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Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Nondestructive Evaluation of Graphite/Aluminum Composites Using Acousto-Ultrasonics

Gene J. Quattlebaum, P. K. Raju

Proc. ASME. IMECE97, Noise Control and Acoustics, 167-175, November 16–21, 1997

Paper No: IMECE1997-1042

DOI: https://doi.org/10.1115/IMECE1997-1042

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Topics: Aluminum, Composite materials, Graphite, Nondestructive evaluation, Ultrasonics, Adhesives, Bond strength, Carbon, Damage, Tensile strength

Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997

Paper No: IMECE1997-1238

DOI: https://doi.org/10.1115/IMECE1997-1238

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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling

Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997

Paper No: IMECE1997-0512

DOI: https://doi.org/10.1115/IMECE1997-0512

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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)

Proceedings Papers

Direct Observation of Contact Damage Produced by Vickers Indentation in Diamond-Like Films

Vispi Homi Bulsara, Srinivasan Chandrasekar, Thomas N. Farris

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 287-292, November 16–21, 1997

Paper No: IMECE1997-0675

DOI: https://doi.org/10.1115/IMECE1997-0675

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Topics: Damage, Diamond films, Stress, Delamination, Adhesives, Cracking (Materials), Failure, Force sensors, Fracture (Materials), Fracture (Process)

Proceedings Papers

The Application of Sandwich Components in Hybrid Structures

Alois Starlinger

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 311-320, November 16–21, 1997

Paper No: IMECE1997-0732

DOI: https://doi.org/10.1115/IMECE1997-0732

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Topics: Adhesives, Aluminum, Aluminum extrusions, Composite materials, Corners (Structural elements), Design, Failure mechanisms, Finite element model, Insulation, Joining

Proceedings Papers

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Jonathan Simon, Long-Sun Huang, Balaji Sridharan, Chang-Jin Kim

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 29-34, November 16–21, 1997

Paper No: IMECE1997-0935

DOI: https://doi.org/10.1115/IMECE1997-0935

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Topics: Joining, Microelectromechanical systems, Semiconductor wafers, Temperature, Adhesives, Low temperature, Reservoirs, Sealing (Process), Epoxy adhesives, Hardening (Curing)

Proceedings Papers

Natural Frequencies and Mode Shapes of Composite Plates or Panels With a Central Stiffening Plate Strip

U. Yuceoglu, V. Özerciyes

Proc. ASME. IMECE97, Noise Control and Acoustics, 185-196, November 16–21, 1997

Paper No: IMECE1997-1044

DOI: https://doi.org/10.1115/IMECE1997-1044

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Topics: Composite materials, Mode shapes, Plates (structures), Strips, Adhesives, Plate theory, Stress, Vibration

Proceedings Papers

Adaptive Health Monitoring Concepts for Spot-Welded and Weld-Bonded Structural Joints

Victor Giurgiutiu, Craig A. Rogers, Yuh Jin Chao, Michael A. Sutton, Xiaomin Deng

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 99-104, November 16–21, 1997

Paper No: IMECE1997-0182

DOI: https://doi.org/10.1115/IMECE1997-0182

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Topics: Joints, Bonding, Adhesives, Welding, Aluminum, Joining, Nondestructive evaluation, Actuators, Adaptive structures, Automotive industry

Proceedings Papers

Molecular Mechanisms of Monocyte Adhesion to Cytokine Stimulated Endothelial Cells Under Physiological Flow Conditions

Sharad Kukreti, Larry V. McIntire, C. Wayne Smith

Proc. ASME. IMECE97, Advances in Bioengineering, 81-82, November 16–21, 1997

Paper No: IMECE1997-0238

DOI: https://doi.org/10.1115/IMECE1997-0238

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Topics: Adhesion, Endothelial cells, Flow (Dynamics), Physiology, Adhesives, Shear stress

Proceedings Papers

Probabilistic Modeling of Formation and Breakage of Cell Aggregates in a Shear Field

Mian Long, Harry L. Goldsmith, Cheng Zhu

Proc. ASME. IMECE97, Advances in Bioengineering, 77-78, November 16–21, 1997

Paper No: IMECE1997-0236

DOI: https://doi.org/10.1115/IMECE1997-0236

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Topics: Modeling, Shear (Mechanics), Adhesion, Adhesives, Erythrocytes, Latex, Probability, Statistics, Steady state, Stress

Proceedings Papers

Not Viscous Drag but Matric Forces Are Responsible for Skin Barrier Function

Patricia M. van Kemenade, Jacques M. Huyghe, Lucien F. A. Douven

Proc. ASME. IMECE97, Advances in Bioengineering, 35-36, November 16–21, 1997

Paper No: IMECE1997-0215

DOI: https://doi.org/10.1115/IMECE1997-0215

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Topics: Drag (Fluid dynamics), Skin, Water, Adhesives, Detergents, Fluids

Proceedings Papers

Measuring the Probability of Receptor Extraction From the Cell Membrane

Scott E. Chesla, Bryan T. Marshall, Cheng Zhu

Proc. ASME. IMECE97, Advances in Bioengineering, 129-130, November 16–21, 1997

Paper No: IMECE1997-0262

DOI: https://doi.org/10.1115/IMECE1997-0262

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Topics: Cell membranes, Probability, Membranes, Adhesion, Adhesives

Proceedings Papers

Dissociation of Individual Molecular Bonds Under Force

Cheng Zhu, Scott E. Chesla

Proc. ASME. IMECE97, Advances in Bioengineering, 177-178, November 16–21, 1997

Paper No: IMECE1997-0286

DOI: https://doi.org/10.1115/IMECE1997-0286

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Topics: Adhesives, Cell membranes, Erythrocytes, Signals

Proceedings Papers

Dependence of Kinetic Rates on Receptor’s Membrane Anchor

Scott E. Chesla, Cheng Zhu

Proc. ASME. IMECE97, Advances in Bioengineering, 127-128, November 16–21, 1997

Paper No: IMECE1997-0261

DOI: https://doi.org/10.1115/IMECE1997-0261

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Topics: Adhesives, Membranes

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997

Paper No: IMECE1997-0513

DOI: https://doi.org/10.1115/IMECE1997-0513

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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics

Proceedings Papers

Mechanics of Cell Rolling Adhesion in Shear Flow

Xiaoxiao Lei, Michael B. Lawrence, Cheng Dong

Proc. ASME. IMECE97, Advances in Bioengineering, 173-174, November 16–21, 1997

Paper No: IMECE1997-0284

DOI: https://doi.org/10.1115/IMECE1997-0284

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Topics: Adhesion, Shear flow, Leukocytes, Adhesives, Biological tissues, Deformation, Endothelial cells, Hemodynamics, Shear (Mechanics), Shear stress

Proceedings Papers

The Damping Characteristics of Machine Structures Assembled by Bonding: A Beam in Which Two Steel Strips Are Partially Joined by an Adhesive

Takashi Kobayashi, Yuichi Nakano

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 85-89, November 15–20, 1998

Paper No: IMECE1998-1120

DOI: https://doi.org/10.1115/IMECE1998-1120

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Topics: Adhesives, Bonding, Damping, Machinery, Steel, Strips, Finite element analysis, Temperature

Proceedings Papers

Elastoplastic FEM Stress Analysis and Strength Evaluation of Adhesive Tapered Lap Joints of Hollow Shafts Subjected to Tensile Loads

Masataka Kawawaki, Yuichi Nakano, Toshiyuki Sawa

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 77-84, November 15–20, 1998

Paper No: IMECE1998-1119

DOI: https://doi.org/10.1115/IMECE1998-1119

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Topics: Adhesives, Finite element methods, Stress, Stress analysis (Engineering), Tensile strength

2 3 4 5

NARROW

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Nondestructive Evaluation of Graphite/Aluminum Composites Using Acousto-Ultrasonics

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Direct Observation of Contact Damage Produced by Vickers Indentation in Diamond-Like Films

The Application of Sandwich Components in Hybrid Structures

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Natural Frequencies and Mode Shapes of Composite Plates or Panels With a Central Stiffening Plate Strip

Adaptive Health Monitoring Concepts for Spot-Welded and Weld-Bonded Structural Joints

Molecular Mechanisms of Monocyte Adhesion to Cytokine Stimulated Endothelial Cells Under Physiological Flow Conditions

Probabilistic Modeling of Formation and Breakage of Cell Aggregates in a Shear Field

Not Viscous Drag but Matric Forces Are Responsible for Skin Barrier Function

Measuring the Probability of Receptor Extraction From the Cell Membrane

Dissociation of Individual Molecular Bonds Under Force

Dependence of Kinetic Rates on Receptor’s Membrane Anchor

The Effect of Temperature and Humidity Exposure on Adhesion

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Mechanics of Cell Rolling Adhesion in Shear Flow

The Damping Characteristics of Machine Structures Assembled by Bonding: A Beam in Which Two Steel Strips Are Partially Joined by an Adhesive

Elastoplastic FEM Stress Analysis and Strength Evaluation of Adhesive Tapered Lap Joints of Hollow Shafts Subjected to Tensile Loads

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