1-20 of 74
Electronic packages
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems

Andrzej J. Przekwas, Mahesh M. Athavale, Yin-H. Ho
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 27-32, November 17–22, 1996
Paper No: IMECE1996-0999
https://doi.org/10.1115/IMECE1996-0999
View Paper titled, High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems
Open the PDF for High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems in another window
Topics: Design, Electronics, Resolution (Optics), Computer simulation, Heat, Heat sinks, Computer cooling, Computers, Cooling, Defense industry
Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures?

E. Suhir, Q. S. M. Ilyas
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 101-125, November 17–22, 1996
Paper No: IMECE1996-0725
https://doi.org/10.1115/IMECE1996-0725
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures?
Open the PDF for “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures? in another window
Topics: Failure, Membranes, Molding, Stress, Bending (Stress), Electronic packages, Structural analysis
Proceedings Papers

The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages

Zhenfeng Guo, Thomas J. Gher, Cynthia T. Sarafids, George K. Lucey
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 179-198, November 17–22, 1996
Paper No: IMECE1996-0786
https://doi.org/10.1115/IMECE1996-0786
View Paper titled, The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages
Open the PDF for The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages in another window
Topics: Electronic packages, Solders, Tin, Creep, Deformation, Alloys, Atoms, Electrons, Indium alloys, Shear (Mechanics)
Proceedings Papers

An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages

Zhenfeng Guo
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 199-220, November 17–22, 1996
Paper No: IMECE1996-0787
https://doi.org/10.1115/IMECE1996-0787
View Paper titled, An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages
Open the PDF for An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages in another window
Topics: Electronic packages, Fatigue, Solder joints, Fracture (Process), Temperature, Tin, Failure, Failure mechanisms, Fatigue cracks, Fatigue failure
Proceedings Papers

Curing Analysis of a Flip-Chip-on-Board Electronic Package

Wen C. Zheng
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 13-22, November 17–22, 1996
Paper No: IMECE1996-0885
https://doi.org/10.1115/IMECE1996-0885
View Paper titled, Curing Analysis of a Flip-Chip-on-Board Electronic Package
Open the PDF for Curing Analysis of a Flip-Chip-on-Board Electronic Package in another window
Topics: Electronic packages, Hardening (Curing), Epoxy adhesives, Epoxy resins, Manufacturing, Finite element methods, Finite element model, Temperature, Chemical reactions, Computer simulation
Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997
Paper No: IMECE1997-0816
https://doi.org/10.1115/IMECE1997-0816
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures
Open the PDF for “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures in another window
Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis
Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997
Paper No: IMECE1997-0810
https://doi.org/10.1115/IMECE1997-0810
View Paper titled, Design Considerations in Avionics Electronic Packaging
Open the PDF for Design Considerations in Avionics Electronic Packaging in another window
Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging
Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997
Paper No: IMECE1997-0853
https://doi.org/10.1115/IMECE1997-0853
View Paper titled, Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package
Open the PDF for Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package in another window
Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Paper No: IMECE1997-1111
https://doi.org/10.1115/IMECE1997-1111
View Paper titled, Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package
Open the PDF for Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package in another window
Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Paper No: IMECE1997-1231
https://doi.org/10.1115/IMECE1997-1231
View Paper titled, Testing and Measurement Techniques Applied to Electronic Packaging Development
Open the PDF for Testing and Measurement Techniques Applied to Electronic Packaging Development in another window
Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997
Paper No: IMECE1997-1233
https://doi.org/10.1115/IMECE1997-1233
View Paper titled, A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry
Open the PDF for A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry in another window
Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip
Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997
Paper No: IMECE1997-1220
https://doi.org/10.1115/IMECE1997-1220
View Paper titled, Advances in Stress Test Chips
Open the PDF for Advances in Stress Test Chips in another window
Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
Open the PDF for Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry in another window
Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
Open the PDF for Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC in another window
Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997
Paper No: IMECE1997-0501
https://doi.org/10.1115/IMECE1997-0501
View Paper titled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill
Open the PDF for Potential Failure Sites in a Flip-Chip Package With and Without Underfill in another window
Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis
Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997
Paper No: IMECE1997-0676
https://doi.org/10.1115/IMECE1997-0676
View Paper titled, Process Modeling and Interfacial Behavior in the VSPA Package
Open the PDF for Process Modeling and Interfacial Behavior in the VSPA Package in another window
Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
Open the PDF for Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages in another window
Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998
Paper No: IMECE1998-0435
https://doi.org/10.1115/IMECE1998-0435
View Paper titled, Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling
Open the PDF for Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling in another window
Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Paper No: IMECE1999-0922
https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
Open the PDF for Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages in another window
Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001
Paper No: IMECE2001/HTD-24377
https://doi.org/10.1115/IMECE2001/HTD-24377
View Paper titled, Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits
Open the PDF for Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits in another window
Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)