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Proceedings Papers

Electromagnetic Moving Armature Actuators for Active Vibration Control

Bruce S. Murray, Richard Madden, E. Frank Berkman
Proc. ASME. IMECE96, Noise Control and Acoustics: Volume 1 — Active Noise and Vibration Control; Complexity in Acoustics; Noise Sources in Internal Combustion Engines; Vehicle Flow/Structure Noises; Aeroacoustic Sound Propagation in Ducts and Jets; Turbomachinery Noise; BS/MS Student Paper Competition, 7-13, November 17–22, 1996
Paper No: IMECE1996-0503
https://doi.org/10.1115/IMECE1996-0503
View Paper titled, Electromagnetic Moving Armature Actuators for Active Vibration Control
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Topics: Actuators, Vibration control, Cooling, Feedback, Frequency response, Generators, Knudsen number, Stability, Transducers, Vibration
Proceedings Papers

Study of Foam Sheet Formation: Part III — Effects of Foam Thickness and Cell Density

S. T. Lee, N. S. Ramesh
Proc. ASME. IMECE96, Cellular and Microcellular Materials, 71-80, November 17–22, 1996
Paper No: IMECE1996-1409
https://doi.org/10.1115/IMECE1996-1409
View Paper titled, Study of Foam Sheet Formation: Part III — Effects of Foam Thickness and Cell Density
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Topics: Density, Bubbles, Rheology, Cooling, Diffusion (Physics), Evaporation, Foams (Chemistry), High pressure (Physics), Low density polyethylene, Modeling
Proceedings Papers

Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates

Eric B. Zimmerman, Hisham Hegab, Gene T. Colwell
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 83-87, November 17–22, 1996
Paper No: IMECE1996-1006
https://doi.org/10.1115/IMECE1996-1006
View Paper titled, Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates
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Topics: Air flow, Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans
Proceedings Papers

Thermal Analysis of Compact Electronic Equipment With Cooling Fan

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Sadao Makita
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 89-92.1, November 17–22, 1996
Paper No: IMECE1996-1007
https://doi.org/10.1115/IMECE1996-1007
View Paper titled, Thermal Analysis of Compact Electronic Equipment With Cooling Fan
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Topics: Cooling, Electronic equipment, Thermal analysis, Heat conduction, Numerical analysis, Air flow, Computer simulation, Computers, Finite volume methods, Printed circuit boards
Proceedings Papers

High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems

Andrzej J. Przekwas, Mahesh M. Athavale, Yin-H. Ho
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 27-32, November 17–22, 1996
Paper No: IMECE1996-0999
https://doi.org/10.1115/IMECE1996-0999
View Paper titled, High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems
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Topics: Design, Electronics, Resolution (Optics), Computer simulation, Heat, Heat sinks, Computer cooling, Computers, Cooling, Defense industry
Proceedings Papers

Thermal Control Subsystem Design for the Avionics of a Space Station Payload

Matthew E. Moran
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 93-107, November 17–22, 1996
Paper No: IMECE1996-1008
https://doi.org/10.1115/IMECE1996-1008
View Paper titled, Thermal Control Subsystem Design for the Avionics of a Space Station Payload
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Topics: Avionics, Design, Space stations, Temperature, Conceptual design, Cooling, Cycles, Hardware, Measurement systems, Modeling
Proceedings Papers

The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates

B. Chandran, W. F. Schmidt, M. H. Gordon, R. Djkaria
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 61-66, November 17–22, 1996
Paper No: IMECE1996-1003
https://doi.org/10.1115/IMECE1996-1003
View Paper titled, The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates
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Topics: Creep, Diamonds, Gallium arsenide, Solders, Bonding, Cooling, Stress, Fracture (Process), Relaxation (Physics), Fracture toughness
Proceedings Papers

Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling

Jiansen Zhu, Daqing Zou, Sheng Liu, Jim Benson
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 141-148, November 17–22, 1996
Paper No: IMECE1996-0728
https://doi.org/10.1115/IMECE1996-0728
View Paper titled, Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling
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Topics: Finite element analysis, High temperature, Interferometry, Modeling, Cooling, Finite element model, Cross section (Physics), Delamination, Diffraction gratings, Temperature
Proceedings Papers

Combustors for Micro-Gas Turbine Engines

Ian A. Waitz, Gautam Gauba, Yang-Sheng Tzeng
Proc. ASME. IMECE96, Aerospace, 777-788, November 17–22, 1996
Paper No: IMECE1996-0694
https://doi.org/10.1115/IMECE1996-0694
View Paper titled, Combustors for Micro-Gas Turbine Engines
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Topics: Combustion chambers, Gas turbines, Combustion, Hydrogen, Ceramics, Cooling, Design, Flames, Fossil fuels, Heat transfer
Proceedings Papers

Measurement of Water Transport During Freezing Using Differential Scanning Calorimetry

Ramachandra V. Devireddy, Debopam Raha, John C. Bischof
Proc. ASME. IMECE96, Advances in Heat and Mass Transfer in Biotechnology, 37-42, November 17–22, 1996
Paper No: IMECE1996-0748
https://doi.org/10.1115/IMECE1996-0748
View Paper titled, Measurement of Water Transport During Freezing Using Differential Scanning Calorimetry
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Topics: Differential scanning calorimetry, Freezing, Water, Biological tissues, Liver, Cooling, Fittings, Heat, Ice, Microscopy
Proceedings Papers

Optimal Cryopreservation Protocol Design for Pancreas Islets

Robson Cintra de Freitas, Kenneth R. Diller
Proc. ASME. IMECE96, Advances in Heat and Mass Transfer in Biotechnology, 7, November 17–22, 1996
Paper No: IMECE1996-0739
https://doi.org/10.1115/IMECE1996-0739
View Paper titled, Optimal Cryopreservation Protocol Design for Pancreas Islets
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Topics: Cryonics, Design, Temperature, Cooling, Ice, Optimization, Probability
Proceedings Papers

Modeling and Performance Comparison of a Refrigerant Cooled Liquid Desiccant Absorber With a Conventional Refrigerant Cooled Cooling Coil

Arshad Y. Khan, Eliud Robles, Fernando J. Sulsona
Proc. ASME. IMECE96, Advances in Energy Efficiency, Heat/Mass Transfer Enhancement, 1-6, November 17–22, 1996
Paper No: IMECE1996-0755
https://doi.org/10.1115/IMECE1996-0755
View Paper titled, Modeling and Performance Comparison of a Refrigerant Cooled Liquid Desiccant Absorber With a Conventional Refrigerant Cooled Cooling Coil
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Topics: Cooling, Modeling, Refrigerants, Flow (Dynamics), Dehumidification, Heat, Mass transfer, Temperature
Proceedings Papers

Development of a Noninvasive Blood Perfusion Probe

Thomas B. O’Reilly, Terry L. Gonzales, Thomas E. Diller
Proc. ASME. IMECE96, Advances in Heat and Mass Transfer in Biotechnology, 67-73, November 17–22, 1996
Paper No: IMECE1996-0753
https://doi.org/10.1115/IMECE1996-0753
View Paper titled, Development of a Noninvasive Blood Perfusion Probe
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Topics: Blood, Probes, Biological tissues, Heat flux, Temperature, Cooling, Skin, Biomedicine, Contact resistance, Electricity (Physics)
Proceedings Papers

Thermal Characteristics of Two Phase Thermosyphon Cooling Module for Multi-Chip Device

Sung-Bong Choi, Sang-Sig Nam, Jae-Hee Kim, Ho-Young Kwak
Proc. ASME. IMECE96, Advances in Energy Efficiency, Heat/Mass Transfer Enhancement, 33-43, November 17–22, 1996
Paper No: IMECE1996-0759
https://doi.org/10.1115/IMECE1996-0759
View Paper titled, Thermal Characteristics of Two Phase Thermosyphon Cooling Module for Multi-Chip Device
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Topics: Cooling, Condensers (steam plant), Temperature, Heat, Heat flux, Packaging, Steady state, Stress, Transients (Dynamics), Vapors
Proceedings Papers

Enhanced Vitrification of Cryopreservation Media in the Presence of Microwave Irradiation

Thomas H. Jackson, Aydin Ungan, John K. Critser, Dayong Gao
Proc. ASME. IMECE96, Advances in Heat and Mass Transfer in Biotechnology, 23-26, November 17–22, 1996
Paper No: IMECE1996-0744
https://doi.org/10.1115/IMECE1996-0744
View Paper titled, Enhanced Vitrification of Cryopreservation Media in the Presence of Microwave Irradiation
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Topics: Cryonics, Irradiation (Radiation exposure), Microwaves, Vitrification, Ice, Cooling, Crystallization, Electric fields, Nitrogen, Cavities
Proceedings Papers

Application of Freezing Rate Expressions and Gassing Power to Frozen Bread Dough

Alain Le Bail, Michel Havet, Maryvonne Pasco, Jean Marc Chourot
Proc. ASME. IMECE96, Advances in Heat and Mass Transfer in Biotechnology, 9-13, November 17–22, 1996
Paper No: IMECE1996-0740
https://doi.org/10.1115/IMECE1996-0740
View Paper titled, Application of Freezing Rate Expressions and Gassing Power to Frozen Bread Dough
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Topics: Freezing, Cylinders, Cooling, Phase transition temperature, Thawing, Tunnels
Proceedings Papers

Thermal Analysis of Two-Phase Microchannel Cooling

N. C. J. Chen, D. K. Felde, G. L. Yoder
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 137-143, November 17–22, 1996
Paper No: IMECE1996-1346
https://doi.org/10.1115/IMECE1996-1346
View Paper titled, Thermal Analysis of Two-Phase Microchannel Cooling
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Topics: Cooling, Microchannels, Thermal analysis, Heat flux, Temperature, Critical heat flux, Design, Heat losses, Pressure, Water
Proceedings Papers

Development of a Micropump for Microelectronic Cooling

C. Channy Wong, Douglas R. Adkins, Dahwey Chu
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 239-244, November 17–22, 1996
Paper No: IMECE1996-1357
https://doi.org/10.1115/IMECE1996-1357
View Paper titled, Development of a Micropump for Microelectronic Cooling
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Topics: Cooling, Micropumps, Design, Pumps, Silicon, Microelectromechanical systems, Electrodes, Electrohydrodynamics, Fluids, Manufacturing
Proceedings Papers

Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals

M. A. Lambert, L. S. Fletcher
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 207-215, November 17–22, 1996
Paper No: IMECE1996-0045
https://doi.org/10.1115/IMECE1996-0045
View Paper titled, Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals
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Topics: Contact resistance, Metals, Surface roughness, Electrical conductance, Coatings, Cooling, Electrical conductivity, Electronic packaging, Flight, Gas turbines
Proceedings Papers

Local Heat Transfer Distributions in a Square Channel With Solid and Perforated Ribs on Two Opposite Walls

Rajesh T. Kukreja, Sai C. Lau
Proc. ASME. IMECE96, Heat Transfer: Volume 2 — Heat Transfer in Turbulent Flows; Fundamentals of Convection Heat Transfer; Fundamentals of Natural Convection in Laminar and Turbulent Flows; Natural Circulation, 37-45, November 17–22, 1996
Paper No: IMECE1996-0057
https://doi.org/10.1115/IMECE1996-0057
View Paper titled, Local Heat Transfer Distributions in a Square Channel With Solid and Perforated Ribs on Two Opposite Walls
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Topics: Heat transfer, Cooling, Blades, Flow (Dynamics), Gas turbines, Heat transfer coefficients, Liquid crystals, Temperature measurement, Turbine blades, Turbulence