Topics: Grinding, Sensors, Wheels, Acoustic emissions, Monitoring systems, Abrasives, Artificial intelligence, Databases, Genetic algorithms, Reliability

Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Topics: Abrasive machining, Finite element analysis, Abrasives, Finite element methods, Fracture (Process), Sawing, Semiconductor wafers, Shapes, Slurries, Stress analysis (Engineering)

Topics: Abrasive machining, Brittleness, Computer simulation, Silicon, Abrasives, Cutting, Finite element analysis, Fracture (Materials), Abrasion, Machining

Topics: Computer simulation, Hydrodynamics, Machining, Particulate matter, Water, Engineering simulation, Jets, Nanoscale phenomena, Simulation, Cutting

Topics: Abrasives, Finite element methods, Machining, Phase transitions, Vibration, Silicon, Atomic force microscopy, Friction, Nanoscale phenomena, Probes

Topics: Aluminum, Finishing, Polishing, Abrasives, Aerospace industry, Aluminum tube, Biomedicine, Cycles, Experimental design, Integrated circuit fabrication

Topics: Ice, Particulate matter, Abrasives, Food products, Machining, Water, Biomedicine, Blasting, Decontamination, Erosion