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Proceedings Papers

Stacking Sequence Effects on the Process-Induced Free-Edge Stresses in Thermoplastic Composite Laminates

Moshe M. Domb, Jorn S. Hansen

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 93-98, November 16–21, 1997

Paper No: IMECE1997-0712

DOI: https://doi.org/10.1115/IMECE1997-0712

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Topics: Laminates, Stress, Thermoplastic composites, Cooling, Cycles, Residual stresses, Annealing, Computer simulation, Design, Fracture (Materials)

Proceedings Papers

Comparison of Fretting Fatigue Crack Nucleation Experiments to Multiaxial Fatigue Theory Life Predictions

Matthew P. Szolwinski, G. Harish, Thomas N. Farris

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 449-457, November 16–21, 1997

Paper No: IMECE1997-0745

DOI: https://doi.org/10.1115/IMECE1997-0745

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Topics: Fatigue, Fatigue cracks, Nucleation (Physics), Stress, Fracture (Materials), Cycles, Aircraft, Aluminum alloys, Disks, Failure mechanisms

Proceedings Papers

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Qing Wang, Ming-Liang Du, Fu-Pen Chiang

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 459-465, November 16–21, 1997

Paper No: IMECE1997-0746

DOI: https://doi.org/10.1115/IMECE1997-0746

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Topics: Fracture (Materials), Micromechanics (Engineering), Steel, Stress, Fatigue, Deformation, Displacement, Carbon steel, Crack propagation, Cycles

Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997

Paper No: IMECE1997-0822

DOI: https://doi.org/10.1115/IMECE1997-0822

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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Proceedings Papers

Comparison of Different Solder Systems Based on Propensity for Damage

Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 243-248, November 16–21, 1997

Paper No: IMECE1997-0823

DOI: https://doi.org/10.1115/IMECE1997-0823

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Topics: Damage, Solders, Stress, Temperature, Cycles, Fatigue, Fatigue life, Finite element methods, Alloys, Eutectic alloys

Proceedings Papers

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Waldyr L. R. Gallo, Jorge Llagostera, Arnaldo C. S. Walter

Proc. ASME. IMECE97, Advanced Energy Systems, 231-238, November 16–21, 1997

Paper No: IMECE1997-0993

DOI: https://doi.org/10.1115/IMECE1997-0993

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Topics: Cycles, Fuels, Thermoeconomics, Water, Compressors, Pressure, Alloys, Blades, Cooling, Economic analysis

Proceedings Papers

Lumped Parameter Thermodynamic and Heat Transfer Modeling of a Scroll Pump

Sankar Sunder, Joseph L. Smith, Jr.

Proc. ASME. IMECE97, Advanced Energy Systems, 417-427, November 16–21, 1997

Paper No: IMECE1997-1015

DOI: https://doi.org/10.1115/IMECE1997-1015

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Topics: Heat transfer, Modeling, Pumps, Compression, Cycles, Displacement, Engines, Flow (Dynamics), Geometry, Heat conduction

Proceedings Papers

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

Keith E. Herold

Proc. ASME. IMECE97, Advanced Energy Systems, 349-356, November 16–21, 1997

Paper No: IMECE1997-1007

DOI: https://doi.org/10.1115/IMECE1997-1007

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Topics: Absorption, Heat pumps, Heat, Temperature, Cycles, Machinery, Heat transfer, Machine design, Modeling, Shapes

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Recurrent Artificial Neural Networks for Crashworthiness Analysis

Tarek A. Omar, Nabih E. Bedewi, Azim Eskandarian

Proc. ASME. IMECE97, Crashworthiness, Occupant Protection and Biomechanics in Transportation Systems, 109-118, November 16–21, 1997

Paper No: IMECE1997-1190

DOI: https://doi.org/10.1115/IMECE1997-1190

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Topics: Artificial neural networks, Crashworthiness, Displacement, Simulation, Vehicles, Finite element analysis, Cycles, Dynamic systems, Dynamics (Mechanics), Equations of motion

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997

Paper No: IMECE1997-0498

DOI: https://doi.org/10.1115/IMECE1997-0498

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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Sam Y. Zamrik, Mark L. Renauld

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 333-345, November 16–21, 1997

Paper No: IMECE1997-0549

DOI: https://doi.org/10.1115/IMECE1997-0549

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Topics: Fatigue life, Gas turbines, Thermomechanics, Cycles, Temperature, Creep, Fatigue, Nickel, Superalloys

Proceedings Papers

On the Performance vs. Energy Consumption Tradeoff With Semi-Active Vibration Control Using an MR-Fluid Damper

Jin Kyoo Lee, William W. Clark, Sung Hwan Kim

Proc. ASME. IMECE97, Active/Passive Vibration Control and Nonlinear Dynamics of Structures, 55-60, November 16–21, 1997

Paper No: IMECE1997-0559

DOI: https://doi.org/10.1115/IMECE1997-0559

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Topics: Dampers, Energy consumption, Fluids, Tradeoffs, Vibration control, Vibration, Cycles, Excitation, Vibration suppression

Proceedings Papers

A Simple Method for Estimating Railcar Wheel Tread Temperature Rise During Braking

G. J. Moyar, F. G. Carlson

Proc. ASME. IMECE97, Rail Transportation, 65-74, November 16–21, 1997

Paper No: IMECE1997-0594

DOI: https://doi.org/10.1115/IMECE1997-0594

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Topics: Braking, Temperature, Wheels, Drag (Fluid dynamics), Trains, Brakes, Computational methods, Computer software, Cycles, Engineering simulation

Proceedings Papers

Semi-Empirical Process Modeling: Model and Database Integration

H. P. Wang, Erin M. Perry, Martin K. Lee

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 51-65, November 16–21, 1997

Paper No: IMECE1997-0619

DOI: https://doi.org/10.1115/IMECE1997-0619

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Topics: Databases, Modeling, Plastics, Tooling, Cycles, Design, Engineers, Extruding, Injection molding, Product design

Proceedings Papers

Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts

Shia-Chung Chen, Nien-Tien Cheng, Sheng-Yan Hu

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 15-32, November 16–21, 1997

Paper No: IMECE1997-0617

DOI: https://doi.org/10.1115/IMECE1997-0617

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Topics: Engineering simulation, Molding, Simulation, Warping, Geometry, Algorithms, Boundary element methods, Computer-aided engineering, Cooling, Cycles

2 3 4 5

NARROW

Stacking Sequence Effects on the Process-Induced Free-Edge Stresses in Thermoplastic Composite Laminates

Comparison of Fretting Fatigue Crack Nucleation Experiments to Multiaxial Fatigue Theory Life Predictions

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Comparison of Different Solder Systems Based on Propensity for Damage

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Lumped Parameter Thermodynamic and Heat Transfer Modeling of a Scroll Pump

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

Testing and Measurement Techniques Applied to Electronic Packaging Development

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Recurrent Artificial Neural Networks for Crashworthiness Analysis

Transient Thermal Analysis of Outdoor Electronic Equipment

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

On the Performance vs. Energy Consumption Tradeoff With Semi-Active Vibration Control Using an MR-Fluid Damper

A Simple Method for Estimating Railcar Wheel Tread Temperature Rise During Braking

Semi-Empirical Process Modeling: Model and Database Integration

Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts

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