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Proceedings Papers

Measurement of Leadframe Strain in Electrically Active Power Semiconductors

Seth M. Avery, Robert D. Lorenz
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A018, November 13–19, 2015
Paper No: IMECE2015-50357
DOI: https://doi.org/10.1115/IMECE2015-50357
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Topics: Deformation, Displacement, Displacement measurement, Electronic speckle pattern interferometry, Modeling, Noise (Sound), Power semiconductor devices, Resolution (Optics), Strain measurement, Stress
Proceedings Papers

Measuring Stress and Strain Fields in Connecting Rods Using Laser Interferometry (ESPI)

Bruno F. Vaz, Rafael A. L. e Silva, Auteliano A. S. Junior
Proc. ASME. IMECE2011, Volume 9: Transportation Systems; Safety Engineering, Risk Analysis and Reliability Methods; Applied Stochastic Optimization, Uncertainty and Probability, 253-262, November 11–17, 2011
Paper No: IMECE2011-63936
DOI: https://doi.org/10.1115/IMECE2011-63936
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Topics: Electronic speckle pattern interferometry, Interferometry, Lasers, Rods, Stress, Experimental design, Automotive industry, Computer simulation, Design, Engineering simulation
Proceedings Papers

Full Field ESPI Vibration Measurements to Predict Fatigue Behavior

Alessandro Zanarini
Proc. ASME. IMECE2008, Volume 1: Advances in Aerospace Technology, 165-174, October 31–November 6, 2008
Paper No: IMECE2008-68727
DOI: https://doi.org/10.1115/IMECE2008-68727
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Topics: Electronic speckle pattern interferometry, Fatigue, Vibration measurement, Durability, Aluminum, Constitutive equations, Density, Displacement, Fatigue life, Modeling
Proceedings Papers

Application of the Electronic Speckle Pattern Interferometry (ESPI) Technique for the Localisation Analysis of Damage Development in Composites

Pascal J. P. Bouquet, Albert H. Cardon
Proc. ASME. IMECE2002, Nondestructive Evaluation, 11-18, November 17–22, 2002
Paper No: IMECE2002-33448
DOI: https://doi.org/10.1115/IMECE2002-33448
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Topics: Composite materials, Creep, Damage, Electronic speckle pattern interferometry
Proceedings Papers

Investigative Study of Local Sherwood Numbers Using Phase Measurement Interferometry

David McGuire, Tara M. Dalton, Mark R. Davies
Proc. ASME. IMECE2004, Fluids Engineering, 513-520, November 13–19, 2004
Paper No: IMECE2004-59772
DOI: https://doi.org/10.1115/IMECE2004-59772
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Topics: Air flow, Algorithms, Boundary layers, Chemical reactions, Corrosion, Design, Diffusion (Physics), Electronic speckle pattern interferometry, Ethanol, Evaporation
Proceedings Papers

Using Electric Speckle Pattern Interferometry (ESPI) for the Measurement of Concentration Profiles Within a Binary Mixture

David C. McGuire, Tara M. Dalton, Mark R. Davies
Proc. ASME. IMECE2004, Fluids Engineering, 521-526, November 13–19, 2004
Paper No: IMECE2004-59775
DOI: https://doi.org/10.1115/IMECE2004-59775
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Topics: Electronic speckle pattern interferometry, Interferometry, Interferometers, Fluids, Algorithms, Construction, Mass transfer, Optics
Proceedings Papers

Analytical and Experimental Studies of Orthotropic Corner-Supported Plates With Segmented In-Plane Actuators

Hartono Sumali, Jordan E. Massad, Philip L. Reu, Pavel M. Chaplya, Jeffrey W. Martin
Proc. ASME. IMECE2005, Dynamic Systems and Control, Parts A and B, 197-202, November 5–11, 2005
Paper No: IMECE2005-80962
DOI: https://doi.org/10.1115/IMECE2005-80962
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Topics: Actuators, Corners (Structural elements), Plates (structures), Laminates, Boundary-value problems, Deflection, Electronic speckle pattern interferometry, Shapes
Proceedings Papers

Functionally Graded Nanocomposites: Manufacturing and Characterization

Jared A. Rud, Yuri M. Shkel, Donald R. Matthys, Jeffrey P. Davidson
Proc. ASME. IMECE2006, Aerospace, 507-512, November 5–10, 2006
Paper No: IMECE2006-14623
DOI: https://doi.org/10.1115/IMECE2006-14623
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Topics: Carbon, Composite materials, Electric fields, Electronic speckle pattern interferometry, Epoxy adhesives, Epoxy resins, Fibers, Manufacturing, Materials properties, Nanocomposites