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Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

Proceedings Papers

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Sam Y. Zamrik, Mark L. Renauld

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 333-345, November 16–21, 1997

Paper No: IMECE1997-0549

DOI: https://doi.org/10.1115/IMECE1997-0549

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Topics: Fatigue life, Gas turbines, Thermomechanics, Cycles, Temperature, Creep, Fatigue, Nickel, Superalloys

Proceedings Papers

Effect of Suspension Nonlinearities on Rail Vehicle Bifurcation and Stability

Mehdi Ahmadian, Shaopu Yang

Proc. ASME. IMECE97, Rail Transportation, 97-106, November 16–21, 1997

Paper No: IMECE1997-0598

DOI: https://doi.org/10.1115/IMECE1997-0598

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Topics: Bifurcation, Rail vehicles, Stability, Damping, Creep, Trucks, Yaw, Dynamics (Mechanics), Rails, Simulation results

Proceedings Papers

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

G. Sathyanarayanan, Louis J. Plebani, Hsueh-Ming S. Wang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 411-415, November 16–21, 1997

Paper No: IMECE1997-0694

DOI: https://doi.org/10.1115/IMECE1997-0694

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Topics: Creep, Finishes, Grinding, Bending strength, Stress, Ceramics, Design, Fracture (Materials), Reliability, Surface roughness

Proceedings Papers

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Ramesh Talreja

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 151-156, November 16–21, 1997

Paper No: IMECE1997-0659

DOI: https://doi.org/10.1115/IMECE1997-0659

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Topics: Composite materials, Damage mechanics, Durability, Creep, Damage, Fatigue life, Geometry, Metals, Testing

Proceedings Papers

Densification in Heterogeneous Powder Mixtures by Creep

Antonios Zavaliangos

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 25-36, November 16–21, 1997

Paper No: IMECE1997-0648

DOI: https://doi.org/10.1115/IMECE1997-0648

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Topics: Creep, External pressure, Powder metallurgy, Pressure

Proceedings Papers

Crack Tip Stress Fields and Creep Crack Growth of Interface Cracks in Functionally Graded/Layered Materials

S. B. Biner

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 45-55, November 16–21, 1997

Paper No: IMECE1997-0650

DOI: https://doi.org/10.1115/IMECE1997-0650

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Topics: Creep, Fracture (Materials), Stress, Cavitation, Cavities, Steady state

Proceedings Papers

Test Methods and Accelerated Testing for Life Prediction of Composite Systems

Kenneth L. Reifsnider

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 213-221, November 16–21, 1997

Paper No: IMECE1997-0667

DOI: https://doi.org/10.1115/IMECE1997-0667

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Topics: Composite materials, Testing, Constants (Physics), Damage, Durability, Stress, Creep, Fatigue, Fracture (Materials), Fracture (Process)

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Dynamic and Transient Nonlinear Behavior of Articular Cartilage in Unconfined Compression

M. Fortin, J. Soulhat, A. Shirazi-Adl, E. B. Hunziker, M. D. Buschmann

Proc. ASME. IMECE97, Advances in Bioengineering, 199-200, November 16–21, 1997

Paper No: IMECE1997-0297

DOI: https://doi.org/10.1115/IMECE1997-0297

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Topics: Cartilage, Compression, Transients (Dynamics), Stress, Biological tissues, Displacement, Testing, Compressive stress, Creep, Equilibrium (Physics)

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Finite Element Modeling of Scleral Creep and Ocular Elongation in Deprivation-Induced Myopia

Jerry D. Grissom, John T. Siegwart, Jr., Alan W. Eberhardt

Proc. ASME. IMECE97, Advances in Bioengineering, 123-124, November 16–21, 1997

Paper No: IMECE1997-0259

DOI: https://doi.org/10.1115/IMECE1997-0259

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Topics: Creep, Elongation, Finite element analysis, Modeling, Feedback

Proceedings Papers

Gas Transport by Thermal Transpiration in Micro-Channels: A Numerical Study

C. Channy Wong, Mary L. Hudson, Donald L. Potter, Tim J. Bartel

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 223-230, November 15–20, 1998

Paper No: IMECE1998-1246

DOI: https://doi.org/10.1115/IMECE1998-1246

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Topics: Microchannels, Transpiration, Design, Flow (Dynamics), Pressure, Creep, Microelectromechanical systems, Simulation, Temperature, Temperature gradient

Proceedings Papers

MEMS Testing Techniques for Long-Term Stability

Stuart Brown, Christopher Muhlstein, Cameron Abnet, Clarence Chui

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 145, November 15–20, 1998

Paper No: IMECE1998-1150

DOI: https://doi.org/10.1115/IMECE1998-1150

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Topics: Microelectromechanical systems, Stability, Testing, Creep, Elasticity, Fatigue cracks, Fracture toughness, Governments, Mechanical properties, Mechanical testing

Proceedings Papers

Influence of Multiple Fiber Breaks on Stresses in a Fiber Composite With a Creeping Matrix

Irene J. Beyerlein

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 205-206, November 15–20, 1998

Paper No: IMECE1998-1175

DOI: https://doi.org/10.1115/IMECE1998-1175

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Topics: Composite materials, Fibers, Stress, Creep, Fracture (Materials), Temperature, Tension, Bearings, Ceramic composites, Computational mechanics

Proceedings Papers

Time-Dependent Degradation in Fiber Composites due to Multiple Constituent Degradation Mechanisms

N. Iyengar, S. W. Case, H. G. Halverson, W. A. Curtin

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 73, November 15–20, 1998

Paper No: IMECE1998-0362

DOI: https://doi.org/10.1115/IMECE1998-0362

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Topics: Composite materials, Fibers, Failure, Creep, Fracture (Materials), Stress, Damage, Deformation, Fiber reinforced composites, Temperature

Proceedings Papers

Discrepancies Between High Temperature Fatigue Life Prediction Models

Abbas A. Moftakhar

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 135-143, November 15–20, 1998

Paper No: IMECE1998-0371

DOI: https://doi.org/10.1115/IMECE1998-0371

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Topics: Fatigue life, High temperature, Creep, Rupture, Compressive stress, Damage, Electromagnetic scattering, Fatigue, Heat, Pressure vessels

Proceedings Papers

Analysis and Control of Mesoscale Actuator Systems

Edward Kiely, Gregory Washington, Jun-Kyung Song

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 95-102, November 15–20, 1998

Paper No: IMECE1998-0943

DOI: https://doi.org/10.1115/IMECE1998-0943

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Topics: Actuators, Deflection, Design, Microscale devices, Piezoelectric materials, Control modeling, Creep, Displacement, Energy consumption, Hardware

2 3 4 5

NARROW

Thermal Mechanical Properties of Two Solder Alloys

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Effect of Suspension Nonlinearities on Rail Vehicle Bifurcation and Stability

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Densification in Heterogeneous Powder Mixtures by Creep

Crack Tip Stress Fields and Creep Crack Growth of Interface Cracks in Functionally Graded/Layered Materials

Test Methods and Accelerated Testing for Life Prediction of Composite Systems

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Dynamic and Transient Nonlinear Behavior of Articular Cartilage in Unconfined Compression

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Finite Element Modeling of Scleral Creep and Ocular Elongation in Deprivation-Induced Myopia

Gas Transport by Thermal Transpiration in Micro-Channels: A Numerical Study

MEMS Testing Techniques for Long-Term Stability

Influence of Multiple Fiber Breaks on Stresses in a Fiber Composite With a Creeping Matrix

Time-Dependent Degradation in Fiber Composites due to Multiple Constituent Degradation Mechanisms

Discrepancies Between High Temperature Fatigue Life Prediction Models

Analysis and Control of Mesoscale Actuator Systems

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