79, November 17–22, 1996
Paper No: IMECE1996-0892
https://doi.org/10.1115/IMECE1996-0892
View Paper titled, Thermal Management of Flip Chips on Printed Circuit Boards
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Topics: Flip-chip devices, Printed circuit boards, Thermal management, Ceramics, Electronics, Energy dissipation, Power density, Reliability, Shrinkage (Materials)
Proceedings Papers

Boundary Control of a Flexible Link Electrically Driven Gantry Robot

Catalin F. Baicu, Christopher D. Rahn, Darren M. Dawson
Proc. ASME. IMECE96, Active Control of Vibration and Noise, 109-115, November 17–22, 1996
Paper No: IMECE1996-0911
https://doi.org/10.1115/IMECE1996-0911
View Paper titled, Boundary Control of a Flexible Link Electrically Driven Gantry Robot
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Topics: Robots, Control equipment, Dynamics (Mechanics), Engines, Motors, Vibration, Boundary-value problems, Computer simulation, Damping, Electronics
Proceedings Papers

Numerical and Experimental Qualification of Seal Integrity of Rotary Shouldered Connections Under Combined Loads

Fei Song, Michael Du, Ke Li
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A039, October 30–November 3, 2022
Paper No: IMECE2022-96180
https://doi.org/10.1115/IMECE2022-96180
View Paper titled, Numerical and Experimental Qualification of Seal Integrity of Rotary Shouldered Connections Under Combined Loads
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Topics: Finite element analysis, Stress, Drilling, Computer simulation, Leakage, Pressure, Screw threads, Thread, Bits (Tools), Chain
Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997
Paper No: IMECE1997-0815
https://doi.org/10.1115/IMECE1997-0815
View Paper titled, Low Cost Plastic Packaging of the Network Interface Unit
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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging
Proceedings Papers

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

B. P. van Drieënhuizen, N. I. Maluf
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 9-12, November 16–21, 1997
Paper No: IMECE1997-0931
https://doi.org/10.1115/IMECE1997-0931
View Paper titled, High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching
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Topics: Accelerometers, Bonding, Crystals, Reactive-ion etching, Resolution (Optics), Silicon, Noise (Sound), Complementary metal oxide semiconductors, Brownian motion, Electronics
Proceedings Papers

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Arun Majumdar, John Varesi
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 171-179, November 16–21, 1997
Paper No: IMECE1997-0955
https://doi.org/10.1115/IMECE1997-0955
View Paper titled, Nanoscale Thermometry Using Scanning Joule Expansion Microscopy
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Topics: Joules, Microscopy, Nanoscale phenomena, Temperature measurement, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals, Temperature distribution
Proceedings Papers

Integrated Electromechanical Devices for Active Control of Vibration and Sound

Eric H. Anderson, Mark D. Holcomb, Donald J. Leo, Adam X. Bogue, Farla R. Russo
Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 67-80, November 16–21, 1997
Paper No: IMECE1997-0179
https://doi.org/10.1115/IMECE1997-0179
View Paper titled, Integrated Electromechanical Devices for Active Control of Vibration and Sound
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Topics: Electromechanical devices, Vibration, Design, Electronics, Transducers, Actuators, Flexible electronics, Noise control, Piezoelectric ceramics, Piezoelectric materials
Proceedings Papers

Power Flow Analysis of an Electrostrictive Actuator Driven by a PWM Amplifier

Gregory A. Zvonar, Douglas K. Lindner
Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 155-162, November 16–21, 1997
Paper No: IMECE1997-0189
https://doi.org/10.1115/IMECE1997-0189
View Paper titled, Power Flow Analysis of an Electrostrictive Actuator Driven by a PWM Amplifier
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Topics: Actuators, Flow (Dynamics), Control equipment, Dynamic models, Design, Electricity (Physics), Electronics
Proceedings Papers

A Review of Changes and Trends Affecting Military Electronics Manufacturing

Anthony J. Rafanelli
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 447-451, November 16–21, 1997
Paper No: IMECE1997-1122
https://doi.org/10.1115/IMECE1997-1122
View Paper titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes, US Department of Defense
Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997
Paper No: IMECE1997-1082
https://doi.org/10.1115/IMECE1997-1082
View Paper titled, Active Structural Control of Vertical Turning Lathe Vibrations
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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components
Proceedings Papers

Video Based Manufacturing Courses for Electronics

John A. Fillo, Chittaranjan Sahay, Krishnaswami Srihari
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 471-477, November 16–21, 1997
Paper No: IMECE1997-1126
https://doi.org/10.1115/IMECE1997-1126
View Paper titled, Video Based Manufacturing Courses for Electronics
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Topics: Electronics, Manufacturing, Defense industry, Packaging, Students, Wire
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-1221
https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Paper No: IMECE1997-1231
https://doi.org/10.1115/IMECE1997-1231
View Paper titled, Testing and Measurement Techniques Applied to Electronic Packaging Development
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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

Mixture Flow Pattern Recognition Based Upon On-Line Analysis of Physical Parameters

Brian E. Williams, Alice B. Soulek
Proc. ASME. IMECE97, Advances in Bioengineering, 5, November 16–21, 1997
Paper No: IMECE1997-0200
https://doi.org/10.1115/IMECE1997-0200
View Paper titled, Mixture Flow Pattern Recognition Based Upon On-Line Analysis of Physical Parameters
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Topics: Flow (Dynamics), Pattern recognition, Fluids, Dynamics (Mechanics), Pressure, Bioengineering, Blood, Computer-aided engineering, Design, Electronics