Topics: Machinery, Materials characterization, Microelectromechanical systems, Testing, Thin films, Displacement, Aluminum, Copper foil, Fibers, Force measurement

Topics: Design, Generators, Water, Heat, Bodies of water, Energy generation, Heat transfer, Temperature, Absorption, Copper foil

Topics: Graphene, Strain sensors, Chemical vapor deposition, Sensors, Plasma desorption mass spectrometry, Stress concentration, Copper foil, Design, Electrodes, Manufacturing

Topics: Graphene, Transistors, Temperature, Chemical vapor deposition, Silicon, Brightness (Photometry), Cathode ray oscilloscopes, Copper foil, Electrodes, Electron beams

Topics: Graphene, Strain sensors, Copper, Reactive-ion etching, Copper foil, Crystals, Diluents, Hydrogen, Microelectromechanical systems, Plasma desorption mass spectrometry

Topics: Carbon nanotubes, Composite materials, Damage, Electrodes, Epoxy resins, Electrical resistivity, Disks, Finite element methods, Glass, Textiles

Topics: Chemical vapor deposition, Graphene, Density, Nucleation (Physics), Reactive-ion etching, Copper foil, Gages, Grain size, Photolithography, Plasma desorption mass spectrometry

Topics: Manufacturing, Sheet metal, Die cutting, Micromachining, Shearing (Deformation), Aluminum, Copper foil, Grain size, Microelectromechanical systems, Shapes

Topics: Bulk solids, Clearances (Engineering), Computer software, Copper foil, Crystals, Die cutting, Finite element analysis, Finite element model, Flow (Dynamics), Grain size

Topics: Control equipment, Copper, Copper foil, Flow (Dynamics), Gates (Closures), Lamination, Lasers, Modeling, Packaging, Solder masks

Topics: Epoxy resins, Sprays, Copper, Methanol, Copper foil, Failure, Film thickness, Fracture (Materials), Fracture (Process), Tradeoffs

Topics: Electromagnetic radiation, Vibration, Springs, Magnets, Manufacturing, Simulation, Stress, Circuits, Copper foil, Design